AMD XC2VP4-5FFG672C

Overview

XC2VP4-5FFG672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 6,768 logic cells, and 18 × 18-bit dedicated multipliers. It features twelve Digital Clock Managers (DCMs), 348 user I/Os in a 672-pin flip-chip fine-pitch BGA package, and supports DDR memory interfaces and PCI/PCI-X compliance for embedded networking and telecom control-plane applications.

For engineers reviewing the XC2VP4-5FFG672C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO), FF672 package I/O count, DCM phase-shifting capability, and dual-voltage supply architecture (1.5 V core / 2.5 V I/O).

Technical Context

The XC2VP4-5FFG672C implements a hybrid architecture combining programmable logic fabric with hard IP blocks: a single IBM PowerPC 405 core running at up to 300 MHz (speed grade -5), four RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s serial links with 8B/10B encoding, and twelve fully digital DCMs enabling precise clock deskew, multiplication, division, and ±180° phase shifting in 1/256-clock-period increments.

Its IOBs support 22 single-ended and 10 differential I/O standards-including LVDS, SSTL, HSTL, and PCI-X-with programmable drive strength (2–24 mA) and XCITE Digitally Controlled Impedance (DCI) for on-die termination. The FPGA fabric includes 3,008 CLB slices, 94 18×18 multipliers, and 28 Block SelectRAM+ modules (18 Kb each), delivering up to 504 Kb of true dual-port block RAM.

Key Specifications

Pinout & Package

XC2VP4-5FFG672C uses a 672-pin flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, optimized for signal integrity and thermal dissipation in high-density PCB layouts. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration pins (CCLK, DONE, PROG_B), JTAG boundary-scan signals (TCK/TDI/TDO/TMS), PowerPC debug interface (JTAGPPC), RocketIO differential pairs (TXP/TXN/RXP/RXN), and configurable SelectIO-Ultra banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-5FFG672C, the XC2VP4-6FF672C offers higher clock frequency headroom without layout change, while XC2VP7-5FF896C provides scalable logic and I/O resources at the cost of larger footprint and increased power-both retain identical PowerPC and RocketIO feature sets but differ in performance ceiling and physical integration constraints.

Availability

XC2VP4-5FFG672C is available at Aetrix Electronics and suitable for industrial protocol gateways, medical imaging aggregators, aerospace avionics interfaces, and telecom base station control-plane systems requiring stable component supply over extended product lifecycles.

Supply support for XC2VP4-5FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family, including XC2VP4-5FFG672C, was designed for high-performance embedded systems requiring integrated processing, serial connectivity, and flexible logic-targeting telecom infrastructure, defense electronics, and industrial automation where hardware-software co-design is critical.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FFG672C?

The XC2VP4-5FFG672C has a -5 speed grade, specifying a maximum PowerPC 405 core frequency of 300 MHz under commercial temperature conditions. This rating is validated per DS083 Table 4 and applies when using the CPMC405CLOCK macro with standard timing constraints. The XC2VP4-5FFG672C does not support the higher 350 MHz or 400 MHz operation found in -6 or -7 grades.

Does XC2VP4-5FFG672C support PCI-X 133 MHz operation?

Yes, XC2VP4-5FFG672C supports PCI-X 133 MHz operation through its SelectIO-Ultra I/O banks configured for 3.3 V signaling. Per DS083 Module 1, page 4, it complies with PCI-X 133 MHz and 66 MHz standards at 3.3 V, with programmable drive strength and on-chip termination ensuring signal integrity. The XC2VP4-5FFG672C requires proper board-level termination and timing closure for full compliance.

How many RocketIO transceivers are implemented in XC2VP4-5FFG672C?

The XC2VP4-5FFG672C integrates exactly four RocketIO multi-gigabit transceivers, as confirmed in DS083 Table 1 and Module 1 summary. These operate at up to 3.125 Gb/s in the -5 speed grade and support 8B/10B encoding, channel bonding, and automatic clock recovery. The XC2VP4-5FFG672C does not include RocketIO X transceivers, which are exclusive to XC2VPX-series devices.

What package type and pin count does XC2VP4-5FFG672C use?

XC2VP4-5FFG672C uses the FF672 flip-chip fine-pitch BGA package with 672 balls and 1.0 mm pitch. As specified in DS083 Table 3, this package delivers 348 user I/Os plus dedicated configuration, JTAG, and PowerPC debug pins. The "FF" prefix explicitly denotes flip-chip construction, distinguishing it from wire-bond FG/FGG packages used for other Virtex-II Pro variants.

Is XC2VP4-5FFG672C recommended for new designs?

No, XC2VP4-5FFG672C is marked "Product Not Recommended For New Designs" per DS083 cover page and Module 1. Xilinx discontinued the Virtex-II Pro family in favor of Virtex-4 and later generations. While still available through authorized distributors and Aetrix Electronics for legacy support, new designs should consider Spartan-7, Artix-7, or Kintex UltraScale+ FPGAs for improved power efficiency, toolchain support, and long-term availability.