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AMD XC2VP50-5FFG1152C
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- Part No.:
- XC2VP50-5FFG1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP50-5FFG1152C.pdf
- Description:
- IC FPGA 692 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,116
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Product details
Overview
XC2VP50-5FFG1152C from Xilinx is a high-density Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interfaces, embedded networking systems, and reconfigurable DSP acceleration where integrated processing and serial I/O coexist.
For engineers reviewing the XC2VP50-5FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver count and speed grade (-5), PowerPC 405 clock stability at 300 MHz, DCM phase-shifting resolution, SelectIO-Ultra I/O standard support (LVDS, SSTL, HSTL), and FF1152 package thermal/power delivery characteristics.
Technical Context
The XC2VP50-5FFG1152C implements a hardened architecture integrating two independent PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - all operating at up to 300 MHz in -5 speed grade. Its FPGA fabric includes 232 18×18-bit multipliers and 232 Block SelectRAM+ modules (18 Kb each), supporting true dual-port RAM configurations from 512×36 to 16K×1.
RocketIO transceivers are fully integrated SERDES with monolithic CDR, 8B/10B encoding, programmable pre-emphasis (0–500%), and on-chip 50 Ω termination. In the FF1152 package, all 16 transceivers are bonded out, enabling full-duplex aggregate bandwidth of 50 Gb/s (16 × 3.125 Gb/s) with channel bonding support for inter-chip alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 53,136 - determines maximum combinational logic density and register count for complex control/data paths |
| PowerPC Blocks | 2 × PowerPC 405 - enables dual-core embedded software execution with separate instruction/data caches and MMU |
| RocketIO Transceivers | 16 × 3.125 Gb/s - provides 50 Gb/s full-duplex raw serial bandwidth with 8B/10B encoding and channel bonding |
| User I/O Pads | 852 - supports high-pin-count parallel buses (e.g., DDR2, PCI-X) and multiple differential standards simultaneously |
| Digital Clock Managers (DCMs) | 8 - delivers jitter-tolerant clock deskew, integer/fractional frequency synthesis, and 1/256-cycle phase shifting |
| Block SelectRAM+ (18 Kb) | 232 blocks - enables large on-chip memory buffers (e.g., 4.2 Mb total) with true dual-port access for FIFOs or frame stores |
| 18×18 Multiplier Blocks | 232 - accelerates DSP operations including FIR filtering, FFT twiddle factor computation, and matrix arithmetic |
Pinout & Package
XC2VP50-5FFG1152C uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for signal integrity and thermal dissipation in high-speed serial applications. This package supports all 16 RocketIO transceivers and 852 user I/Os, with dedicated power/ground ball arrays and controlled impedance routing layers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.5 V supply for FPGA logic and PowerPC core; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, DCMs, and SelectIO-Ultra I/O drivers |
| VCCO | I/O bank power supply | Configurable per-bank voltage (1.5 V to 3.3 V) enabling mixed-voltage interface support |
| M0/M1/M2 | Configuration mode select | Determines startup configuration mode (e.g., Master SelectMAP, Slave Serial) |
| CCLK | Configuration clock input | Drives internal configuration logic; frequency ≤ 50 MHz for reliable bitstream loading |
| PROG_B | Program initiate | Active-low signal that resets configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant testing, programming, and debug access to internal registers |
| DXP/DXN | RocketIO differential transceiver pair | High-speed serial data path supporting 3.125 Gb/s; requires controlled 100 Ω differential PCB trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores with MMU | Enables real-time OS deployment and memory-protected multitasking without external microprocessor |
| 16 RocketIO transceivers (3.125 Gb/s) | Eliminates need for discrete SerDes ICs in 10GbE, Fibre Channel, or XAUI-based backplanes |
| SelectIO-Ultra with DCI | Provides on-die programmable termination (50–75 Ω) for LVDS, SSTL, and HSTL, reducing board-level resistor count |
| Digital Clock Manager (DCM) | Delivers sub-degree phase resolution and jitter-free clock multiplication/division for synchronous system timing |
| Block SelectRAM+ (18 Kb × 232) | Supports large on-chip frame buffers and lookup tables without external memory latency or bandwidth bottlenecks |
| 18×18 multiplier blocks (232) | Accelerates fixed-point DSP kernels with single-cycle multiply-accumulate capability for real-time signal processing |
Applications
| Telecom Line Card | Industrial Protocol Gateway |
|---|---|
|
Use Scenario: High-density OC-48/STM-16 line interface card aggregating 16 x 2.5 Gb/s SONET streams into a 40 Gb/s backplane fabric. IC Role / Device Role / Timing Role: XC2VP50-5FFG1152C serves as the protocol-aware aggregation engine, performing 8B/10B decode, HDLC framing, and time-division multiplexing using RocketIO transceivers and CLB fabric. Use Value: Integrated RocketIO eliminates 16 discrete transceiver ICs; dual PowerPC cores run management plane software while FPGA fabric handles real-time packet processing. |
Use Scenario: Fieldbus-to-Ethernet gateway bridging PROFIBUS DP, Modbus RTU, and EtherNet/IP in factory automation systems. IC Role / Device Role / Timing Role: XC2VP50-5FFG1152C hosts dual PowerPC 405 cores running protocol stacks and FPGA fabric implementing hardware-accelerated CRC, bit-stuffing, and packet serialization. Use Value: Single-chip solution replaces MCU + FPGA + PHY combo; SelectIO-Ultra supports simultaneous 3.3 V LVCMOS (fieldbus) and 2.5 V LVDS (backplane) I/O standards. |
| Medical Imaging Backend | Defense Radar Signal Processor |
|
Use Scenario: Real-time image reconstruction pipeline in MRI systems requiring high-throughput data ingestion from 64-channel ADC frontends and GPU-offloaded post-processing. IC Role / Device Role / Timing Role: XC2VP50-5FFG1152C acts as the high-bandwidth data concentrator and preprocessing unit, using Block SelectRAM+ for line buffering and multipliers for FFT-based k-space correction. Use Value: 852 I/Os enable direct connection to multiple ADCs; 232 multiplier blocks accelerate real-time beamforming algorithms without external DSP chips. |
Use Scenario: Active electronically scanned array (AESA) radar subsystem performing pulse compression, Doppler filtering, and CFAR detection in airborne platforms. IC Role / Device Role / Timing Role: XC2VP50-5FFG1152C implements deterministic signal processing chain with PowerPC cores managing radar control loops and FPGA fabric executing pipelined FIR filters and FFTs. Use Value: DCM-controlled clocks ensure sub-nanosecond timing alignment across 16 RF channels; RocketIO transceivers interface with high-speed DAC/ADC JESD204B-like serializers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-5FF896C | Higher logic density (74,448 cells), 20 RocketIO transceivers, but only 804 user I/Os in smaller FF896 package | Better suited for transceiver-heavy designs with less parallel I/O demand (e.g., 20-lane XAUI switch fabric) | Select XC2VP70-5FF896C when aggregate serial bandwidth >50 Gb/s is required and board space limits package size |
| XC4VLX80-11FF1148C | Virtex-4 generation; higher logic capacity (81,792 LUTs), no embedded PowerPC, supports 622 Mb/s–3.75 Gb/s RocketIO | Targets pure logic-intensive applications without hard processor requirements (e.g., video compression engines) | Choose XC4VLX80-11FF1148C for new designs needing higher logic density and lower power, accepting loss of integrated CPU |
Compared with XC2VP50-5FFG1152C, XC2VP70-5FF896C trades I/O count for transceiver count and logic density, while XC4VLX80-11FF1148C abandons PowerPC integration for greater LUT count and process node advantage - making XC2VP50-5FFG1152C uniquely balanced for CPU+SERDES+I/O co-design in legacy telecom infrastructure.
Availability
XC2VP50-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial protocol gateways, and medical imaging backend systems requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP50-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed serial transceivers.
The Virtex-II Pro family was designed to unify programmable logic, embedded RISC processing, and multi-gigabit serial I/O in a single device for next-generation communications and signal processing systems.
FAQ
What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP50-5FFG1152C?
The XC2VP50-5FFG1152C speed grade -5 guarantees PowerPC 405 core operation at 300 MHz under commercial temperature conditions. This rating is confirmed in DS083 Table 4 and applies to both cores simultaneously when proper power sequencing and cooling are maintained per Xilinx DC and Switching Characteristics documentation.
Does XC2VP50-5FFG1152C support 10 Gigabit Ethernet (10GbE) physical layer interfacing?
Yes, XC2VP50-5FFG1152C supports 10GbE via its RocketIO transceivers, which are compliant with XAUI (10 Gigabit Attachment Unit Interface) at 3.125 Gb/s per lane. Four lanes can be bonded to implement full 10GbE MAC-to-PHY connectivity, with 8B/10B encoding and channel alignment handled in hardware.
What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP50-5FFG1152C?
XC2VP50-5FFG1152C supports 22 single-ended (e.g., LVCMOS 1.5/1.8/2.5/3.3 V, PCI, GTL) and 10 differential standards (e.g., LVDS, BLVDS, LVPECL, HSTL, SSTL) through its SelectIO-Ultra blocks. Digitally Controlled Impedance (DCI) provides on-die termination for most single-ended standards without external resistors.
Is XC2VP50-5FFG1152C pin-compatible with other Virtex-II Pro devices in the FF1152 package?
No, XC2VP50-5FFG1152C is not pin-compatible with other Virtex-II Pro devices in the FF1152 package. While package footprint is identical, I/O assignment, power pin distribution, and RocketIO transceiver placement differ across device densities. Pinout must be validated against DS083 Module 4 for each specific part.
What configuration modes does XC2VP50-5FFG1152C support, and which is recommended for production systems?
XC2VP50-5FFG1152C supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan configuration modes. For production systems requiring fast, secure, and field-upgradable configuration, Master SelectMAP with external flash memory and optional Triple-DES bitstream encryption is recommended per Xilinx UG078 guidelines.
XC2VP50-5FFG1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5904
- Number of Logic Elements/Cells:
- 53136
- Total RAM Bits:
- 4276224
- Number of I/O:
- 692
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP50-5FFG1152C FAQ
1.How can I place an order for XC2VP50-5FFG1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP50-5FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP50-5FFG1152C reliable?
The price and inventory of XC2VP50-5FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP50-5FFG1152C is usually 5 days.
3.What payment methods are accepted for XC2VP50-5FFG1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP50-5FFG1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP50-5FFG1152C?
XC2VP50-5FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP50-5FFG1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP50-5FFG1152C?
For technical support, including XC2VP50-5FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP50-5FFG1152C requirements.
6.How does Aetrix verify that XC2VP50-5FFG1152C is sourced from the original manufacturer or authorized distributors?
All XC2VP50-5FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP50-5FFG1152C meets industry standards.
7.What is the process for return or replacement of XC2VP50-5FFG1152C?
All XC2VP50-5FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP50-5FFG1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP50-5FFG1152C part is unused and in its original packaging.
Return procedure for XC2VP50-5FFG1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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