AMD XC2VP50-5FF1517I

Overview

XC2VP50-5FF1517I from Xilinx is a high-density, radiation-tolerant (industrial-grade) platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers, 53,136 logic cells, and 852 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It delivers 3.125 Gb/s serial transceiver performance, 300 MHz PowerPC operation, and integrated Digital Clock Managers for telecom, military comms, and high-reliability embedded processing.

For engineers reviewing the XC2VP50-5FF1517I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed -5 speed grade timing at industrial temperature range (–40°C to +100°C), FF1517 package I/O count and thermal profile, RocketIO channel count vs. transceiver-enabled packages, and PowerPC cache/MMU compatibility with legacy VxWorks or Linux BSPs.

Technical Context

This device implements a hardened dual-core PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - all operating at 300 MHz under -5 industrial speed grade. Its FPGA fabric includes 232 dedicated 18×18 multipliers, 232 Block SelectRAM+ modules (18 Kb each), and twelve Digital Clock Managers supporting precise phase shifting and frequency synthesis.

The XC2VP50-5FF1517I uses flip-chip interconnect on the FF1517 package (40×40 mm, 1.0 mm pitch), enabling full bonding of all 16 RocketIO transceivers and 852 user I/Os. It supports 8/16/32-bit parallel FPGA interfaces per transceiver, 8B/10B encoding, channel bonding across up to 20 lanes, and programmable pre-emphasis for signal integrity over backplanes.

Key Specifications

Pinout & Package

XC2VP50-5FF1517I is housed in a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.0 mm pitch and 40×40 mm body size. This package supports full I/O utilization (852 user pins), all 16 RocketIO transceiver pairs, and optimized power/ground ball placement for low-noise core and I/O supply domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP50-5FF1517I, the -6 variant trades industrial temperature compliance for higher clock margins, while the XC2VP70-5FF1152I increases logic capacity at the cost of larger package area and reduced per-pin routing flexibility in dense layouts.

Availability

XC2VP50-5FF1517I is available at Aetrix Electronics and suitable for aerospace telemetry, defense communications, and industrial automation requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP50-5FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based platform FPGAs with embedded processors and high-speed transceivers for system-on-chip integration.

The Virtex-II Pro family, including XC2VP50-5FF1517I, was engineered for high-reliability embedded computing where programmable logic, hard CPU cores, and multi-gigabit I/O must coexist on a single die - targeting telecom infrastructure, radar, and mission-critical control systems.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP50-5FF1517I?

The XC2VP50-5FF1517I is rated for 300 MHz PowerPC operation under industrial temperature conditions (–40°C to +100°C) and -5 speed grade. This frequency is fully characterized and guaranteed by Xilinx's DC and switching characteristics data - not a typical or nominal value. The XC2VP50-5FF1517I achieves this using its dual-core architecture with independent clock domains and on-chip memory controllers.

Does XC2VP50-5FF1517I support JTAG boundary-scan testing per IEEE 1149.1?

Yes, XC2VP50-5FF1517I fully complies with IEEE 1149.1 boundary-scan standards. Its TAP controller supports EXTEST, INTEST, SAMPLE, PRELOAD, BYPASS, IDCODE, and USERCODE instructions. The XC2VP50-5FF1517I also supports IEEE 1532 for in-system configuration, enabling verified programming and post-configuration integrity checks during manufacturing test.

Can XC2VP50-5FF1517I be configured via SPI flash memory?

No - XC2VP50-5FF1517I does not support native SPI master configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and JTAG (IEEE 1532) modes only. To use SPI flash, an external microcontroller or CPLD must implement the configuration state machine and drive XC2VP50-5FF1517I's CCLK and DIN pins in Slave Serial mode.

What transceiver protocols are natively supported by the RocketIO blocks in XC2VP50-5FF1517I?

The RocketIO transceivers in XC2VP50-5FF1517I natively support Fibre Channel (1.0625/2.125 Gb/s), Gigabit Ethernet (1.25 Gb/s), 10G Attachment Unit Interface (XAUI at 3.125 Gb/s), and InfiniBand (2.5 Gb/s). Protocol support is implemented in hard logic - no FPGA fabric resources are consumed for encoding/decoding, and 8B/10B logic is embedded per channel.

Is triple-DES bitstream encryption enabled by default in XC2VP50-5FF1517I?

No - triple-DES bitstream encryption in XC2VP50-5FF1517I is optional and must be explicitly enabled during bitstream generation using Xilinx ISE tools with appropriate license keys. When enabled, the XC2VP50-5FF1517I decrypts the configuration stream on-the-fly using on-chip keys; unencrypted bitstreams remain fully functional but lack IP protection.