AMD XC2VP50-5FF1517C

Overview

XC2VP50-5FF1517C from Xilinx is a high-density, flip-chip BGA FPGA in the Virtex-II Pro family, integrating two PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in a 1517-pin FF1517 package. It targets high-throughput telecom backplane interfaces, embedded networking systems, and DSP-accelerated video processing where on-chip processing and serial interconnect coexist.

For engineers reviewing the XC2VP50-5FF1517C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), DCM-based clock management, SelectIO-Ultra I/O flexibility, and FF1517 package thermal/power delivery characteristics.

Technical Context

The XC2VP50-5FF1517C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores (300 MHz max at -5 speed grade) and up to 16 RocketIO transceivers. Its routing uses Active Interconnect Technology with hierarchical segmented resources, ensuring predictable timing independent of fanout.

Each RocketIO channel supports full-duplex SERDES operation at 3.125 Gb/s with 8B/10B encoding, programmable pre-emphasis, on-chip 50 Ω termination, and internal loopback modes. The device includes twelve Digital Clock Managers (DCMs) for phase-shifting, frequency synthesis, and deskew - critical for synchronizing processor, transceiver, and fabric clocks.

Key Specifications

Pinout & Package

XC2VP50-5FF1517C is housed in a 40 mm × 40 mm, 1.0 mm pitch, flip-chip fine-pitch BGA (FF1517) package with 1517 solder balls. This package supports high I/O count and superior thermal dissipation versus wire-bond alternatives, and is qualified for industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP50-5FF1517C, XC2VP70-5FF1152C trades I/O count and package size for greater transceiver and logic capacity, while XC5VLX110-3FF1136C delivers architectural improvements including faster transceivers, more efficient logic, and updated PowerPC cores - making it the technically superior choice for forward-looking development.

Availability

XC2VP50-5FF1517C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and broadcast video equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP50-5FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as its flagship high-performance FPGA platform for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify programmable logic, embedded processors, and high-speed serial I/O in a single die - targeting applications where software-defined functionality, hardware acceleration, and multi-gigabit connectivity converge.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-5FF1517C?

The XC2VP50-5FF1517C has a -5 speed grade, which specifies a maximum PowerPC 405 core frequency of 300 MHz under industrial temperature conditions. At commercial temperature range, the same device supports up to 350 MHz. These values are validated in DS083 (v5.0) Table 4 and require proper decoupling and thermal management to sustain.

Does XC2VP50-5FF1517C support 10 Gigabit Ethernet (10GbE) physical layer interfacing?

Yes, XC2VP50-5FF1517C supports 10GbE via its RocketIO transceivers, which are compliant with XAUI (10 Gigabit Attachment Unit Interface) at 3.125 Gb/s per lane. Four lanes can be bonded to implement full 10GbE MAC-to-PHY connectivity, and the device includes built-in 8B/10B encoding/decoding required for XAUI compliance.

What configuration modes are supported by XC2VP50-5FF1517C?

XC2VP50-5FF1517C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by the M0–M2 pins, and all modes are fully documented in Module 1 of DS083. Bitstream encryption using triple-DES is also available for secure configuration.

Can XC2VP50-5FF1517C perform partial reconfiguration in-system?

Yes, XC2VP50-5FF1517C supports partial reconfiguration, allowing dynamic modification of specific logic regions without resetting the entire device or halting PowerPC execution. This capability is enabled by the Virtex-II Pro architecture and requires use of Xilinx ISE tools with appropriate constraints and bitstream generation settings.

Is XC2VP50-5FF1517C pin-compatible with other Virtex-II Pro devices in the FF1517 package?

No, XC2VP50-5FF1517C is not pin-compatible with other Virtex-II Pro devices in the FF1517 package. While the FF1517 footprint is shared across XC2VP50 and XC2VP100 variants, I/O assignments, power pin allocations, and transceiver pinouts differ between densities. Each device requires a unique PCB layout per Xilinx Pinout Files (Module 4 of DS083).