AMD XC2VP4-5FGG456I

Overview

XC2VP4-5FGG456I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 456-pin Fine-Pitch BGA (FGG456) package. It targets high-reliability telecom backplane interfaces, embedded DSP subsystems, and protocol-bridging applications requiring integrated processing and serial connectivity.

For engineers reviewing the XC2VP4-5FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.5 Gb/s transceivers), industrial temperature range (–40°C to +100°C), FGG456 wire-bond BGA package with 1.0 mm pitch, and compatibility with Xilinx ISE 12.x toolchain for partial reconfiguration and ChipScope debugging.

Technical Context

This device implements a hybrid architecture combining hard IP blocks-PowerPC 405 CPU, RocketIO SERDES, DCMs-with programmable fabric (CLBs, Block SelectRAM+, 18×18 multipliers). The PowerPC block operates at up to 300 MHz in industrial grade, supported by 16 KB instruction and 16 KB data caches, MMU, and OCM interface.

RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s (wire-bond packages), with 8B/10B encoding, channel bonding (2–20 channels), on-chip 50Ω/75Ω termination, and per-channel loopback. All I/Os use SelectIO-Ultra with DCI, supporting LVDS, SSTL, HSTL, and PCI-X standards.

Key Specifications

Pinout & Package

XC2VP4-5FGG456I uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free construction. It supports industrial temperature operation (–40°C to +100°C) and includes 15 dedicated configuration/control pins (e.g., CCLK, DONE, PROG_B, TCK/TMS/TDI/TDO) outside the 348-user-I/O count.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-5FGG456I, the XC2VP4-6FGG456I offers improved timing margin at identical pinout and power envelope, while XC2VP7-5FGG456I delivers 65% more logic and double the transceivers in the same FGG456 package-making both viable alternatives depending on whether performance headroom or functional expansion is prioritized.

Availability

XC2VP4-5FGG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and medical imaging systems requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP4-5FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed for high-performance embedded systems integrating processor cores, high-speed serial I/O, and configurable logic-targeting telecom, aerospace, and industrial applications demanding hardware-software co-design.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FGG456I?

The PowerPC 405 core in XC2VP4-5FGG456I operates at up to 300 MHz under industrial temperature conditions (–40°C to +100°C) and -5 speed grade. This rating is confirmed in DS083 Table 4 and applies specifically to the XC2VP4-5FGG456I variant. Higher frequencies require faster speed grades like -6 or -7, which are not offered in industrial grade for this device.

Does XC2VP4-5FGG456I support partial reconfiguration?

Yes, XC2VP4-5FGG456I supports partial reconfiguration through Xilinx ISE 12.x toolchain using the Modular Design flow. This allows dynamic swapping of logic modules (e.g., different encryption engines or protocol handlers) without resetting the PowerPC core or disrupting RocketIO links-critical for mission-critical telecom and avionics applications.

What I/O standards are supported by XC2VP4-5FGG456I's SelectIO-Ultra blocks?

XC2VP4-5FGG456I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Its Digitally Controlled Impedance (DCI) feature provides automatic on-chip termination for all single-ended I/Os, eliminating external resistors.

Is XC2VP4-5FGG456I pin-compatible with other Virtex-II Pro devices in FGG456 package?

No-XC2VP4-5FGG456I is not pin-compatible with higher-density Virtex-II Pro devices (e.g., XC2VP7-5FGG456I) in the same FGG456 package. While both use identical ball counts and pitch, I/O bank assignments, transceiver pinouts, and power/ground distribution differ per device. Pin mapping must be verified against DS083 Module 4 for each specific part.

What configuration modes does XC2VP4-5FGG456I support?

XC2VP4-5FGG456I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0/M1/M2 pins at power-up. Configuration bitstreams can be encrypted using on-chip DES decryptor with one or two triple-DES key sets.