AMD XC2VP4-6FFG672C

Overview

XC2VP4-6FFG672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 6,768 logic cells, and 348 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It targets high-speed serial interconnect, embedded processing, and reconfigurable system-on-chip applications in telecom and networking equipment.

For engineers reviewing the XC2VP4-6FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing performance, integrated PowerPC 405 core clocked up to 350 MHz, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, and support for SelectIO-Ultra I/O standards including LVDS and PCI-X.

Technical Context

The XC2VP4-6FFG672C implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP blocks: a single embedded PowerPC 405 core (32-bit Harvard, 16 KB instruction/data caches, MMU) and four RocketIO transceivers supporting full-duplex operation from 600 Mb/s to 3.125 Gb/s. Its DCM-based clock management provides precise de-skew, frequency synthesis, and phase shifting across up to 12 dedicated modules.

Logic resources include 3,008 Configurable Logic Blocks (CLBs), each with dual 4-input LUTs and flip-flops; 28 dedicated 18×18-bit multipliers; and 504 Kb of distributed RAM plus 348 Kb of block SelectRAM+ (18 Kb × 28). I/O subsystem supports 22 single-ended and 10 differential standards with Digitally Controlled Impedance (DCI) termination.

Key Specifications

Pinout & Package

XC2VP4-6FFG672C is housed in a 672-ball flip-chip fine-pitch BGA (FFG672) package with 1.0 mm pitch, designed for high I/O count and thermal performance. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), configuration, JTAG, and transceiver differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-6FFG672C, XC2VP7-6FFG676C offers scalable logic and transceiver resources within identical speed grade and thermal envelope, whereas XC3S1600E-4FGG456C represents a fundamentally different product category-entry-level logic-only FPGA-lacking both processor and transceiver capabilities essential to XC2VP4-6FFG672C's target applications.

Availability

XC2VP4-6FFG672C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging backplanes, and defense radar signal processors requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP4-6FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The XC2VP4-6FFG672C belongs to the Virtex-II Pro family - Xilinx's first generation of platform FPGAs integrating hard PowerPC cores and multi-gigabit transceivers, designed specifically for high-performance embedded computing and serial interconnect in communications and signal processing systems.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FFG672C?

The XC2VP4-6FFG672C PowerPC 405 core operates at up to 350 MHz under the -6 speed grade at commercial temperature range, as specified in DS083 Table 4. This frequency assumes proper decoupling, thermal management, and adherence to voltage tolerances (VCCINT = 1.5 V ±3%). The core's performance is gated by the FPGA fabric timing closure and DCM-stabilized clock distribution.

Does XC2VP4-6FFG672C support JTAG boundary-scan testing?

Yes, XC2VP4-6FFG672C fully supports IEEE 1149.1 boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification, in-system programming, and real-time debug access without requiring additional test fixtures.

Can XC2VP4-6FFG672C be configured using SPI flash memory?

No, XC2VP4-6FFG672C does not natively support direct SPI flash configuration. It supports Master Serial, Slave Serial, Master/Slave SelectMAP, and IEEE 1532 JTAG modes. To use SPI flash, an external microcontroller or CPLD must implement a bridge that loads the bitstream into XC2VP4-6FFG672C via SelectMAP or JTAG - Xilinx does not provide integrated SPI boot capability for this device.

What I/O standards are supported by XC2VP4-6FFG672C with on-chip termination?

XC2VP4-6FFG672C supports on-chip Digitally Controlled Impedance (DCI) termination for all single-ended I/O standards including LVCMOS (1.5 V, 1.8 V, 2.5 V, 3.3 V), LVTTL, SSTL, and HSTL classes I–IV. For differential standards, on-chip 100 Ω termination is available for LVDS, BLVDS, ULVDS, and LDT - eliminating need for external resistors on compatible interfaces.

Is XC2VP4-6FFG672C recommended for new designs?

No, XC2VP4-6FFG672C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While fully functional and supported for existing programs, Xilinx recommends Virtex-4, Virtex-5, or newer UltraScale families for new development due to enhanced performance, lower power, and ongoing toolchain support. Lifecycle management remains available through authorized distributors.