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AMD XC2VP4-6FG456C

Part No.:
XC2VP4-6FG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC2VP4-6FG456C.pdf
Description:
IC FPGA 248 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,602

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Product details

Overview

XC2VP4-6FG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It targets high-speed serial interconnect and embedded processing in telecom line cards, network switches, and video processing systems.

For engineers reviewing the XC2VP4-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed PowerPC 405 integration, RocketIO transceiver count and speed grade (-6 = 2.5 Gb/s), DCM count for clock synthesis, SelectRAM+ memory capacity (504 Kb), and FG456 package compatibility with existing PCB layouts.

Technical Context

The XC2VP4-6FG456C implements a hybrid architecture combining hard IP blocks - including a fully functional IBM PowerPC 405 core running up to 350 MHz (speed grade -6) and four RocketIO transceivers supporting 600 Mb/s to 2.5 Gb/s per channel - with programmable FPGA fabric based on 0.13 µm copper process technology. Its CLB structure delivers 3,008 slices and 94 18×18 multipliers.

Digital Clock Manager (DCM) modules provide precise clock de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting. The device uses SRAM-based configuration with IEEE 1532 support, triple-DES bitstream encryption, and partial reconfiguration capability - all operating under 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O (VCCO) supplies.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells6,768 - determines maximum combinational logic density and register count for custom RTL implementation
PowerPC Core1 × PPC405 - provides embedded 32-bit RISC processing at up to 350 MHz, with 16 KB instruction and 16 KB data cache
RocketIO Transceivers4 × 2.5 Gb/s - enables full-duplex serial links compliant with Gigabit Ethernet, Fibre Channel, and XAUI protocols
Block RAM504 Kb (28 × 18-Kb SelectRAM+) - supports large FIFOs, buffers, or on-chip memory-mapped peripherals
Digital Clock Managers12 × DCM - allows independent clock domain management, jitter reduction, and phase-aligned clock distribution
User I/O Pads248 - supports high-pin-count parallel interfaces, DDR memory controllers, and mixed-voltage I/O standards
PackageFG456 - 23×23 mm fine-pitch wire-bond BGA with 1.0 mm pitch, compatible with standard reflow processes

Pinout & Package

XC2VP4-6FG456C is housed in a 456-ball fine-pitch wire-bond BGA (FG456) package with 1.0 mm ball pitch and 23 mm × 23 mm body size. Pin definitions are documented across 302 pages of Module 4 in DS083 (v5.0), covering dedicated configuration, JTAG, clock, PowerPC bus, RocketIO differential pairs, and configurable I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration state machine during master serial or SelectMAP programming
DONEConfiguration Status OutputOpen-drain signal indicating successful bitstream loading and initialization completion
TCK/TMS/TDI/TDOJTAG Test Access PortEnables IEEE 1149.1 boundary-scan testing, debug access, and configuration via JTAG chain
DXP/DXNRocketIO Differential TransmitterHigh-speed serial output pair supporting 600 Mb/s–2.5 Gb/s; requires controlled 100 Ω differential impedance routing
VRXP/VRXNRocketIO Differential ReceiverHigh-speed serial input pair with programmable equalization and on-chip 100 Ω termination
PPC_0[0:31]PowerPC Data Bus32-bit synchronous data interface between FPGA fabric and integrated PPC405 core

Key Features

FeatureDesign Value
Embedded PowerPC 405 CoreHard macro delivering deterministic 350 MHz operation with MMU, caches, and CoreConnect bus interface - eliminates soft-core resource overhead
RocketIO TransceiversFour monolithic SERDES blocks with integrated CDR, 8B/10B encoding, and programmable pre-emphasis - reduces external PHY component count
Digital Clock Manager (DCM)Twelve independent DCMs enabling zero-delay clock buffering, ±1/256-cycle phase alignment, and fractional multiplication - critical for source-synchronous timing closure
SelectIO-Ultra I/OSupport for 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL) with programmable drive strength (2–24 mA) and on-chip DCI termination - simplifies board-level impedance matching
Configurable Logic Fabric6,768 logic cells built from 4-input LUTs + flip-flops + carry chains - enables high-performance DSP, packet processing, and protocol acceleration logic

Applications

Telecom Line Card InterfaceIndustrial Video Processing

Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a backplane using time-division multiplexing and framing logic.

IC Role / Device Role / Timing Role: XC2VP4-6FG456C serves as the central packet-processing and interface bridging unit, hosting both framer logic and RocketIO-based SerDes for backplane connectivity.

Use Value: Integrated RocketIO transceivers eliminate discrete PHYs, while the PowerPC core runs real-time OAM&P software without requiring external microcontroller resources.

Use Scenario: Real-time HD video scaling, color space conversion, and HDMI output generation in broadcast equipment.

IC Role / Device Role / Timing Role: XC2VP4-6FG456C implements pixel-rate processing pipelines in FPGA fabric and manages frame buffer DMA via its PowerPC core and OCM controller.

Use Value: 504 Kb of block RAM supports dual-port video frame buffers, and 12 DCMs ensure precise pixel clock derivation and skew control across multiple display interfaces.

Network Switch Control PlaneMedical Imaging Data Acquisition

Use Scenario: Managing switch fabric configuration, statistics collection, and CLI/management interface in Layer 2/L3 enterprise switches.

IC Role / Device Role / Timing Role: XC2VP4-6FG456C hosts the control-plane processor (PowerPC) and offloads packet classification and ACL lookup to custom FPGA logic.

Use Value: Tight coupling between PowerPC and fabric enables low-latency register access to hardware accelerators, reducing software overhead in forwarding decisions.

Use Scenario: Digitizing and preprocessing ultrasound or MRI sensor data before transmission to host PC over PCIe or Gigabit Ethernet.

IC Role / Device Role / Timing Role: XC2VP4-6FG456C acts as the real-time acquisition engine, synchronizing ADC sampling clocks, applying FIR filtering in fabric, and streaming results via RocketIO to host.

Use Value: On-chip 18×18 multipliers accelerate digital filtering, while RocketIO's 2.5 Gb/s transceivers enable high-throughput raw data transfer without bottlenecking the acquisition pipeline.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2VP7-6FG456CHigher density: 11,088 logic cells, 8 RocketIO transceivers, 396 user I/Os - same FG456 package footprintSupports more complex protocol stacks and larger embedded software images due to increased fabric and memory resourcesSelect when additional transceivers or logic capacity is required without changing PCB layout
XC2VP4-6FF672CSame logic and transceiver count, but in FF672 flip-chip BGA (27×27 mm); offers 404 user I/Os and improved thermal performanceBetter suited for high-I/O-count designs and thermally constrained environments where wire-bond limitations applyChoose for higher I/O count or better power dissipation - requires new PCB layout and assembly process qualification

Compared with XC2VP4-6FG456C, XC2VP7-6FG456C provides scalable logic and transceiver headroom within identical packaging, while XC2VP4-6FF672C trades package compatibility for greater I/O count and thermal efficiency - neither is pin-compatible, but both serve overlapping embedded system roles.

Availability

XC2VP4-6FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video systems, and medical imaging equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP4-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and embedded processor integration.

The Virtex-II Pro family was designed to unify high-speed serial I/O, embedded processing, and flexible logic in a single device for demanding communications and signal processing applications.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FG456C?

The XC2VP4-6FG456C PowerPC 405 core operates at up to 350 MHz under speed grade -6 (Commercial temperature range). This rating assumes proper decoupling, thermal management, and adherence to voltage specifications (1.5 V VCCINT). Performance may be reduced in Industrial-grade variants or under non-ideal PCB conditions.

Does XC2VP4-6FG456C support partial reconfiguration?

Yes, XC2VP4-6FG456C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of logic modules without resetting the entire device - essential for adaptive communication protocols and runtime feature updates in deployed systems.

What I/O standards are supported by XC2VP4-6FG456C?

XC2VP4-6FG456C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, GTL) and 10 differential standards (LVDS, BLVDS, LVPECL, HSTL, SSTL). Its SelectIO-Ultra blocks also provide Digitally Controlled Impedance (DCI) for automatic on-die termination matching.

Is XC2VP4-6FG456C RoHS-compliant?

Yes, XC2VP4-6FG456C is manufactured in Pb-free (RoHS-compliant) versions under the FGG456 package designation. The FG456 variant is leaded; customers requiring RoHS compliance must specify FGG456 in ordering - both share identical electrical and thermal characteristics.

What configuration modes does XC2VP4-6FG456C support?

XC2VP4-6FG456C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration can be initiated via JTAG, dedicated configuration pins, or external microcontroller - enabling flexible boot strategies in embedded systems.

XC2VP4-6FG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
752
Number of Logic Elements/Cells:
6768
Total RAM Bits:
516096
Number of I/O:
248
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC2VP4-6FG456C FAQ

1.How can I place an order for XC2VP4-6FG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP4-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP4-6FG456C reliable?

The price and inventory of XC2VP4-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP4-6FG456C is usually 5 days.

3.What payment methods are accepted for XC2VP4-6FG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP4-6FG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP4-6FG456C?

XC2VP4-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP4-6FG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP4-6FG456C?

For technical support, including XC2VP4-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP4-6FG456C requirements.

6.How does Aetrix verify that XC2VP4-6FG456C is sourced from the original manufacturer or authorized distributors?

All XC2VP4-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP4-6FG456C meets industry standards.

7.What is the process for return or replacement of XC2VP4-6FG456C?

All XC2VP4-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP4-6FG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP4-6FG456C part is unused and in its original packaging.

Return procedure for XC2VP4-6FG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP4-6FG456C Tags

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