AMD XC2VP4-6FGG256C

Overview

XC2VP4-6FGG256C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin fine-pitch wire-bond BGA (FGG256) package. It targets high-speed serial interconnect, embedded processing, and reconfigurable system-on-chip applications in telecom and networking equipment.

For engineers reviewing the XC2VP4-6FGG256C datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 integration, RocketIO transceiver count and speed grade (-6 = 2.5 Gb/s), DCM count for clock management, SelectRAM+ memory capacity (504 Kb), and FGG256 package compatibility with legacy PCB layouts.

Technical Context

The XC2VP4-6FGG256C implements a hybrid architecture combining hard IP blocks-PowerPC 405 core (350 MHz at -6 speed grade) and four RocketIO transceivers-with programmable FPGA fabric based on 0.13 µm copper process. Its DCMs provide precise clock deskew, multiplication, division, and phase shifting up to ±180° in 1/256-cycle steps.

I/O subsystem includes SelectIO-Ultra with support for LVDS, SSTL, HSTL, PCI-X, and Digitally Controlled Impedance (DCI) for on-die termination. Configuration uses SRAM-based bitstream loading via Master/Slave SelectMAP or JTAG, with optional DES encryption and readback capability for debug.

Key Specifications

Pinout & Package

XC2VP4-6FGG256C is housed in a 256-ball fine-pitch wire-bond BGA (FGG256) package with 1.0 mm pitch, 17 mm × 17 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCO, VCCAUX, configuration, JTAG, PowerPC bus, RocketIO differential pairs, and general-purpose I/O.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA with embedded processor and high-speed serial I/O applications.

Compared with XC2VP4-6FGG256C, XC2VP7-6FGG456C offers higher transceiver count and logic capacity at the cost of larger footprint and higher power, while XC2VP4-5FGG256C retains full pin compatibility but trades off serial speed and CPU frequency for cost and thermal efficiency.

Availability

XC2VP4-6FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC2VP4-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed to unify programmable logic, embedded processing, and high-speed serial I/O in a single die-targeting system-on-chip replacement in communications, defense, and high-performance computing.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FGG256C?

The PowerPC 405 core in XC2VP4-6FGG256C operates at up to 350 MHz under the -6 speed grade specification. This frequency is validated across commercial temperature range (0°C to 85°C) with proper decoupling and 1.5 V VCCINT supply. The XC2VP4-6FGG256C datasheet specifies this limit in Table 4 of DS083, and exceeding it may cause timing violations or functional failure.

Does XC2VP4-6FGG256C support JTAG boundary-scan testing?

Yes, XC2VP4-6FGG256C fully supports IEEE 1149.1 boundary-scan testing via its dedicated TCK, TMS, TDI, TDO, and TRST pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming without requiring additional test fixtures.

Can XC2VP4-6FGG256C be configured using SPI flash memory?

No, XC2VP4-6FGG256C does not natively support SPI flash configuration. It requires configuration through Master/Slave SelectMAP mode (parallel x8/x16), Slave Serial mode (x1), or JTAG. External SPI flash must be interfaced via FPGA fabric logic or an external microcontroller; no built-in SPI controller exists in the PowerPC 405 block for direct boot-from-SPI.

What is the purpose of the HSWAP_EN pin on XC2VP4-6FGG256C?

The HSWAP_EN pin on XC2VP4-6FGG256C enables hot-swap I/O protection during power-up sequencing. When asserted high before configuration, it disables all I/O drivers until configuration completes, preventing bus contention or back-driving on live backplanes. This feature is critical for telecom line cards and modular chassis systems requiring live insertion.

Is XC2VP4-6FGG256C compatible with Xilinx ISE 14.7 design tools?

No, XC2VP4-6FGG256C requires Xilinx ISE Design Suite versions 6.3 through 10.1. ISE 14.7 does not support Virtex-II Pro devices; its device libraries end with Virtex-5. Using unsupported tool versions results in unrecognized part numbers, missing IP cores (e.g., PPC405 wrapper), and incorrect timing analysis for the XC2VP4-6FGG256C architecture.