AMD XC2VP50-5FF1152C

Overview

XC2VP50-5FF1152C from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 8 Digital Clock Managers (DCMs). It uses a 0.13 µm nine-layer copper process with 1.5 V core voltage and is packaged in a 1152-pin flip-chip fine-pitch BGA (FF1152) for high-density telecom and networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP50-5FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, 3.125 Gb/s transceiver performance at -5 speed grade, FF1152 package I/O count (852 user I/Os), and compatibility with XAUI, Fibre Channel, and Gigabit Ethernet protocols.

Technical Context

The XC2VP50-5FF1152C implements two independent PowerPC 405 cores running at up to 300 MHz (at -5 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its RocketIO transceivers support full-duplex operation at 3.125 Gb/s with 8B/10B encoding, channel bonding (2–20 channels), and programmable pre-emphasis.

It features 232 18×18-bit multipliers, 232 Block SelectRAM+ modules (each 18 Kb), and 12 DCMs enabling precise clock deskew, multiplication/division, and ±180° phase shifting. The FF1152 package provides 852 user I/Os with SelectIO-Ultra support for LVDS, SSTL, HSTL, and PCI-X standards, plus Digitally Controlled Impedance (DCI) termination.

Key Specifications

Pinout & Package

XC2VP50-5FF1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.0 mm pitch, optimized for thermal dissipation and signal integrity in high-speed serial applications. Pin definitions follow Xilinx DS083 Module 4, covering configuration, JTAG, clock, PowerPC debug, RocketIO differential pairs, and SelectIO-Ultra banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing and high-speed serial interconnect applications.

Compared with XC2VP50-5FF1152C, XC2VP70-5FF1152C offers greater transceiver and logic capacity in the same footprint, while XC5VLX110-3FF1136C provides modern architecture benefits but removes embedded PowerPC processing and requires layout changes.

Availability

XC2VP50-5FF1152C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, broadcast video, and avionics applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP50-5FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II Pro family was designed for high-performance embedded systems integrating hard processor cores and multi-gigabit serial I/O, targeting telecom, aerospace, and test equipment where reconfigurable logic meets deterministic real-time processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-5FF1152C?

The XC2VP50-5FF1152C supports PowerPC 405 processor blocks operating at up to 300 MHz under the -5 speed grade, as specified in DS083 Table 4. This frequency assumes proper decoupling, thermal management, and adherence to voltage tolerances (1.5 V ±3% core, 2.5 V ±5% auxiliary). The XC2VP50-5FF1152C achieves this performance using its 0.13 µm copper process and integrated clock management resources.

Does XC2VP50-5FF1152C support 10 Gigabit Ethernet (10GbE) physical layer interfacing?

Yes, XC2VP50-5FF1152C supports 10GbE via its RocketIO transceivers configured for XAUI (10 Gigabit Attachment Unit Interface), which operates at 3.125 Gb/s per lane across four lanes. The XC2VP50-5FF1152C's transceivers comply with XAUI, Fibre Channel, and Gigabit Ethernet standards, and include 8B/10B encoding, channel bonding, and elastic buffers required for 10GbE MAC-to-PHY bridging.

What package type and pin count does XC2VP50-5FF1152C use?

XC2VP50-5FF1152C uses the FF1152 flip-chip fine-pitch BGA package with 1152 balls and 1.0 mm pitch. Per DS083 Table 3, it provides 852 user I/Os, excluding configuration, JTAG, power, and RocketIO dedicated pins. The FF1152 package supports high thermal dissipation and signal integrity for multi-gigabit serial applications.

Can XC2VP50-5FF1152C perform partial reconfiguration in the field?

Yes, XC2VP50-5FF1152C supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. Bitstream sections can be dynamically loaded into designated CLB or Block RAM regions without resetting the entire device. This capability is documented in DS083 Module 1 and enables runtime adaptation of communication protocols or signal processing pipelines in the XC2VP50-5FF1152C.

Is XC2VP50-5FF1152C suitable for designs requiring cryptographic bitstream protection?

Yes, XC2VP50-5FF1152C includes an on-chip Triple DES decryptor supporting optional encryption of configuration bitstreams using one or two DES key sets. This feature enables secure boot and prevents reverse engineering of FPGA logic, making XC2VP50-5FF1152C appropriate for defense, financial, and regulated industrial applications requiring tamper-resistant configuration.