AMD XC2VP4-5FGG256I
- Part No.:
- XC2VP4-5FGG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP4-5FGG256I.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2VP4-5FGG256I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin Fine-Pitch BGA (FGG256) package. It targets high-reliability industrial telecom and embedded control systems requiring integrated processing, serial connectivity, and reconfigurable logic.
For engineers reviewing the XC2VP4-5FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.5 Gb/s transceivers), industrial temperature rating (–40°C to +100°C), wire-bond FGG256 package with 140 usable I/Os, and compatibility with Xilinx ISE 12.x toolchain for legacy system maintenance.
Technical Context
The XC2VP4-5FGG256I implements a hybrid architecture combining hard IP blocks - including a single 32-bit PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - with programmable FPGA fabric based on 0.13 µm copper process. Its four RocketIO transceivers support full-duplex operation at up to 2.5 Gb/s per channel with 8B/10B encoding, internal CDR, and programmable pre-emphasis.
Digital clock management is handled by twelve DCM modules offering precise de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting. The device uses SelectIO-Ultra I/O banks supporting LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, BLVDS) with Digitally Controlled Impedance (DCI) termination and DDR register support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 6,768 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC Core | 1 × PPC405 @ 300 MHz - provides embedded real-time control, boot code execution, and peripheral management without external CPU |
| RocketIO Transceivers | 4 × 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, XAUI, Fibre Channel) |
| User I/O Pins | 140 - supports wide parallel buses, memory interfaces, and mixed-voltage I/O with programmable drive strength (2–24 mA) |
| Digital Clock Managers | 12 × DCM - delivers jitter-tolerant clock distribution, dynamic phase alignment, and frequency translation across multiple clock domains |
| Block RAM | 28 × 18 Kb SelectRAM+ - provides 504 KB of true dual-port embedded memory for FIFOs, buffers, or lookup tables |
| Multipliers | 28 × 18×18-bit - accelerates DSP functions such as filtering, FFT, and correlation in hardware |
| Operating Temperature | –40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC2VP4-5FGG256I uses a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free finish. Package dimensions are 17 mm × 17 mm. Pin assignments follow Xilinx DS083 Module 4, with dedicated configuration (M0/M1/M2, PROG_B, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), power (VCCINT=1.5V, VCCAUX=2.5V, VCCO per bank), and I/O banks grouped by voltage and signaling standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives synchronous bitstream loading in Master SelectMAP mode; must be stable before configuration begins |
| DONE | Configuration Status Output | Open-drain signal indicating successful completion of configuration; used for system reset synchronization |
| M0/M1/M2 | Mode Selection Inputs | Set configuration mode (e.g., Slave Serial, Master SelectMAP); sampled at power-up/reset |
| PROG_B | Program Initiate Input | Active-low signal forcing reconfiguration; resets internal state and clears configuration memory |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Support IEEE 1149.1 testing, programming, and debug; TDO is output-only, others bidirectional |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS/BLVDS clock inputs; internally routed to DCMs for low-jitter clock domain generation |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for FPGA fabric and PowerPC core; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V ±3% supply for DCMs, SelectRAM+, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 Core | Enables embedded software execution (e.g., Linux/uClinux, RTOS) alongside hardware acceleration without external processor interface timing constraints |
| RocketIO Transceivers | Eliminates need for external SERDES chips and associated clock recovery ICs, reducing board area and BOM cost in serial backplane designs |
| Digitally Controlled Impedance (DCI) | Automatically matches I/O line impedance to 50 Ω or 75 Ω without external resistors, improving signal integrity in high-speed parallel buses |
| SelectRAM+ Memory Blocks | Provides deterministic, low-latency memory access for real-time buffering and packet processing without external SRAM latency penalties |
| Twelve DCM Modules | Allows independent clock domain management for processor, transceivers, and logic fabric - critical for meeting setup/hold timing across heterogeneous subsystems |
| Triple-DES Bitstream Encryption | Protects intellectual property in field-deployed systems by preventing unauthorized readback or cloning of configuration data |
Applications
| Telecom Line Card | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a single OC-3/STM-1 interface using time-division multiplexing and HDLC framing. IC Role / Device Role / Timing Role: XC2VP4-5FGG256I acts as the central packet-processing engine, handling framer interfacing, CRC calculation, and traffic shaping while synchronizing to line-derived clocks via DCMs. Use Value: Integrates protocol processing, serial transport (RocketIO), and deterministic timing (DCM) in one device, eliminating discrete PHYs and clock cleaners required in legacy ASIC-based designs. | Use Scenario: Bridging Modbus RTU over RS-485 to EtherNet/IP or PROFINET in factory automation controllers. IC Role / Device Role / Timing Role: XC2VP4-5FGG256I hosts soft-core UARTs, Ethernet MAC, and real-time protocol stacks on its PowerPC core while managing GPIO, watchdog, and isolated I/O via FPGA fabric. Use Value: Reduces component count by consolidating communication stack execution, physical layer interfacing, and safety-critical I/O control - all operating under single-board thermal and EMI constraints. |
| Medical Imaging Data Acq. | Avionics Data Concentrator |
Use Scenario: Capturing and preprocessing raw sensor data from ultrasound or MRI front-ends at >100 MSPS before compression and storage. IC Role / Device Role / Timing Role: XC2VP4-5FGG256I performs real-time FIR filtering, beamforming, and DMA-controlled DDR2 memory transfers using its 28 multipliers and 12 DCMs for synchronized sampling clocks. Use Value: Achieves sub-microsecond latency between ADC capture and memory write - unattainable with off-chip DSP+FPGA combinations due to bus bottlenecks. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete discrete I/O signals onto a single Ethernet backbone in flight control computers. IC Role / Device Role / Timing Role: XC2VP4-5FGG256I serves as a deterministic time-triggered node, executing ARINC receive/transmit state machines and 1553 bus controller logic in FPGA fabric while logging events via PowerPC core. Use Value: Meets DO-254 Level A design assurance requirements through traceable HDL, built-in boundary scan, and deterministic timing analysis enabled by fixed DCM parameters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-6FGG256I | Higher speed grade (-6): supports 350 MHz PowerPC and 2.5 Gb/s RocketIO at commercial temp only; not rated for industrial range | Suitable for cost-sensitive commercial telecom equipment where ambient temperature stays below 85°C | Select only if thermal margin allows and industrial qualification is unnecessary |
| XCV2000E-6FG456C | No embedded processor or transceivers; 2M system gates, 456-pin BGA, 1.8V core; lacks DCMs, SelectRAM+, and DCI | Fits simpler logic-intensive tasks without serial I/O or soft-core needs, e.g., glue logic replacement or display timing control | Choose when serial connectivity and embedded processing are not required and legacy Virtex-E toolflow is mandated |
Compared with XC2VP4-5FGG256I, the XC2VP4-6FGG256I offers higher clock margins but sacrifices industrial temperature support, while the XCV2000E-6FG456C provides gate density at lower cost but omits all hard IP blocks - making XC2VP4-5FGG256I uniquely suited for reconfigurable embedded systems needing integrated compute, I/O, and timing.
Availability
XC2VP4-5FGG256I is available at Aetrix Electronics and suitable for industrial protocol gateways, telecom line cards, medical imaging subsystems, and avionics data concentrators requiring stable component supply across extended lifecycle programs.
Supply support for XC2VP4-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.
The Virtex-II Pro family, including XC2VP4-5FGG256I, was designed for high-performance embedded systems requiring tightly coupled hardware/software co-design, particularly in telecom infrastructure and industrial control where integration reduces latency and improves reliability.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FGG256I?
The XC2VP4-5FGG256I PowerPC 405 core operates at up to 300 MHz under industrial temperature conditions (–40°C to +100°C). This speed grade (-5) is validated across the full temperature range and requires no external derating. The XC2VP4-5FGG256I datasheet specifies this limit in Table 4 of DS083, and it applies regardless of whether the core runs standalone or concurrently with RocketIO transceivers or FPGA fabric activity.
Does XC2VP4-5FGG256I support JTAG boundary-scan testing?
Yes, XC2VP4-5FGG256I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, PRELOAD, and BYPASS. Test access is available during both configuration and normal operation, enabling in-system verification of PCB interconnects and I/O pin functionality without halting XC2VP4-5FGG256I application logic.
Can XC2VP4-5FGG256I be configured using SPI flash memory?
No, XC2VP4-5FGG256I does not support native SPI flash configuration. It requires configuration through Master SelectMAP, Slave SelectMAP, or JTAG modes using parallel or serial PROMs compatible with Xilinx's Platform Flash XL (e.g., XCFxxP series). SPI flash would require an external microcontroller or CPLD to emulate the SelectMAP interface - a method not supported by XC2VP4-5FGG256I's native configuration controller.
What I/O standards are supported by XC2VP4-5FGG256I's SelectIO-Ultra banks?
XC2VP4-5FGG256I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, LVTTL, PCI, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL). Each bank is independently configurable for voltage and standard. Digitally Controlled Impedance (DCI) provides automatic on-die termination for single-ended I/Os, while on-chip differential termination is available for LVDS and related standards - all directly supported in XC2VP4-5FGG256I without external components.
Is XC2VP4-5FGG256I still recommended for new designs?
No, XC2VP4-5FGG256I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy system repair, obsolescence mitigation, and long-lifecycle industrial programs, but Xilinx recommends Virtex-5 or newer families (e.g., Kintex-7) for new development due to superior performance, lower power, and ongoing tool support. Aetrix Electronics maintains inventory and supply chain continuity specifically for XC2VP4-5FGG256I in these maintenance contexts.
XC2VP4-5FGG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 752
- Number of Logic Elements/Cells:
- 6768
- Total RAM Bits:
- 516096
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP4-5FGG256I FAQ
1.How can I place an order for XC2VP4-5FGG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP4-5FGG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP4-5FGG256I reliable?
The price and inventory of XC2VP4-5FGG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-5FGG256I is usually 5 days.
3.What payment methods are accepted for XC2VP4-5FGG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-5FGG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP4-5FGG256I?
XC2VP4-5FGG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP4-5FGG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP4-5FGG256I?
For technical support, including XC2VP4-5FGG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-5FGG256I requirements.
6.How does Aetrix verify that XC2VP4-5FGG256I is sourced from the original manufacturer or authorized distributors?
All XC2VP4-5FGG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-5FGG256I meets industry standards.
7.What is the process for return or replacement of XC2VP4-5FGG256I?
All XC2VP4-5FGG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-5FGG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP4-5FGG256I part is unused and in its original packaging.
Return procedure for XC2VP4-5FGG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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