AMD XC2VP4-5FG456C

Overview

XC2VP4-5FG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It targets high-speed serial interconnect and embedded processing in telecom backplanes and network interface cards.

For engineers reviewing the XC2VP4-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include verified PowerPC 405 clock support at 300 MHz (–5 speed grade), RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, DCM phase-shifting resolution of 1/256 clock period, and SelectIO-Ultra I/O support for LVDS, SSTL, and HSTL standards.

Technical Context

The XC2VP4-5FG456C implements a hybrid architecture combining hard IP blocks-PowerPC 405 CPU, RocketIO SERDES, and DCMs-with configurable FPGA fabric (CLBs, Block SelectRAM+, 18×18 multipliers). Its RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.

The PowerPC 405 block includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface; it runs at 300 MHz under –5 speed grade with 1.5 V core supply. The FPGA fabric uses 0.13 µm nine-layer copper process, supports partial reconfiguration, and features XCITE Digitally Controlled Impedance (DCI) for on-die termination across 22 single-ended and 10 differential I/O standards.

Key Specifications

Pinout & Package

XC2VP4-5FG456C uses the FG456 wire-bond fine-pitch BGA package (23 mm × 23 mm, 1.0 mm pitch), with 456 balls including 348 user I/Os, 15 configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B), power/ground, and dedicated RocketIO differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-5FG456C, the –6 speed grade variant offers higher guaranteed clock frequencies for both PowerPC and RocketIO, while the Spartan-3 alternative sacrifices all hard IP blocks for cost reduction-making XC2VP4-5FG456C the sole option for integrated embedded processing with multi-gigabit serial I/O in this density class.

Availability

XC2VP4-5FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, network interface controllers, and industrial video encoders requiring stable component supply across extended product lifecycles.

Supply support for XC2VP4-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-level integration with hard IP cores.

The Virtex-II Pro family was designed to deliver complete platform solutions for high-performance embedded systems, combining FPGA flexibility with hardened processor and transceiver blocks for telecom, networking, and defense applications.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP4-5FG456C?

The XC2VP4-5FG456C PowerPC 405 core is rated for 300 MHz operation under the –5 speed grade at commercial temperature range. This is confirmed in Table 4 of DS083 (v5.0), where –5 grade specifies 300 MHz for the PowerPC processor block. Operation above this frequency requires adherence to XAPP755 guidelines and is not guaranteed across voltage and temperature corners.

Does XC2VP4-5FG456C support LVDS I/O at 840 Mb/s?

Yes, XC2VP4-5FG456C supports LVDS I/O at up to 840 Mb/s, as stated in Module 1, page 3 of DS083 (v5.0) under "SelectIO-Ultra Technology." This capability applies to its SelectIO-Ultra blocks and is independent of RocketIO transceivers. On-chip differential termination is provided for LVDS, enabling clean signal integrity without external resistors.

How many RocketIO transceivers does XC2VP4-5FG456C contain, and what is their maximum data rate?

XC2VP4-5FG456C contains four RocketIO multi-gigabit transceivers. In the FG456 wire-bond package, each operates at up to 2.5 Gb/s, as specified in Table 4 of DS083 (v5.0) for RocketIO transceivers in wire-bond configurations. These are full-duplex SERDES supporting 8B/10B encoding and channel bonding.

Is XC2VP4-5FG456C pin-compatible with other Virtex-II Pro devices in the FG456 package?

No, XC2VP4-5FG456C is not pin-compatible with larger Virtex-II Pro devices (e.g., XC2VP7 or XC2VP20) in the FG456 package. While all share the same physical footprint and ball map, I/O assignment, power pin allocation, and RocketIO pin placement differ significantly across densities. Pin compatibility is only maintained within the same device density and speed grade variants.

What configuration modes does XC2VP4-5FG456C support?

XC2VP4-5FG456C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is controlled via M0–M2 pins at power-up, and the device loads its bitstream into SRAM-based configuration memory. Bitstream encryption using Triple-DES is optional and supported on-chip.