AMD XC2VP4-5FG256I
- Part No.:
- XC2VP4-5FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP4-5FG256I.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,558
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP4-5FG256I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 2.5 Gb/s per channel), 6,768 logic cells, and 18 × 18-bit embedded multipliers. It targets high-reliability industrial communication systems requiring embedded processing, serial interconnect, and reconfigurable logic in a single wire-bond BGA package.
For engineers reviewing the XC2VP4-5FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.5 Gb/s transceivers), FG256 package (140 user I/Os), 1.5 V core supply, and industrial temperature rating (–40°C to +100°C).
Technical Context
The XC2VP4-5FG256I implements a hybrid architecture combining hard IP blocks - including a 32-bit PowerPC 405 core with 16 KB instruction and data caches, MMU, and OCM interface - with programmable FPGA fabric based on 4-input LUTs, distributed RAM, and 18 Kb Block SelectRAM+ modules. Its four RocketIO transceivers support full-duplex operation at 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, internal CDR, and programmable pre-emphasis.
Digital Clock Manager (DCM) modules provide clock deskew, multiplication/division, and fine-grained phase shifting (1/256 period resolution); SelectIO-Ultra I/O supports 22 single-ended and 10 differential standards, including LVDS, SSTL, and PCI-X, with Digitally Controlled Impedance (DCI) for on-chip termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 6,768 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC Core | 1 × IBM PowerPC 405 - provides embedded 32-bit RISC processing with cache, MMU, and CoreConnect bus interface |
| RocketIO Transceivers | 4 × multi-gigabit SERDES - enables up to 10 Gb/s aggregate serial bandwidth (2.5 Gb/s per lane) |
| Block RAM | 504 Kb (28 × 18 Kb blocks) - supports large FIFOs, buffers, or dual-port memory-mapped peripherals |
| Multipliers | 28 × 18 × 18-bit - accelerates DSP functions like FIR filtering, FFT, and correlation without LUT resource consumption |
| Speed Grade | -5 - guarantees 300 MHz PowerPC operation and 2.5 Gb/s transceiver performance under industrial conditions |
| I/O Count | 140 user I/Os - supports wide parallel buses, multiple peripheral interfaces, or high-pin-count memory subsystems |
| Operating Temp | –40°C to +100°C - validated for extended-temperature industrial and transportation applications |
Pinout & Package
XC2VP4-5FG256I uses the FG256 wire-bond fine-pitch BGA package (17 mm × 17 mm, 1.0 mm pitch), with 256 balls arranged in a 16 × 16 array. The package includes 140 user I/Os, 15 dedicated configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B), and 4 RocketIO transceiver pairs (RX/TX differential pairs occupying dedicated ball positions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and device initialization completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave-serial, master-serial, boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts configuration sequence |
| HRP, HRT | RocketIO Receive P/N | Differential input pair for one transceiver channel; requires external AC coupling and proper PCB impedance control |
| HTP, HTN | RocketIO Transmit P/N | Differential output pair supporting programmable swing (200–1600 mVpp) and pre-emphasis (0–500%) |
| VCCINT | Core Supply | 1.5 V ±3% regulated supply powering CLBs, DCMs, and internal logic; requires low-noise decoupling |
| VCCAUX | Auxiliary Supply | 2.5 V ±5% supply for configuration circuitry, DCMs, and SelectIO-Ultra I/O drivers |
| VCCO_0–VCCO_3 | I/O Bank Supplies | Independent 1.5/1.8/2.5/3.3 V supplies per I/O bank enabling mixed-voltage interface support |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 Core | Hard macro delivering deterministic 300 MHz execution with integrated 16 KB instruction/data caches and MMU for real-time OS support |
| RocketIO Transceivers | Four fully independent 2.5 Gb/s SERDES channels with built-in CDR, 8B/10B encode/decode, and channel bonding capability |
| SelectIO-Ultra I/O | Support for 22 single-ended and 10 differential standards (LVDS, SSTL, PCI-X) with on-chip DCI termination eliminating external resistors |
| Digital Clock Manager (DCM) | Up to twelve DCMs per device providing jitter-free clock synthesis, deskew, and sub-degree phase adjustment for timing-critical interfaces |
| Block SelectRAM+ Memory | 28 × 18 Kb true dual-port RAM blocks configurable as 16K×1 to 512×36, enabling high-bandwidth buffer and lookup table implementations |
| 18×18 Multiplier Blocks | 28 dedicated arithmetic units enabling pipelined multiply-accumulate operations at full device speed without LUT overhead |
Applications
| Industrial Ethernet Gateway | Avionics Data Concentrator |
|---|---|
Use Scenario: Aggregating CAN, ARINC 429, and MIL-STD-1553 traffic into a deterministic 100 Mbps Ethernet backbone for flight control systems. IC Role / Device Role / Timing Role: XC2VP4-5FG256I serves as the central protocol translation and packet assembly engine, executing real-time firmware on its PowerPC core while managing time-stamped I/O via FPGA fabric. Use Value: Integrated transceivers enable direct connection to PHYs; DCI eliminates board-level termination components; industrial temp rating ensures operation in avionics bays. | Use Scenario: Real-time video preprocessing unit in airborne surveillance systems, performing motion detection and JPEG compression before transmission over Gigabit Ethernet. IC Role / Device Role / Timing Role: XC2VP4-5FG256I hosts both the video processing pipeline (FPGA fabric) and the compression stack (PowerPC 405), with RocketIO linking to external SerDes for camera interface. Use Value: 28 × 18×18 multipliers accelerate convolution kernels; Block RAM buffers frame data; 140 I/Os support parallel CMOS image sensor interface. |
| Medical Imaging Controller | Railway Signaling Interface |
Use Scenario: High-integrity controller for ultrasound beamforming, synchronizing 128-channel ADC sampling and applying digital delay compensation. IC Role / Device Role / Timing Role: XC2VP4-5FG256I implements deterministic timing-critical delay lines and FIR filters in fabric, while PowerPC manages DICOM export and UI via PCIe bridge. Use Value: DCMs provide sub-nanosecond skew control across 128 channels; industrial temp range supports fanless enclosure operation. | Use Scenario: Interlocking system interface module converting legacy relay-based signaling protocols (e.g., SSI, EBI) to modern Ethernet/IP for centralized monitoring. IC Role / Device Role / Timing Role: XC2VP4-5FG256I acts as safety-certifiable protocol gateway, using FPGA fabric for cycle-accurate bit-level protocol emulation and PowerPC for secure TLS tunneling. Use Value: On-chip DCI ensures reliable 24 V digital input sampling; 1.5 V core reduces thermal load in sealed cabinets; -40°C to +100°C rating meets EN 50121-3-2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-6FG256I | Higher -6 speed grade: 350 MHz PowerPC, 2.5 Gb/s transceivers; identical logic resources and I/O count | Targeted at commercial-temp designs requiring higher CPU throughput or tighter timing margins | Select when design needs guaranteed 350 MHz PowerPC operation but does not require industrial temperature range |
| XC2VP7-5FF456I | Larger device: 11,088 logic cells, 8 RocketIO transceivers, 396 user I/Os in flip-chip FF456 package | Suitable for systems scaling beyond XC2VP4 capacity - e.g., multi-protocol gateways with >4 serial links | Choose when additional transceivers, logic density, or I/O count are required; note FF456 requires different PCB layout and thermal management |
Compared with XC2VP4-5FG256I, the XC2VP4-6FG256I offers higher CPU clock margin at commercial temperature, while the XC2VP7-5FF456I provides scalable bandwidth and logic capacity at the cost of larger footprint and higher power - making XC2VP4-5FG256I optimal for space-constrained industrial edge nodes needing verified thermal robustness.
Availability
XC2VP4-5FG256I is available at Aetrix Electronics and suitable for industrial Ethernet gateways, avionics data concentrators, and medical imaging controllers requiring stable component supply across extended product lifecycles.
Supply support for XC2VP4-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for high-performance computing and embedded systems.
The Virtex-II Pro family was designed to integrate hardened processor cores and high-speed serial transceivers into reconfigurable logic fabric, targeting communications infrastructure, defense, and industrial systems demanding both processing and hardware acceleration.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FG256I?
The XC2VP4-5FG256I is rated for 300 MHz PowerPC 405 operation under industrial temperature conditions (–40°C to +100°C) and 1.5 V core supply. This is guaranteed by the -5 speed grade specification and confirmed in DS083 Table 4. Higher frequencies (e.g., 350 MHz) are only supported in -6 grade devices and are not valid for XC2VP4-5FG256I.
Does XC2VP4-5FG256I support JTAG boundary-scan testing?
Yes, XC2VP4-5FG256I fully supports IEEE 1149.1 boundary-scan testing via its dedicated TAP controller. The device implements standard instructions including EXTEST, INTEST, SAMPLE, PRELOAD, and BYPASS, and supports both system and test modes - enabling in-circuit verification of PCB interconnects and configuration integrity without requiring functional operation of the FPGA fabric or PowerPC core.
Can XC2VP4-5FG256I be configured using SPI flash memory?
No, XC2VP4-5FG256I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 boundary-scan modes. To use SPI flash, an external microcontroller or CPLD must implement a configuration controller that loads the bitstream into XC2VP4-5FG256I via SelectMAP or serial mode - Xilinx does not provide integrated SPI boot capability for this device.
What I/O standards are supported by XC2VP4-5FG256I with on-chip termination?
XC2VP4-5FG256I supports Digitally Controlled Impedance (DCI) for on-chip termination across all 22 single-ended I/O standards (including LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, GTL) and selected differential standards (LVDS, BLVDS, ULVDS, LDT). DCI automatically calibrates termination resistance to match external reference resistors, eliminating discrete termination components and improving signal integrity in high-speed interfaces.
Is XC2VP4-5FG256I still recommended for new designs?
No, XC2VP4-5FG256I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While fully functional and supported for existing production, Xilinx recommends newer families (e.g., Kintex-7, Zynq-7000) for new projects due to superior performance, lower power, and enhanced toolchain support. Aetrix Electronics maintains inventory and lifecycle support for legacy industrial deployments.
XC2VP4-5FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 752
- Number of Logic Elements/Cells:
- 6768
- Total RAM Bits:
- 516096
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP4-5FG256I FAQ
1.How can I place an order for XC2VP4-5FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP4-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP4-5FG256I reliable?
The price and inventory of XC2VP4-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-5FG256I is usually 5 days.
3.What payment methods are accepted for XC2VP4-5FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-5FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP4-5FG256I?
XC2VP4-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP4-5FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP4-5FG256I?
For technical support, including XC2VP4-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-5FG256I requirements.
6.How does Aetrix verify that XC2VP4-5FG256I is sourced from the original manufacturer or authorized distributors?
All XC2VP4-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-5FG256I meets industry standards.
7.What is the process for return or replacement of XC2VP4-5FG256I?
All XC2VP4-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-5FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP4-5FG256I part is unused and in its original packaging.
Return procedure for XC2VP4-5FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP4-5FG256I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

