AMD XC2VP4-5FG256C

Overview

XC2VP4-5FG256C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin fine-pitch wire-bond BGA (FG256) package. It targets high-speed serial interconnect, embedded processing, and reconfigurable telecom infrastructure.

For engineers reviewing the XC2VP4-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 integration, RocketIO transceiver count and speed grade (-5 = 2.5 Gb/s for FG packages), DCM availability, I/O count per FG256 package, and legacy support for 1.5V core/2.5V auxiliary supply.

Technical Context

The XC2VP4-5FG256C implements a hybrid architecture combining hard IP (PowerPC 405 core, RocketIO SERDES) with configurable FPGA fabric. Its four RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages like FG256, with monolithic clock recovery and 8B/10B encoding. The embedded PowerPC 405 runs at up to 300 MHz (speed grade -5), supported by 16 KB instruction and 16 KB data caches plus MMU.

FPGA resources include Configurable Logic Blocks (CLBs) with dual 4-input LUTs and flip-flops, 18 × 18-bit multipliers, 18 Kb Block SelectRAM+ modules, and SelectIO-Ultra I/O banks supporting LVDS, SSTL, HSTL, and PCI-X with Digitally Controlled Impedance (DCI). Twelve DCMs provide phase-shifting, frequency synthesis, and deskew across 16 global clock nets.

Key Specifications

Pinout & Package

XC2VP4-5FG256C uses the FG256 wire-bond fine-pitch BGA package (17 mm × 17 mm, 1.0 mm pitch), with 256 balls arranged in 16 × 16 array. Pin functions are defined per Xilinx DS083 Module 4 (Pinout Information), including dedicated configuration, JTAG, clock, PowerPC bus, RocketIO differential pairs, and configurable I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP4-5FG256C, XC2VP7-5FF456C offers scalable bandwidth and logic capacity for upgraded line cards, while XC3S1600E-4FG320C provides a cost-reduced alternative for pure logic control without embedded processing or serial I/O - neither is pin-compatible, requiring PCB redesign.

Availability

XC2VP4-5FG256C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial protocol conversion, optical transport, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP4-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced platform solutions for high-performance computing and communications.

The Virtex-II Pro family, including XC2VP4-5FG256C, was designed for system-on-chip (SoC) integration in telecom, networking, and embedded vision applications - combining FPGA flexibility with hardened processor and transceiver IP.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP4-5FG256C?

The XC2VP4-5FG256C supports RocketIO transceivers at up to 2.5 Gb/s in the FG256 wire-bond package, as specified for speed grade -5 in DS083 Table 4. This limit is imposed by package construction and signal integrity constraints-not the silicon itself-so higher speeds require flip-chip packages like FF456.

Does XC2VP4-5FG256C include an embedded processor core?

Yes, XC2VP4-5FG256C integrates one IBM PowerPC 405 RISC processor core running at up to 300 MHz (speed grade -5), with 16 KB instruction cache, 16 KB data cache, MMU, and CoreConnect bus interface - enabling true hardware/software co-design without external CPUs.

What package type and pin count does XC2VP4-5FG256C use?

XC2VP4-5FG256C uses the FG256 wire-bond fine-pitch BGA package with 256 balls in a 17 mm × 17 mm footprint and 1.0 mm pitch. It provides 140 user I/Os, excluding configuration, JTAG, and transceiver pins, as documented in DS083 Module 4.

Can XC2VP4-5FG256C be configured via JTAG boundary scan?

Yes, XC2VP4-5FG256C fully supports IEEE 1149.1 JTAG boundary-scan through TCK, TMS, TDI, and TDO pins. This enables in-system programming, verification, and debug - including readback of configuration memory, flip-flops, and Block RAM contents.

Is XC2VP4-5FG256C recommended for new designs?

No, XC2VP4-5FG256C is marked "Product Not Recommended For New Designs" in Xilinx DS083 (v5.0). It remains available for legacy support, repair, and obsolescence management but is superseded by newer families such as Virtex-4, Virtex-5, and UltraScale for new development.