AMD XC2VP4-6FFG672I

Overview

XC2VP4-6FFG672I from Xilinx is a Virtex-II Pro platform FPGA integrating one embedded PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 6,768 logic cells, and 504 I/O pins in a 672-pin flip-chip fine-pitch BGA package. It targets high-reliability telecom backplane interfaces, industrial protocol gateways, and legacy reconfigurable computing systems requiring hardened serial I/O and soft-core processing.

For engineers reviewing the XC2VP4-6FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed -6 speed grade timing (350 MHz PowerPC, 3.125 Gb/s transceivers), FF672 package I/O count (348 user I/Os), DCI-enabled SelectIO-Ultra support for LVDS/HSTL/SSTL, and dual DCM clock management with phase shifting.

Technical Context

This device implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP blocks: the PowerPC 405 core delivers deterministic 350 MHz execution with 16 KB instruction and data caches, MMU, and OCM interface; each RocketIO transceiver provides full-duplex SERDES with monolithic CDR, 8B/10B encoding, and programmable pre-emphasis up to 500%.

The FPGA fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs per slice, 18 × 18-bit dedicated multipliers, 18 Kb Block SelectRAM+ modules (configurable as 512 × 36), and Digital Clock Managers supporting precise deskew, multiplication/division, and 1/256-cycle phase adjustment - all routed via Active Interconnect Technology with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP4-6FFG672I uses a 672-pin flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, 27 mm × 27 mm body size, and thermal-enhanced construction optimized for high I/O density and signal integrity in backplane applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2VP4-6FFG672I, XC2VP4-5FF672C trades industrial temperature and speed for lower cost, while XC2VP7-6FF896I extends capability with +65% logic, +100% transceivers, and +14% I/O - enabling scalable architecture without redesigning PCB layout for the same FF package family.

Availability

XC2VP4-6FFG672I is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial protocol conversion, and avionics retrofit programs requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP4-6FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and system-level integration platforms.

The Virtex-II Pro family was designed for high-performance embedded systems integrating hardened processor cores and multi-gigabit transceivers - targeting applications where ASIC-level bandwidth and flexibility coexist in a single device.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FFG672I?

The XC2VP4-6FFG672I PowerPC 405 core operates at up to 350 MHz under Industrial temperature conditions (-40°C to +100°C) with the -6 speed grade. This rating is validated per DS083 (v5.0) Table 4 and assumes proper decoupling, thermal management, and voltage regulation at 1.5 V VCCINT. The XC2VP4-6FFG672I must be configured with appropriate DCM settings and clock routing to sustain this frequency across all operating corners.

Does XC2VP4-6FFG672I support partial reconfiguration?

Yes, XC2VP4-6FFG672I supports partial reconfiguration as documented in the Virtex-II Pro Functional Description (Module 2). This allows dynamic replacement of logic modules without resetting the PowerPC 405 core, RocketIO transceivers, or configuration memory - critical for mission-critical systems requiring runtime updates. Implementation requires Xilinx ISE 12.4 or earlier toolchain and specific HDL partitioning.

What I/O standards are supported by XC2VP4-6FFG672I's SelectIO-Ultra blocks?

XC2VP4-6FFG672I supports 22 single-ended standards (including LVCMOS 1.5/1.8/2.5/3.3 V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT) via its SelectIO-Ultra blocks. DCI enables on-die termination for most single-ended standards, and on-chip differential termination is available for LVDS, ULVDS, and LDT - eliminating external resistors and improving signal fidelity.

Is XC2VP4-6FFG672I pin-compatible with other Virtex-II Pro devices in the FF672 package?

No, XC2VP4-6FFG672I is not pin-compatible with other Virtex-II Pro devices in the FF672 package. While the FF672 mechanical footprint is shared across XC2VP4, XC2VP7, and XC2VP20 variants, pin functions differ significantly due to varying resource counts (e.g., RocketIO placement, DCM locations, I/O bank assignments). Migration requires full PCB redesign and I/O constraint revalidation per DS083 Module 4 pinout tables.

What is the purpose of the DCM blocks in XC2VP4-6FFG672I?

The XC2VP4-6FFG672I integrates four Digital Clock Manager (DCM) blocks to provide jitter-tolerant clock distribution, deskew, frequency synthesis (multiplication/division), and fine-grained phase shifting (1/256 cycle resolution). Each DCM accepts an input clock and generates multiple synchronized outputs - essential for aligning PowerPC, RocketIO, and FPGA fabric timing domains while meeting setup/hold requirements across temperature and voltage variations.