AMD XC2VP4-5FF672I

Overview

XC2VP4-5FF672I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 6,768 logic cells, and 12 DCM clock management units. It operates at -5 speed grade with industrial temperature range (–40°C to +100°C) in a 672-pin flip-chip fine-pitch BGA package, used in telecom line cards requiring embedded processing and high-speed serial I/O.

For engineers reviewing the XC2VP4-5FF672I datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 integration, RocketIO transceiver count and speed grade compliance, DCM resource availability, SelectIO-Ultra I/O standard support, and FF672 package thermal/mechanical constraints for industrial deployment.

Technical Context

The XC2VP4-5FF672I implements a hybrid architecture combining programmable logic fabric with hard IP blocks: a single IBM PowerPC 405 core running up to 300 MHz (at -5 speed grade), four RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex operation, and twelve Digital Clock Manager (DCM) modules enabling precise phase shifting, frequency synthesis, and deskew.

Its logic fabric includes 3,008 CLB slices, 94 18×18-bit multipliers, 28 Block SelectRAM+ modules (18 Kb each), and SelectIO-Ultra I/O banks supporting LVDS, SSTL, HSTL, and PCI-X standards with Digitally Controlled Impedance (DCI) termination - all configured via SRAM-based bitstream loaded through SelectMAP or JTAG.

Key Specifications

Pinout & Package

XC2VP4-5FF672I uses the FF672 flip-chip fine-pitch BGA package (27 mm × 27 mm, 1.0 mm pitch), featuring 672 solder balls arranged in a grid with dedicated power, ground, configuration, clock, I/O, and transceiver differential pairs. Pin functions are defined per Xilinx DS083 Module 4 (Pinout Information), with ball assignments grouped by bank, voltage domain (VCCO, VCCAUX, VCCINT), and functional role.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP4-5FF672I, XC2VP7-5FF676I offers scalable logic and I/O for expanded functionality within similar mechanical constraints, while XC2VP4-6FF672I trades industrial temperature support for higher clock rates - making the -5FF672I the sole option meeting both extended temperature and guaranteed 300 MHz PowerPC operation.

Availability

XC2VP4-5FF672I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, medical imaging subsystems, and avionics sensor fusion requiring stable component supply across long product lifecycles.

Supply support for XC2VP4-5FF672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding system-level applications.

The Virtex-II Pro product line was designed to integrate hard processor cores and high-speed serial transceivers into SRAM-based FPGA fabric - targeting embedded computing, communications infrastructure, and real-time signal processing markets.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FF672I?

The XC2VP4-5FF672I PowerPC 405 core is rated for up to 300 MHz operation under industrial temperature conditions (–40°C to +100°C) at the -5 speed grade. This frequency is guaranteed by Xilinx timing analysis and validated across voltage and process corners. The XC2VP4-5FF672I datasheet specifies this limit in Table 4 of DS083, and exceeding it may result in timing violations or functional failure.

Does XC2VP4-5FF672I support JTAG boundary-scan testing?

Yes, XC2VP4-5FF672I fully complies with IEEE 1149.1 and supports boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming. This capability is documented in Module 1 of DS083 and verified in Xilinx's production test flow.

Can XC2VP4-5FF672I be configured using SPI flash memory?

No, XC2VP4-5FF672I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and JTAG (IEEE 1532) configuration modes only. External SPI flash would require an external microcontroller or CPLD to translate SPI reads into SelectMAP or serial bitstream format - a method not supported by Xilinx tools or guaranteed by device specification.

What I/O standards are supported by XC2VP4-5FF672I's SelectIO-Ultra banks?

XC2VP4-5FF672I supports 22 single-ended standards (including LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V, PCI-X 133 MHz, GTL, HSTL Classes I–IV, SSTL Classes I/II) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each bank is independently configurable for voltage and standard, with Digitally Controlled Impedance (DCI) providing on-die termination - all confirmed in DS083 Module 1 Section "SelectIO-Ultra Technology".

Is XC2VP4-5FF672I recommended for new designs?

No, XC2VP4-5FF672I is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0) cover page and Module 1. While fully functional and supported for existing production, Xilinx advises migration to newer families (e.g., Kintex-7 or Versal) for new projects due to obsolescence planning, toolchain limitations, and lack of long-term roadmap support. Aetrix Electronics maintains inventory for legacy program continuity.