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AMD XC2VP4-6FG256I
- Part No.:
- XC2VP4-6FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP4-6FG256I.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,512
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Product details
Overview
XC2VP4-6FG256I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin fine-pitch wire-bond BGA (FG256) package. It targets high-reliability embedded communications systems requiring integrated processing, serial connectivity, and reconfigurable logic.
For engineers reviewing the XC2VP4-6FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 clock speed (350 MHz at -6 grade), RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, DCM phase-shifting resolution (1/256 period), and FG256 package thermal/mechanical constraints for industrial deployment.
Technical Context
The XC2VP4-6FG256I implements a hardened PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its four RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback for protocol validation.
Logic fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs + flip-flops per slice, 18 × 18-bit multipliers, 18 Kb Block SelectRAM+ modules (504 Kb total), and Active Interconnect routing with predictable delay independent of fanout. Clocking uses twelve DCMs for deskew, multiplication/division, and coarse/fine phase shifting across 16 global clock nets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 6,768 - determines maximum combinational/sequential logic capacity for custom IP integration |
| PowerPC 405 Core Speed | 350 MHz (-6 speed grade) - defines real-time deterministic software throughput in embedded control loops |
| RocketIO Transceivers | 4 × 2.5 Gb/s full-duplex - enables four independent serial links compliant with Fibre Channel, Gigabit Ethernet, and XAUI |
| User I/O Pins | 140 - number of configurable single-ended/differential I/Os available in FG256 package after accounting for configuration pins |
| Digital Clock Managers (DCMs) | 12 - provide jitter-tolerant clock synthesis, deskew, and sub-degree phase alignment for timing-critical interfaces |
| Block RAM Capacity | 504 Kb (28 × 18 Kb blocks) - supports large FIFOs, frame buffers, or protocol state tables without external memory |
| Core Voltage (VCCINT) | 1.5 V - defines power delivery architecture and thermal design requirements for PCB layout |
Pinout & Package
XC2VP4-6FG256I is housed in a 256-ball fine-pitch wire-bond ball grid array (FG256) package with 1.0 mm pitch, 17 mm × 17 mm body size, and Pb-free option (FGG256). Thermal resistance (θJA) is 29.5°C/W; recommended PCB pad layout follows Xilinx UG071 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP programming; requires stable 0–100 MHz clock |
| DONE | Configuration Status Output | Open-drain signal pulled high when bitstream loading completes and device enters user mode |
| M0, M1, M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up; latched on PROG_B deassertion |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts initialization sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS/BLVDS differential clock signals for dedicated global clock routing to DCMs |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 Core | Enables concurrent firmware execution and hardware acceleration without external microprocessor, reducing BOM count and board space |
| RocketIO Transceivers | Eliminates need for discrete SERDES ICs and external termination resistors via on-chip 50 Ω matching and CDR |
| Digitally Controlled Impedance (DCI) | Automatically calibrates series/parallel on-die termination to match trace impedance (50–75 Ω), improving signal integrity without layout tuning |
| SelectIO-Ultra I/O Standards | Supports 22 single-ended (LVCMOS, PCI-X, SSTL) and 10 differential (LVDS, BLVDS, LVPECL) standards - simplifies interface to legacy and high-speed peripherals |
| Dual-Port Block RAM | Allows simultaneous read/write access to same memory block - critical for ping-pong buffering in video or packet-processing pipelines |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
Use Scenario: Aggregating multiple T1/E1 streams into a backplane interface with real-time packet classification. IC Role / Device Role / Timing Role: XC2VP4-6FG256I acts as line interface unit (LIU) with PowerPC handling protocol stack and FPGA fabric implementing HDLC framing, CRC, and channelized time-slot mapping. Use Value: Integrated RocketIO transceivers replace four discrete PHYs; DCMs align T1 clock domains (1.544 MHz) to system reference, eliminating external jitter cleaners. |
Use Scenario: Closed-loop servo control of multi-axis CNC machines using EtherCAT or SERCOS III fieldbus. IC Role / Device Role / Timing Role: XC2VP4-6FG256I serves as motion controller SoC: PowerPC runs real-time OS and trajectory planning, while FPGA implements PWM generation, encoder interpolation, and fieldbus MAC layer. Use Value: 348 I/Os support 16-axis analog/digital I/O expansion; SelectIO-Ultra drives 24 V industrial outputs directly; DCI ensures clean 100 Mbps SERCOS III signaling over 100 m cables. |
| Medical Imaging Subsystem | Avionics Data Concentrator |
Use Scenario: Real-time preprocessing of ultrasound beamformed data before transmission to host GPU via PCIe. IC Role / Device Role / Timing Role: XC2VP4-6FG256I functions as imaging pipeline accelerator: FPGA fabric performs FIR filtering and scan conversion; PowerPC manages DMA transfers and DICOM metadata tagging. Use Value: 18 × 18 multipliers enable 128-tap real-time filters; Block RAM buffers 2 MB frame data; RocketIO links to custom high-speed interconnect instead of PCIe root complex. |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O from cockpit sensors into a unified AFDX endpoint. IC Role / Device Role / Timing Role: XC2VP4-6FG256I operates as deterministic data concentrator: PowerPC schedules cyclic AFDX transmission; FPGA handles bit-level ARINC/MIL-STD framing and error detection. Use Value: Twelve DCMs lock to multiple independent aircraft clocks (e.g., 1 MHz IRIG-B, 4 kHz sync pulse); FG256 package meets DO-254 Class C mechanical reliability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-6FG456I | Higher density: 11,088 logic cells, 8 RocketIO transceivers, 396 I/Os, larger FG456 package | Supports more complex protocols (e.g., dual 10G Ethernet MACs) and larger real-time control algorithms | Choose when XC2VP4-6FG256I resource utilization exceeds 85% or additional transceivers are required |
| XC2VP4-7FG256C | Same logic/transceiver count but -7 speed grade (400 MHz PowerPC, 2.5 Gb/s RocketIO) and commercial temperature range (0°C to 85°C) | Not qualified for industrial (-40°C to 100°C) or extended temperature environments | Use only in controlled ambient environments where higher clock speed justifies reduced thermal margin |
Compared with XC2VP4-6FG256I, XC2VP7-6FG456I offers scalable bandwidth and I/O for upgraded systems, while XC2VP4-7FG256C trades industrial qualification for peak performance - both require PCB redesign due to different packages or thermal profiles.
Availability
XC2VP4-6FG256I is available at Aetrix Electronics and suitable for industrial motion control, avionics data concentrators, telecom line cards, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC2VP4-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices with embedded processors and high-speed transceivers for aerospace, defense, and industrial markets.
The Virtex-II Pro family, including XC2VP4-6FG256I, was engineered to unify programmable logic, hard CPU cores, and multi-gigabit serial I/O in a single die for deterministic embedded systems demanding both software flexibility and hardware acceleration.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FG256I?
The XC2VP4-6FG256I PowerPC 405 core operates at up to 350 MHz under Industrial temperature conditions (-40°C to 100°C) and -6 speed grade. This rating is validated per DS083 (v5.0) switching characteristics and assumes proper decoupling, thermal management, and voltage regulation at 1.5 V VCCINT. Exceeding this frequency risks timing violations in cache or MMU paths.
Does XC2VP4-6FG256I support JTAG boundary-scan testing?
Yes, XC2VP4-6FG256I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements SAMPLE, PRELOAD, EXTEST, and INTEST instructions, enabling interconnect verification, pin fault detection, and in-system programming - all documented in Module 4 of DS083.
Can XC2VP4-6FG256I be configured using SPI flash memory?
No, XC2VP4-6FG256I does not support native SPI flash configuration. It requires master serial, slave serial, or SelectMAP modes using parallel NOR flash or microcontroller-driven configuration. SPI flash compatibility was introduced in later Virtex-4 and Spartan-3 generations; XC2VP4-6FG256I relies on external PROMs with x8 or x16 bus interfaces per UG071.
What I/O standards are supported by XC2VP4-6FG256I's SelectIO-Ultra blocks?
XC2VP4-6FG256I supports 22 single-ended standards (including LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, SSTL-2, HSTL) and 10 differential standards (LVDS, BLVDS, LVPECL, ULVDS, LDT). DCI automatically configures on-die termination for single-ended I/Os, while on-chip differential termination is available for LVDS and related standards per DS083 Module 1.
Is XC2VP4-6FG256I pin-compatible with other Virtex-II Pro devices in FG256 packaging?
No, XC2VP4-6FG256I is not pin-compatible with other Virtex-II Pro devices in FG256 packages. While XC2VP2-6FG256I also uses FG256, its I/O count (140) and RocketIO placement differ; XC2VP4-6FG256I has unique ball assignments for DCM clocks, PowerPC debug ports, and transceiver reference clocks - verified against Table 3 and pinout diagrams in DS083 Module 4.
XC2VP4-6FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 752
- Number of Logic Elements/Cells:
- 6768
- Total RAM Bits:
- 516096
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP4-6FG256I FAQ
1.How can I place an order for XC2VP4-6FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP4-6FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP4-6FG256I reliable?
The price and inventory of XC2VP4-6FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-6FG256I is usually 5 days.
3.What payment methods are accepted for XC2VP4-6FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-6FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP4-6FG256I?
XC2VP4-6FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP4-6FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP4-6FG256I?
For technical support, including XC2VP4-6FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-6FG256I requirements.
6.How does Aetrix verify that XC2VP4-6FG256I is sourced from the original manufacturer or authorized distributors?
All XC2VP4-6FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-6FG256I meets industry standards.
7.What is the process for return or replacement of XC2VP4-6FG256I?
All XC2VP4-6FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-6FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP4-6FG256I part is unused and in its original packaging.
Return procedure for XC2VP4-6FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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