AMD XC2VP4-6FG456C
- Part No.:
- XC2VP4-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2VP4-6FG456C.pdf
- Description:
- IC FPGA 248 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,602
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Product details
Overview
XC2VP4-6FG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It targets high-speed serial interconnect and embedded processing in telecom line cards, network switches, and video processing systems.
For engineers reviewing the XC2VP4-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed PowerPC 405 integration, RocketIO transceiver count and speed grade (-6 = 2.5 Gb/s), DCM count for clock synthesis, SelectRAM+ memory capacity (504 Kb), and FG456 package compatibility with existing PCB layouts.
Technical Context
The XC2VP4-6FG456C implements a hybrid architecture combining hard IP blocks - including a fully functional IBM PowerPC 405 core running up to 350 MHz (speed grade -6) and four RocketIO transceivers supporting 600 Mb/s to 2.5 Gb/s per channel - with programmable FPGA fabric based on 0.13 µm copper process technology. Its CLB structure delivers 3,008 slices and 94 18×18 multipliers.
Digital Clock Manager (DCM) modules provide precise clock de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting. The device uses SRAM-based configuration with IEEE 1532 support, triple-DES bitstream encryption, and partial reconfiguration capability - all operating under 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O (VCCO) supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 6,768 - determines maximum combinational logic density and register count for custom RTL implementation |
| PowerPC Core | 1 × PPC405 - provides embedded 32-bit RISC processing at up to 350 MHz, with 16 KB instruction and 16 KB data cache |
| RocketIO Transceivers | 4 × 2.5 Gb/s - enables full-duplex serial links compliant with Gigabit Ethernet, Fibre Channel, and XAUI protocols |
| Block RAM | 504 Kb (28 × 18-Kb SelectRAM+) - supports large FIFOs, buffers, or on-chip memory-mapped peripherals |
| Digital Clock Managers | 12 × DCM - allows independent clock domain management, jitter reduction, and phase-aligned clock distribution |
| User I/O Pads | 248 - supports high-pin-count parallel interfaces, DDR memory controllers, and mixed-voltage I/O standards |
| Package | FG456 - 23×23 mm fine-pitch wire-bond BGA with 1.0 mm pitch, compatible with standard reflow processes |
Pinout & Package
XC2VP4-6FG456C is housed in a 456-ball fine-pitch wire-bond BGA (FG456) package with 1.0 mm ball pitch and 23 mm × 23 mm body size. Pin definitions are documented across 302 pages of Module 4 in DS083 (v5.0), covering dedicated configuration, JTAG, clock, PowerPC bus, RocketIO differential pairs, and configurable I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and initialization completion |
| TCK/TMS/TDI/TDO | JTAG Test Access Port | Enables IEEE 1149.1 boundary-scan testing, debug access, and configuration via JTAG chain |
| DXP/DXN | RocketIO Differential Transmitter | High-speed serial output pair supporting 600 Mb/s–2.5 Gb/s; requires controlled 100 Ω differential impedance routing |
| VRXP/VRXN | RocketIO Differential Receiver | High-speed serial input pair with programmable equalization and on-chip 100 Ω termination |
| PPC_0[0:31] | PowerPC Data Bus | 32-bit synchronous data interface between FPGA fabric and integrated PPC405 core |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 Core | Hard macro delivering deterministic 350 MHz operation with MMU, caches, and CoreConnect bus interface - eliminates soft-core resource overhead |
| RocketIO Transceivers | Four monolithic SERDES blocks with integrated CDR, 8B/10B encoding, and programmable pre-emphasis - reduces external PHY component count |
| Digital Clock Manager (DCM) | Twelve independent DCMs enabling zero-delay clock buffering, ±1/256-cycle phase alignment, and fractional multiplication - critical for source-synchronous timing closure |
| SelectIO-Ultra I/O | Support for 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL) with programmable drive strength (2–24 mA) and on-chip DCI termination - simplifies board-level impedance matching |
| Configurable Logic Fabric | 6,768 logic cells built from 4-input LUTs + flip-flops + carry chains - enables high-performance DSP, packet processing, and protocol acceleration logic |
Applications
| Telecom Line Card Interface | Industrial Video Processing |
|---|---|
Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a backplane using time-division multiplexing and framing logic. IC Role / Device Role / Timing Role: XC2VP4-6FG456C serves as the central packet-processing and interface bridging unit, hosting both framer logic and RocketIO-based SerDes for backplane connectivity. Use Value: Integrated RocketIO transceivers eliminate discrete PHYs, while the PowerPC core runs real-time OAM&P software without requiring external microcontroller resources. | Use Scenario: Real-time HD video scaling, color space conversion, and HDMI output generation in broadcast equipment. IC Role / Device Role / Timing Role: XC2VP4-6FG456C implements pixel-rate processing pipelines in FPGA fabric and manages frame buffer DMA via its PowerPC core and OCM controller. Use Value: 504 Kb of block RAM supports dual-port video frame buffers, and 12 DCMs ensure precise pixel clock derivation and skew control across multiple display interfaces. |
| Network Switch Control Plane | Medical Imaging Data Acquisition |
Use Scenario: Managing switch fabric configuration, statistics collection, and CLI/management interface in Layer 2/L3 enterprise switches. IC Role / Device Role / Timing Role: XC2VP4-6FG456C hosts the control-plane processor (PowerPC) and offloads packet classification and ACL lookup to custom FPGA logic. Use Value: Tight coupling between PowerPC and fabric enables low-latency register access to hardware accelerators, reducing software overhead in forwarding decisions. | Use Scenario: Digitizing and preprocessing ultrasound or MRI sensor data before transmission to host PC over PCIe or Gigabit Ethernet. IC Role / Device Role / Timing Role: XC2VP4-6FG456C acts as the real-time acquisition engine, synchronizing ADC sampling clocks, applying FIR filtering in fabric, and streaming results via RocketIO to host. Use Value: On-chip 18×18 multipliers accelerate digital filtering, while RocketIO's 2.5 Gb/s transceivers enable high-throughput raw data transfer without bottlenecking the acquisition pipeline. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-6FG456C | Higher density: 11,088 logic cells, 8 RocketIO transceivers, 396 user I/Os - same FG456 package footprint | Supports more complex protocol stacks and larger embedded software images due to increased fabric and memory resources | Select when additional transceivers or logic capacity is required without changing PCB layout |
| XC2VP4-6FF672C | Same logic and transceiver count, but in FF672 flip-chip BGA (27×27 mm); offers 404 user I/Os and improved thermal performance | Better suited for high-I/O-count designs and thermally constrained environments where wire-bond limitations apply | Choose for higher I/O count or better power dissipation - requires new PCB layout and assembly process qualification |
Compared with XC2VP4-6FG456C, XC2VP7-6FG456C provides scalable logic and transceiver headroom within identical packaging, while XC2VP4-6FF672C trades package compatibility for greater I/O count and thermal efficiency - neither is pin-compatible, but both serve overlapping embedded system roles.
Availability
XC2VP4-6FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video systems, and medical imaging equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP4-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and embedded processor integration.
The Virtex-II Pro family was designed to unify high-speed serial I/O, embedded processing, and flexible logic in a single device for demanding communications and signal processing applications.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FG456C?
The XC2VP4-6FG456C PowerPC 405 core operates at up to 350 MHz under speed grade -6 (Commercial temperature range). This rating assumes proper decoupling, thermal management, and adherence to voltage specifications (1.5 V VCCINT). Performance may be reduced in Industrial-grade variants or under non-ideal PCB conditions.
Does XC2VP4-6FG456C support partial reconfiguration?
Yes, XC2VP4-6FG456C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of logic modules without resetting the entire device - essential for adaptive communication protocols and runtime feature updates in deployed systems.
What I/O standards are supported by XC2VP4-6FG456C?
XC2VP4-6FG456C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, GTL) and 10 differential standards (LVDS, BLVDS, LVPECL, HSTL, SSTL). Its SelectIO-Ultra blocks also provide Digitally Controlled Impedance (DCI) for automatic on-die termination matching.
Is XC2VP4-6FG456C RoHS-compliant?
Yes, XC2VP4-6FG456C is manufactured in Pb-free (RoHS-compliant) versions under the FGG456 package designation. The FG456 variant is leaded; customers requiring RoHS compliance must specify FGG456 in ordering - both share identical electrical and thermal characteristics.
What configuration modes does XC2VP4-6FG456C support?
XC2VP4-6FG456C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration can be initiated via JTAG, dedicated configuration pins, or external microcontroller - enabling flexible boot strategies in embedded systems.
XC2VP4-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 752
- Number of Logic Elements/Cells:
- 6768
- Total RAM Bits:
- 516096
- Number of I/O:
- 248
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2VP4-6FG456C FAQ
1.How can I place an order for XC2VP4-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP4-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP4-6FG456C reliable?
The price and inventory of XC2VP4-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-6FG456C is usually 5 days.
3.What payment methods are accepted for XC2VP4-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP4-6FG456C?
XC2VP4-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP4-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP4-6FG456C?
For technical support, including XC2VP4-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-6FG456C requirements.
6.How does Aetrix verify that XC2VP4-6FG456C is sourced from the original manufacturer or authorized distributors?
All XC2VP4-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-6FG456C meets industry standards.
7.What is the process for return or replacement of XC2VP4-6FG456C?
All XC2VP4-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP4-6FG456C part is unused and in its original packaging.
Return procedure for XC2VP4-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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