AMD XC2VP50-5FFG1152I

Overview

XC2VP50-5FFG1152I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom, networking, and video processing systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP50-5FFG1152I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver count and speed grade (-5), PowerPC 405 clock frequency (300 MHz), I/O count (852), DCM count (8), and FF1152 package compatibility with industrial temperature range (–40°C to +100°C).

Technical Context

This device integrates two IBM PowerPC 405 cores with 16 KB instruction and data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its 16 RocketIO transceivers support full-duplex operation at 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

The FPGA fabric includes 232 18×18-bit multipliers, 232 Block SelectRAM+ modules (18 Kb each), 12 DCMs for precise clock management, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X standards with digitally controlled impedance (DCI) and DDR register options.

Key Specifications

Pinout & Package

XC2VP50-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), with 1152 solder balls arranged in a 36×36 array. This package supports 852 user I/Os plus dedicated configuration, clock, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP50-5FFG1152I, the XC2VP50-6FFG1152I offers higher PowerPC clock margin but lacks industrial temperature qualification, while the XC2VP70-5FFG1152I retains identical packaging and speed grade but adds 21K+ logic cells and 4 extra RocketIO channels - enabling feature-rich upgrades without board redesign.

Availability

XC2VP50-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and broadcast video systems requiring stable component supply over extended product lifecycles.

Supply support for XC2VP50-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the industry's first FPGA and continues to lead in adaptive computing architectures.

The Virtex-II Pro family was designed for high-performance embedded systems integrating hard processor cores and high-speed serial I/O - targeting applications where ASIC-level bandwidth and flexibility coexist in a single device.

FAQ

What is the maximum guaranteed PowerPC 405 clock frequency for XC2VP50-5FFG1152I?

The XC2VP50-5FFG1152I is rated for 300 MHz PowerPC 405 operation under industrial temperature conditions (–40°C to +100°C) at speed grade -5. This is confirmed in Table 4 of DS083 (v5.0), where -5 grade specifies 300 MHz for dual-processor devices. The XC2VP50-5FFG1152I must be used with appropriate voltage regulation and thermal management to sustain this frequency across its full temperature range.

Does XC2VP50-5FFG1152I support RocketIO X transceivers?

No, XC2VP50-5FFG1152I does not support RocketIO X transceivers. According to Table 1 in DS083 (v5.0), only XC2VPX20 and XC2VPX70 devices include RocketIO X cores. The XC2VP50-5FFG1152I contains up to 16 standard RocketIO transceivers, rated at 3.125 Gb/s (not 6.25 Gb/s), and lacks the 64B/66B encoding and variable-rate features of RocketIO X.

What package type and pin count does XC2VP50-5FFG1152I use?

XC2VP50-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package with 1152 solder balls arranged in a 36×36 grid. As documented in Table 3 of DS083 (v5.0), this package delivers 852 user I/Os and supports industrial temperature operation. The "FF" prefix explicitly denotes flip-chip construction, distinguishing it from wire-bond FG/FGG packages.

How many Digital Clock Managers (DCMs) are available in XC2VP50-5FFG1152I?

XC2VP50-5FFG1152I includes 12 Digital Clock Managers (DCMs), as stated in Table 1 of DS083 (v5.0). Each DCM provides fully digital clock deskew, multiplication/division, and fine-grained phase shifting (1/256 of period). These 12 DCMs are distributed across the die to support independent clock domain management for PowerPC cores, RocketIO transceivers, and user logic.

Is XC2VP50-5FFG1152I recommended for new designs?

No, XC2VP50-5FFG1152I is marked "Product Not Recommended For New Designs" per the DS083 (v5.0) datasheet cover page and Module 1 introduction. While fully functional and supported for existing programs, Xilinx advises new projects to consider newer families such as Virtex-5 or Kintex-7 for improved performance, power efficiency, and long-term availability.