AMD XC2VP4-5FGG256C

Overview

XC2VP4-5FGG256C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin fine-pitch wire-bond BGA (FGG256) package. It targets high-reliability telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP4-5FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, speed-grade–specific timing, I/O standard support (LVDS, SSTL, HSTL), DCM phase-shifting resolution, and RocketIO transceiver configuration constraints - all confirmed for the -5 speed grade and FGG256 package.

Technical Context

The XC2VP4-5FGG256C implements a hybrid architecture combining SRAM-based configurable logic (CLBs with 4-input LUTs and flip-flops), dedicated 18×18-bit multipliers, 18-Kb Block SelectRAM+ memory blocks, and hard IP including one PowerPC 405 core (300 MHz at -5 grade) and four RocketIO transceivers. Its Active Interconnect routing fabric provides predictable delay independent of fanout.

Digital Clock Management uses twelve DCM modules supporting precise de-skew, integer/fractional frequency synthesis, and 1/256-cycle fine-grained phase shifting. I/O subsystem includes SelectIO-Ultra with Digitally Controlled Impedance (DCI) for on-die termination across LVCMOS, SSTL, and HSTL standards, plus differential support for LVDS and BLVDS with on-chip 100-Ω termination.

Key Specifications

Pinout & Package

XC2VP4-5FGG256C uses the FGG256 package: 256-ball fine-pitch (1.0 mm) wire-bond BGA, 17 mm × 17 mm body, Pb-free compliant. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCO, VCCAUX, VRP/VRN reference, and MGT differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-5FGG256C, XC2VP7-5FF456C offers scalable transceiver count and logic resources but mandates redesign due to flip-chip packaging and incompatible pinout; XC3S1000-4FGG320C provides lower-cost logic-only capability but omits all hard IP blocks essential for serial communication and embedded processing in the original design.

Availability

XC2VP4-5FGG256C is available at Aetrix Electronics and suitable for telecom line card development, industrial protocol gateways, medical imaging subsystems, and avionics sensor hubs requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP4-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance, system-level integration with hard IP cores.

The Virtex-II Pro product line was engineered to unify programmable logic, embedded processors, and high-speed serial I/O in a single device for demanding communications and signal-processing applications.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP4-5FGG256C?

The XC2VP4-5FGG256C PowerPC 405 core is rated for 300 MHz operation under commercial temperature conditions (0°C to +85°C) at the -5 speed grade. This guarantee covers sustained instruction execution, cache access, and MMU translation - verified per DS083 Table 4. Higher frequencies require derating or engineering samples not covered by standard datasheet specifications.

Does XC2VP4-5FGG256C support LVDS I/O with on-chip termination?

Yes, XC2VP4-5FGG256C supports LVDS signaling with integrated 100 Ω differential on-chip termination for both transmit and receive paths, eliminating external resistors. This is confirmed in DS083 Module 1 Section "SelectIO-Ultra Technology" and applies specifically to the FGG256 package's LVDS-capable I/O banks.

Can XC2VP4-5FGG256C be configured via JTAG boundary scan?

Yes, XC2VP4-5FGG256C fully supports IEEE 1149.1 JTAG boundary-scan configuration using TCK, TMS, TDI, and TDO pins. It implements EXTEST, INTEST, and HIGHZ instructions, enabling board-level testing, in-system programming, and partial reconfiguration - detailed in DS083 Module 1 "Boundary Scan" section.

How many Digital Clock Managers (DCMs) does XC2VP4-5FGG256C include?

XC2VP4-5FGG256C integrates twelve Digital Clock Manager (DCM) modules, each capable of input jitter filtering, frequency synthesis (integer or fractional), and fine-grained phase shifting (1/256 of period). This count is fixed per device and confirmed in DS083 Table 1 and Module 2 "Digital Clock Manager" description.

Is XC2VP4-5FGG256C recommended for new designs?

No, XC2VP4-5FGG256C is marked "Product Not Recommended For New Designs" per DS083 v5.0 cover page and Module 1 introduction. Xilinx discontinued active development and marketing of Virtex-II Pro devices in favor of newer families (Virtex-4 onward); however, Aetrix Electronics maintains legacy supply and technical support for existing production programs.