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AMD XC2VP50-5FF1152I
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- Part No.:
- XC2VP50-5FF1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP50-5FF1152I.pdf
- Description:
- IC FPGA 692 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,231
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Product details
Overview
XC2VP50-5FF1152I from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 8 DCM clock management modules. It implements SRAM-based in-system configuration with 1.5V core voltage and supports PCI-X/PCI-compliant I/O standards for high-reliability telecom and networking control-plane applications.
For engineers reviewing the XC2VP50-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include verified dual-processor support at 300 MHz (Industrial grade), FF1152 flip-chip BGA package with 1152 balls, 852 user I/Os, and RocketIO transceiver count/configuration compatibility with legacy backplane protocols including Gigabit Ethernet and Fibre Channel.
Technical Context
This device uses a 0.13 µm nine-layer copper process with active interconnect routing architecture, enabling predictable timing independent of fanout. Its dual PowerPC 405 cores operate at up to 300 MHz in Industrial grade (-5 speed grade), each with 16 KB instruction and data caches, MMU, and dedicated OCM interface.
The RocketIO transceivers are full-duplex SERDES supporting 600 Mb/s to 3.125 Gb/s per channel, with monolithic CDR, 8B/10B encoding, programmable pre-emphasis, and on-chip 50 Ω termination - all implemented without external components. The FPGA fabric includes 232 18×18-bit multipliers and 232 Block SelectRAM+ modules (18 Kb each), configured as true dual-port RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 53,136 - determines maximum combinational/sequential logic capacity for custom IP integration |
| PowerPC Blocks | 2 × IBM PowerPC 405 - enables dual-core embedded processing with cache, MMU, and OCM interface |
| RocketIO Transceivers | 16 channels - provides 50 Gb/s full-duplex raw bandwidth for backplane or chip-to-chip serial links |
| DCMs | 8 units - deliver self-calibrating clock deskew, multiplication/division, and ±180° phase shift per channel |
| User I/O Pads | 852 - supports high-pin-count parallel buses and multiple differential I/O standards (LVDS, SSTL, HSTL) |
| Block RAM | 852 Kb distributed + 4,176 Kb block-based - enables large FIFOs, buffers, and on-chip memory-mapped peripherals |
| Speed Grade | -5 Industrial - guarantees 300 MHz PowerPC operation and 3.125 Gb/s RocketIO performance over -40°C to +100°C |
| Core Voltage | 1.5 V VCCINT - defines power delivery requirements and thermal design envelope for system-level integration |
Pinout & Package
XC2VP50-5FF1152I uses the FF1152 flip-chip fine-pitch BGA package with 1.0 mm ball pitch, 35 mm × 35 mm body size, and 1152 I/O balls. This package supports 852 user I/Os plus dedicated configuration, JTAG, and power/ground pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading and initialization of I/Os and logic |
| M0–M2 | Mode Selection Inputs | Determine configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enable IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| VCCINT | Core Power Supply | 1.5 V supply for FPGA fabric and PowerPC logic; requires low-noise regulation and decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for DCMs, SelectIO-Ultra drivers, and configuration circuitry |
| VCCO | I/O Bank Power Supply | Programmable 1.5 V / 1.8 V / 2.5 V / 3.3 V per bank to support mixed-voltage interfaces |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS/LVPECL clock sources for DCM reference; enables jitter-tolerant clock domain crossing |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables asymmetric multiprocessing: one core for real-time control, second for protocol stack or diagnostics |
| RocketIO Transceivers (16) | Eliminates need for external SERDES chips in 10Gbps-class backplanes using Fibre Channel or XAUI |
| Digital Clock Manager (8) | Provides deterministic clock deskew across 852 I/Os without external PLLs or delay lines |
| SelectIO-Ultra I/O | Supports 22 single-ended and 10 differential standards - simplifies migration from ASICs to FPGA-based designs |
| SRAM-Based Configuration | Allows unlimited reprogramming and partial reconfiguration for field-upgradable control firmware |
| On-Chip Memory Hierarchy | Combines 16 KB instruction/data caches + 852 Kb distributed RAM + 4,176 Kb block RAM for latency-critical buffering |
Applications
| Telecom Line Card Control | High-Speed Network Switch Fabric |
|---|---|
|
Use Scenario: Managing packet classification, QoS scheduling, and PHY interface bridging in modular carrier-grade switches. IC Role / Device Role / Timing Role: Dual PowerPC 405 cores run Linux-based control plane software while RocketIO transceivers interface directly to SFP+ cages and SerDes PHYs. Use Value: Integrates processor, high-speed serial I/O, and programmable logic in one die - reducing board area and inter-chip latency by >40% vs discrete solutions. |
Use Scenario: Implementing flexible packet forwarding engines with deep buffer memory and multi-protocol support (Ethernet, SONET, OTN). IC Role / Device Role / Timing Role: FPGA fabric executes custom match-action tables and traffic shapers; RocketIO channels carry 3.125 Gb/s XAUI links to switch ASICs. Use Value: 16 transceivers enable 16-lane XAUI aggregation without external retimers - lowering BOM cost and power by ~2.3 W per link. |
| Medical Imaging Data Acquisition | Defense Radar Signal Processing |
|
Use Scenario: Capturing and preprocessing high-resolution ultrasound or MRI sensor streams before transmission to host processors. IC Role / Device Role / Timing Role: Configurable logic implements real-time FIR filtering and beamforming; PowerPC cores manage PCIe endpoint and storage interface. Use Value: On-chip 4,176 Kb Block RAM serves as frame buffer - eliminating external DDR2 and reducing EMI from high-speed memory buses. |
Use Scenario: Performing pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: RocketIO transceivers receive digitized RF samples from ADCs; CLBs execute FFT and CFAR algorithms with deterministic latency. Use Value: 232 dedicated 18×18 multipliers accelerate complex arithmetic - achieving 12 GFLOPS peak throughput within fixed 100°C thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-5FF1152I | 74,448 logic cells, 20 RocketIO transceivers, same FF1152 package and -5 speed grade | Higher transceiver count and logic density support larger switch fabrics or multi-channel radar systems | Select when >16 transceivers or >53K logic cells are required; otherwise XC2VP50-5FF1152I offers better cost/power balance |
| XC2VP50-6FF1152I | Same logic resources and transceiver count, but -6 speed grade (350 MHz PowerPC, 3.125 Gb/s RocketIO) | Commercial temperature range only (-40°C to +85°C); not qualified for Industrial environments | Choose only for non-industrial deployments where higher clock speeds justify reduced thermal margin |
Compared with XC2VP70-5FF1152I and XC2VP50-6FF1152I, the XC2VP50-5FF1152I uniquely balances industrial temperature operation, 16-channel serial I/O, and dual-processor capability in a mature, production-proven package - making it optimal for long-lifecycle telecom infrastructure upgrades.
Availability
XC2VP50-5FF1152I is available at Aetrix Electronics and suitable for telecom line card control, high-speed network switch fabric, medical imaging data acquisition, and defense radar signal processing requiring stable component supply across extended product lifecycles.
Supply support for XC2VP50-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance system-on-chip applications requiring both programmable logic and embedded processing.
The Virtex-II Pro family was designed specifically to integrate PowerPC processors and multi-gigabit transceivers into a single FPGA platform for wireline and wireless infrastructure equipment.
FAQ
What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP50-5FF1152I?
The XC2VP50-5FF1152I is rated for 300 MHz PowerPC 405 operation under Industrial temperature conditions (-40°C to +100°C) per DS083 v5.0. This speed grade (-5) ensures deterministic timing closure for cache-coherent dual-core execution without requiring external clock conditioning circuits.
Does XC2VP50-5FF1152I support partial reconfiguration?
Yes, XC2VP50-5FF1152I supports partial reconfiguration via its SRAM-based configuration architecture and dedicated ICAP (Internal Configuration Access Port). This allows dynamic logic module updates during runtime - critical for adaptive signal processing or protocol switching in deployed systems.
What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP50-5FF1152I?
XC2VP50-5FF1152I supports 22 single-ended standards (including LVTTL, LVCMOS at 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Digitally controlled impedance (DCI) enables automatic on-chip termination for all single-ended I/Os.
Is XC2VP50-5FF1152I pin-compatible with other Virtex-II Pro devices in the FF1152 package?
No - XC2VP50-5FF1152I has a unique pinout defined in Module 4 of DS083. While FF1152 is used across multiple Virtex-II Pro devices (e.g., XC2VP40, XC2VP70), I/O allocation, transceiver pin assignments, and power ball mapping differ significantly between densities and transceiver configurations.
What configuration modes does XC2VP50-5FF1152I support?
XC2VP50-5FF1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. All modes use the same CCLK, DONE, M0–M2, and PROG_B pins, with mode selected by M0–M2 state at power-up.
XC2VP50-5FF1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5904
- Number of Logic Elements/Cells:
- 53136
- Total RAM Bits:
- 4276224
- Number of I/O:
- 692
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP50-5FF1152I FAQ
1.How can I place an order for XC2VP50-5FF1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP50-5FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP50-5FF1152I reliable?
The price and inventory of XC2VP50-5FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP50-5FF1152I is usually 5 days.
3.What payment methods are accepted for XC2VP50-5FF1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP50-5FF1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP50-5FF1152I?
XC2VP50-5FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP50-5FF1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP50-5FF1152I?
For technical support, including XC2VP50-5FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP50-5FF1152I requirements.
6.How does Aetrix verify that XC2VP50-5FF1152I is sourced from the original manufacturer or authorized distributors?
All XC2VP50-5FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP50-5FF1152I meets industry standards.
7.What is the process for return or replacement of XC2VP50-5FF1152I?
All XC2VP50-5FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP50-5FF1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP50-5FF1152I part is unused and in its original packaging.
Return procedure for XC2VP50-5FF1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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