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AMD XC2VP4-5FG456I
- Part No.:
- XC2VP4-5FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2VP4-5FG456I.pdf
- Description:
- IC FPGA 248 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,640
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Product details
Overview
XC2VP4-5FG456I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), 6,768 logic cells, and 28 18×18-bit multipliers. It features twelve Digital Clock Managers (DCMs), 348 user I/Os in a 456-pin fine-pitch BGA, and targets high-reliability telecom and networking systems requiring embedded processing and serial interconnect.
For engineers reviewing the XC2VP4-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.5 Gb/s transceivers), FG456 wire-bond BGA package with 348 user I/Os, DCI-enabled SelectIO-Ultra I/O support, and dual-voltage operation (1.5 V core / 2.5 V auxiliary).
Technical Context
The XC2VP4-5FG456I implements a hardened PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface, operating at up to 300 MHz in Industrial grade. Its four RocketIO transceivers support full-duplex SERDES at 600 Mb/s–2.5 Gb/s with 8B/10B encoding, on-chip 50 Ω/75 Ω termination, and per-channel loopback.
Configurable Logic Blocks (CLBs) contain four slices each with dual 4-input LUTs, flip-flops/latches, carry chains, and horizontal cascading. Block SelectRAM+ provides 18 Kb true dual-port RAM blocks (512 × 36 to 16K × 1), while dedicated 18×18 multipliers enable efficient DSP operations without consuming CLB resources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 6,768 - total programmable logic capacity for custom RTL or IP integration |
| PowerPC Core | 1 × PPC405 @ 300 MHz - embedded RISC processor with 32×32-bit GPRs, MMU, and 16 KB I/D caches |
| RocketIO Transceivers | 4 × 2.5 Gb/s - full-duplex SERDES with 8B/10B, on-chip termination, and internal loopback |
| User I/O Count | 348 - configurable single-ended (LVCMOS, SSTL, HSTL) and differential (LVDS, BLVDS) pins |
| Digital Clock Managers | 12 × DCM - fully digital clock synthesis, phase shifting (1/256 period), and deskew for system timing control |
| Block RAM | 504 Kb - 28 × 18 Kb SelectRAM+ blocks supporting true dual-port, read-during-write modes |
| Multipliers | 28 × 18×18-bit - hard arithmetic units enabling pipelined FIR filters or FFT engines without LUT overhead |
Pinout & Package
XC2VP4-5FG456I uses the FG456 wire-bond fine-pitch BGA package (23 mm × 23 mm, 1.0 mm pitch), rated for Industrial temperature range (−40°C to +100°C). Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration (M0–M2, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), power (VCCINT, VCCAUX, VCCO), and I/O banks grouped by voltage and I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or SelectMAP configuration; synchronous to bitstream loading |
| DONE | Configuration Status Output | Open-drain signal indicating successful configuration completion and I/O activation |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test and programming access; supports IEEE 1532 configuration |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for FPGA fabric and PowerPC core; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 2.5 V ±3% supply for DCMs, SelectRAM+, and transceiver analog circuitry |
| VCCO_0–VCCO_5 | I/O Bank Power Supplies | Programmable per-bank voltage (1.5 V/1.8 V/2.5 V/3.3 V) enabling mixed-voltage I/O interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/parallel termination for LVCMOS, SSTL, and HSTL standards eliminates external resistors and improves signal integrity |
| SelectIO-Ultra I/O | Supports 22 single-ended and 10 differential standards including LVDS (840 Mb/s), PCI-X (133 MHz), and DDR registers for source-synchronous interfaces |
| Active Interconnect Routing | Fourth-generation segmented architecture ensures predictable delay independent of fanout, critical for timing-closure in high-speed designs |
| Triple-DES Bitstream Encryption | On-chip decryptor with one or two key sets secures configuration data against cloning or reverse engineering in deployed systems |
| Partial Reconfiguration | Enables dynamic logic swapping without resetting the PowerPC core or transceivers, supporting runtime adaptation in communication protocols |
Applications
| Telecom Line Card | Industrial Protocol Gateway |
|---|---|
|
Use Scenario: Aggregating T1/E1, SONET OC-3, and Ethernet traffic in carrier-grade edge equipment. IC Role / Device Role / Timing Role: FPGA fabric handles packet classification and buffering; PowerPC executes protocol stacks (PPP, HDLC); RocketIO links to framer ICs or SFP modules. Use Value: Single-chip integration reduces board area and interconnect latency versus discrete processor + PLD + PHY solutions. |
Use Scenario: Bridging Modbus RTU, Profibus DP, and EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: PowerPC runs real-time OS and protocol stacks; FPGA implements deterministic I/O timing, CRC offload, and fieldbus physical layer logic. Use Value: DCI-controlled I/O ensures robust noise immunity across long industrial cables; 300 MHz CPU meets cycle-time requirements for motion control loops. |
| Medical Imaging Backplane | Defense Radar Signal Processor |
|
Use Scenario: High-throughput data acquisition from ultrasound or MRI sensor arrays using serialized LVDS or Camera Link interfaces. IC Role / Device Role / Timing Role: RocketIO transceivers receive raw pixel streams; FPGA performs real-time beamforming and filtering; PowerPC manages storage and UI. Use Value: 2.5 Gb/s transceivers match Camera Link Full configuration bandwidth; block RAM enables line-buffered image processing without external memory latency. |
Use Scenario: Pulse-Doppler radar front-end with ADC digitization, digital down-conversion (DDC), and CFAR detection. IC Role / Device Role / Timing Role: Dedicated 18×18 multipliers accelerate complex multiply-accumulate in DDC; DCMs generate precise sampling clocks and local oscillator harmonics. Use Value: Hard multiplier density enables >200 GMAC/s sustained throughput; industrial temperature rating supports conduction-cooled chassis deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-5FF672I | Higher density (11,088 logic cells), 8 RocketIO transceivers, FF672 flip-chip BGA (396 I/O), same -5 speed grade | Supports larger protocol stacks and wider data paths; requires different PCB layout and thermal management | Select when additional transceivers, logic, or I/O are required without changing speed or temperature grade |
| XC2VP4-6FG456I | Same FG456 package and logic count, but -6 speed grade (350 MHz PowerPC, 2.5 Gb/s transceivers) | Enables higher CPU throughput and tighter transceiver timing margins; consumes more power under load | Choose for performance-critical applications where 50 MHz CPU headroom justifies increased power and thermal design effort |
Compared with XC2VP4-5FG456I, XC2VP7-5FF672I offers scalable logic and I/O for system upgrades, while XC2VP4-6FG456I delivers measurable CPU and transceiver timing margin gains within identical footprint constraints - both require validation of thermal dissipation and signal integrity in the target PCB stackup.
Availability
XC2VP4-5FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, medical imaging subsystems, and defense electronics requiring stable component supply over extended product lifecycles.
Supply support for XC2VP4-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices with embedded processors and high-speed transceivers for demanding system-level applications.
The Virtex-II Pro family, including XC2VP4-5FG456I, was designed to unify programmable logic, embedded RISC processing, and multi-gigabit serial I/O in a single device for high-performance communications and signal processing systems.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FG456I?
The XC2VP4-5FG456I PowerPC 405 core operates at up to 300 MHz in Industrial temperature grade (-40°C to +100°C) per DS083 Table 4. This speed grade is fixed for the -5 suffix and validated across voltage and process corners. The XC2VP4-5FG456I does not support 350 MHz operation - that requires the -6 speed grade variant (XC2VP4-6FG456I).
Does XC2VP4-5FG456I support JTAG boundary-scan testing?
Yes, XC2VP4-5FG456I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. It also implements IEEE 1532 for JTAG-based configuration, enabling in-system programming and verification without requiring external configuration PROMs.
Can XC2VP4-5FG456I be used with 1.8 V I/O standards?
Yes, XC2VP4-5FG456I supports 1.8 V LVCMOS and 1.8 V HSTL Class I/II/III/IV through its SelectIO-Ultra I/O banks. Each bank's VCCO voltage is independently configurable, allowing simultaneous use of 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on the same device - critical for legacy system integration.
Is bitstream encryption available on XC2VP4-5FG456I?
Yes, XC2VP4-5FG456I includes an on-chip Triple-DES decryptor supporting one or two encrypted bitstream key sets. This feature secures intellectual property by preventing unauthorized readback or cloning of the configuration, and is enabled during bitstream generation in Xilinx ISE software.
What is the purpose of the Digitally Controlled Impedance (DCI) feature in XC2VP4-5FG456I?
The DCI feature in XC2VP4-5FG456I provides programmable on-die series or parallel termination for single-ended I/O standards (LVCMOS, SSTL, HSTL), eliminating the need for external resistors. It dynamically matches line impedance to reduce reflections and improve signal integrity - especially valuable in high-speed, point-to-point, or stub-based routing topologies.
XC2VP4-5FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 752
- Number of Logic Elements/Cells:
- 6768
- Total RAM Bits:
- 516096
- Number of I/O:
- 248
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2VP4-5FG456I FAQ
1.How can I place an order for XC2VP4-5FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP4-5FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP4-5FG456I reliable?
The price and inventory of XC2VP4-5FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-5FG456I is usually 5 days.
3.What payment methods are accepted for XC2VP4-5FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-5FG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP4-5FG456I?
XC2VP4-5FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP4-5FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP4-5FG456I?
For technical support, including XC2VP4-5FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-5FG456I requirements.
6.How does Aetrix verify that XC2VP4-5FG456I is sourced from the original manufacturer or authorized distributors?
All XC2VP4-5FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-5FG456I meets industry standards.
7.What is the process for return or replacement of XC2VP4-5FG456I?
All XC2VP4-5FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-5FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP4-5FG456I part is unused and in its original packaging.
Return procedure for XC2VP4-5FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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