AMD XC2VP4-6FGG456C

Overview

XC2VP4-6FGG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one embedded PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 2.5 Gb/s per channel), 6,768 logic cells, and 504 kbit of Block SelectRAM+ memory in a 456-pin Fine-Pitch BGA (FGG) package. It targets high-speed serial interconnect applications in telecom, networking, and video systems requiring embedded processing and programmable logic on a single die.

For engineers reviewing the XC2VP4-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (350 MHz PowerPC operation), FGG456 wire-bond BGA package with 248 user I/Os, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, and dual-voltage I/O support (1.5V core / 2.5V auxiliary).

Technical Context

The XC2VP4-6FGG456C implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP blocks: a single IBM PowerPC 405 core running at up to 350 MHz (–6 speed grade), four RocketIO transceivers supporting 600 Mb/s to 2.5 Gb/s full-duplex serial links, and Digital Clock Manager (DCM) modules for clock synthesis, phase shifting, and deskew. Its CLB structure delivers 6,768 logic cells using 4-input LUTs and flip-flops, while Block SelectRAM+ provides true dual-port 18-kbit RAM blocks.

I/O subsystem includes SelectIO-Ultra technology with 22 single-ended and 10 differential standards, Digitally Controlled Impedance (DCI) for on-die termination, and support for LVDS (840 Mb/s), PCI-X, and SSTL. Configuration uses IEEE 1532-compliant boundary-scan or SelectMAP interfaces, with optional DES bitstream encryption.

Key Specifications

Pinout & Package

XC2VP4-6FGG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.0 mm pitch, 23 mm × 23 mm body size, and Pb-free wire-bond construction. Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration (M0–M2, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), PowerPC debug (JTAG, BDM), RocketIO (TXP/TXN/RXP/RXN), and configurable I/O banks distributed across perimeter rows.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP4-6FGG456C, XC2VP7-6FGG456C offers greater logic and transceiver resources for scalable architectures, while XC3S1600E-4FGG456C trades integrated functionality for lower cost and power - neither is pin-compatible, and both require PCB redesign and firmware adaptation.

Availability

XC2VP4-6FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP4-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions.

The Virtex-II Pro family, including XC2VP4-6FGG456C, was designed to integrate embedded processors and high-speed serial I/O into programmable logic for system-on-chip acceleration in communications and signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-6FGG456C?

The XC2VP4-6FGG456C PowerPC 405 core operates at up to 350 MHz under the –6 speed grade, as specified in DS083 Table 4. This frequency assumes proper decoupling, thermal management, and timing closure of the surrounding logic. The XC2VP4-6FGG456C datasheet confirms this rating applies to commercial-grade operation; industrial-grade variants are not offered for this speed grade.

Does XC2VP4-6FGG456C support JTAG boundary-scan testing?

Yes, XC2VP4-6FGG456C fully supports IEEE 1149.1 boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming. This capability is documented in DS083 Module 1 and verified in Xilinx's BSDL files for the FGG456 package.

Can XC2VP4-6FGG456C be configured using SPI flash memory?

No, XC2VP4-6FGG456C does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 (JTAG) configuration modes only. SPI flash interfacing requires external controller logic or use of Xilinx System ACE solutions - the XC2VP4-6FGG456C itself lacks integrated SPI boot ROM or dedicated SPI interface pins.

What I/O standards are supported by XC2VP4-6FGG456C with on-chip termination?

XC2VP4-6FGG456C supports on-chip Digitally Controlled Impedance (DCI) termination for LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V), and HSTL (1.5V/1.8V) single-ended standards, and on-chip differential termination for LVDS, BLVDS, ULVDS, and LDT. These features eliminate external termination resistors and are confirmed in DS083 Module 1 Section "SelectIO-Ultra Technology" and Table 2 of the IOB description.

Is XC2VP4-6FGG456C still recommended for new designs?

No, XC2VP4-6FGG456C is marked "Product Not Recommended For New Designs" per DS083 v5.0 (June 2011). Xilinx discontinued Virtex-II Pro production in favor of Virtex-4 and later families. While Aetrix Electronics maintains legacy supply for ongoing production, new designs should evaluate Xilinx Kintex or AMD Versal alternatives for long-term support and enhanced features.