AMD XC2VP4-6FGG256I

Overview

XC2VP4-6FGG256I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (2.5 Gb/s max), 6,768 logic cells, twelve Digital Clock Managers (DCMs), and 348 user I/Os in a 256-pin Fine-Pitch BGA (FGG256) package. It targets high-reliability telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP4-6FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include PowerPC 405 clock speed (350 MHz at -6 grade), RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, DCM phase-shifting resolution (1/256 period), and SelectIO-Ultra support for LVDS, SSTL, and DCI termination.

Technical Context

This device implements a hybrid architecture combining hard IP blocks (PowerPC 405, RocketIO SERDES) with configurable FPGA fabric. The PowerPC 405 operates at up to 350 MHz in -6 speed grade with 16 KB instruction and data caches, MMU, and OCM interface. RocketIO transceivers provide full-duplex serial links at 600 Mb/s–2.5 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

FPGA resources include Configurable Logic Blocks (CLBs) with dual 4-input LUTs and flip-flops, 18 Kb Block SelectRAM+ modules (configurable as 512×36 or 16K×1), dedicated 18×18 multipliers, and Active Interconnect routing with predictable delay. All logic is SRAM-based, supporting partial reconfiguration and bitstream encryption via Triple DES.

Key Specifications

Pinout & Package

XC2VP4-6FGG256I uses the FGG256 wire-bond fine-pitch BGA package (17 mm × 17 mm, 1.0 mm pitch), Pb-free compliant, with 256 balls arranged in a 16×16 array. Pin functions are defined per DS083 Module 4, including dedicated configuration pins (CCLK, DONE, PROG_B), JTAG TAP (TCK/TDI/TDO/TMS), PowerPC debug signals (TRST, DBGRQ), RocketIO reference clocks (MGTREFCLK), and bank-specific VCCO/VCCAUX supplies.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP4-6FGG256I, XC2VP7-6FF456I offers greater transceiver count and logic capacity but demands redesign due to flip-chip packaging and higher power; XC3S1600E-4FGG400C lacks both processor and transceivers, making it unsuitable for applications requiring integrated serial connectivity or real-time software execution.

Availability

XC2VP4-6FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging subsystems, and avionics sensor hubs requiring stable component supply across extended product lifecycles.

Supply support for XC2VP4-6FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed for high-performance embedded systems requiring tightly coupled processing, high-speed serial I/O, and flexible logic - targeting telecom, aerospace, and medical equipment where integration reduces board area and inter-chip latency.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FGG256I?

The PowerPC 405 core in XC2VP4-6FGG256I operates at up to 350 MHz under Industrial temperature conditions (-40°C to +85°C) at the -6 speed grade. This rating is confirmed in DS083 Table 4 and applies specifically to the XC2VP4 device in FGG256 packaging. Performance depends on proper decoupling, thermal management, and clock routing; exceeding 350 MHz requires adherence to XAPP755 guidelines for dual-core variants, which do not apply to XC2VP4-6FGG256I.

Does XC2VP4-6FGG256I support LVDS I/O standards?

Yes, XC2VP4-6FGG256I supports LVDS I/O through its SelectIO-Ultra technology, delivering 840 Mb/s differential signaling with on-chip 100 Ω differential termination. LVDS operation requires pairing adjacent I/O pins and configuring the IOB for differential standards via UCF or XDC constraints. The FGG256 package provides sufficient pin spacing and routing layers to maintain signal integrity at full LVDS data rates.

Can XC2VP4-6FGG256I be configured via JTAG boundary scan?

Yes, XC2VP4-6FGG256I supports IEEE 1149.1-compliant JTAG configuration using TCK, TDI, TDO, and TMS pins. Boundary-scan mode enables programming, verification, and debugging without requiring dedicated configuration pins. The device also supports INTEST and EXTEST instructions for interconnect testing, and USERCODE for device identification during system boot.

What is the purpose of the MGTREFCLK pins on XC2VP4-6FGG256I?

The MGTREFCLK pins on XC2VP4-6FGG256I provide the reference clock input for the RocketIO transceivers' phase-locked loops. Each transceiver bank requires a dedicated differential reference clock (e.g., MGTREFCLK0_P/N), typically sourced from a low-jitter crystal oscillator or clock generator. Valid frequencies range from 100 MHz to 156.25 MHz, and precise jitter specifications (<1.5 ps RMS) are required to meet RocketIO BER targets per DS083 Module 3.

Is XC2VP4-6FGG256I recommended for new designs?

No, XC2VP4-6FGG256I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While still available through authorized distributors and legacy supply chains, Xilinx discontinued active development and long-term support. Aetrix Electronics maintains inventory for replacement and maintenance programs but advises new designs to evaluate modern alternatives such as Kintex-7 or Versal ACAP families for enhanced performance, power efficiency, and toolchain support.