AMD XC2VP4-5FGG456C

Overview

XC2VP4-5FGG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It delivers embedded processing, high-speed serial connectivity, and configurable logic for telecom line cards, network processors, and video-over-IP gateways.

For engineers reviewing the XC2VP4-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 clock frequency (300 MHz at -5 speed grade), RocketIO transceiver data rate (2.5 Gb/s), DCM count (12), SelectRAM+ capacity (504 Kb), and FG456/FGG456 package compatibility.

Technical Context

The XC2VP4-5FGG456C implements a hybrid architecture combining hard IP blocks - including a 32-bit PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - with programmable fabric based on 4-input LUTs, distributed RAM, and 18×18 multipliers. Its RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, channel bonding, and internal loopback modes.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting per output. The device uses 1.5 V core voltage (VCCINT), 2.5 V auxiliary supply (VCCAUX), and programmable I/O banks supporting LVCMOS, SSTL, HSTL, LVDS, and DCI termination - all implemented in a 0.13 µm nine-layer copper process.

Key Specifications

Pinout & Package

XC2VP4-5FGG456C is housed in the FGG456 package: a 456-pin fine-pitch wire-bond ball grid array (1.0 mm pitch, 23 mm × 23 mm footprint), RoHS-compliant and Pb-free. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCO, VCCAUX, VCCINT, configuration (M0–M2, CCLK, DONE, PROG_B), JTAG (TCK/TDI/TDO/TMS), PowerPC debug (JTAG, BSCAN), RocketIO differential pairs (TXP/TXN, RXP/RXN), and user I/O grouped by SelectIO-Ultra bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP4-5FGG456C, XC2VP7-5FF672C offers greater scalability at the cost of increased power and package complexity, while XC2VP4-6FGG456C delivers measurable PowerPC timing headroom within the same mechanical and electrical footprint.

Availability

XC2VP4-5FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial networking applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2VP4-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference accelerators for high-performance computing, communications, and aerospace markets.

The Virtex-II Pro family - including XC2VP4-5FGG456C - was engineered to unify embedded processing, high-speed serial I/O, and reconfigurable logic in a single die for bandwidth-intensive, low-latency system-on-chip applications.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP4-5FGG456C?

The XC2VP4-5FGG456C is rated for 300 MHz PowerPC 405 operation under commercial temperature conditions (0°C to 85°C) at the -5 speed grade. This specification is validated across voltage and process corners per DS083 Table 4. The XC2VP4-5FGG456C achieves this frequency using internal DCM-synthesized clocks derived from external references, with timing closure confirmed in Xilinx ISE 12.4 implementation tools.

Does XC2VP4-5FGG456C support 3.3 V I/O standards such as PCI and LVTTL?

Yes, XC2VP4-5FGG456C supports 3.3 V single-ended I/O standards including LVTTL and PCI-compliant signaling (33/66 MHz) per DS083 Module 1. Each I/O bank is independently configurable for VCCO = 3.3 V, and the device includes dedicated PCI clamp diodes and slew-rate control. However, PCI-X (133 MHz) is not supported - only standard PCI at 33/66 MHz is verified for XC2VP4-5FGG456C.

Can XC2VP4-5FGG456C be used with RocketIO transceivers operating at 3.125 Gb/s?

No. XC2VP4-5FGG456C contains RocketIO (not RocketIO X) transceivers limited to 2.5 Gb/s maximum data rate in wire-bond packages like FGG456, as specified in DS083 Table 4. The 3.125 Gb/s rate is only guaranteed for flip-chip devices (e.g., FF672) and higher-density Virtex-II Pro parts such as XC2VP20 and above. Attempting 3.125 Gb/s on XC2VP4-5FGG456C will fail link training.

Is XC2VP4-5FGG456C pin-compatible with other Virtex-II Pro devices in the FGG456 package?

XC2VP4-5FGG456C shares the same FGG456 mechanical footprint and pin assignment with XC2VP2-5FGG456C and XC2VP7-5FGG456C, but functional pin mapping differs due to varying resource counts (e.g., RocketIO channels, PowerPC presence, DCM count). While PCB land patterns are identical, signal routing and power delivery must be validated per device - it is not a drop-in replacement without design review.

What configuration modes does XC2VP4-5FGG456C support?

XC2VP4-5FGG456C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is initiated via PROG_B, with mode selected by M0–M2 pins at power-up. Bitstream encryption using Triple-DES is optional, and readback capability allows verification of configuration memory, flip-flops, and block RAM contents - all documented in DS083 Module 1.