AMD XC2VP50-5FFG1517C

Overview

XC2VP50-5FFG1517C from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network packet processors, and video-over-IP systems.

For engineers reviewing the XC2VP50-5FFG1517C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed -5 speed grade timing (300 MHz PowerPC, 3.125 Gb/s transceivers), FF1517 package I/O count (852), dual-processor support, and RocketIO channel count (16) - all validated in DS083 v5.0.

Technical Context

The XC2VP50-5FFG1517C implements two independent PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface, enabling real-time embedded software execution alongside FPGA fabric. Its 16 RocketIO transceivers support full-duplex 3.125 Gb/s operation with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback - eliminating external clock recovery ICs and termination resistors.

Logic resources include 23,616 Configurable Logic Block (CLB) slices, 232 18×18-bit multipliers, 4,176 Kb distributed RAM, and eight 18-Kb Block SelectRAM+ modules (852 Kb total). Clock management uses twelve Digital Clock Managers (DCMs) with phase shifting, frequency synthesis, and deskew - supporting synchronous design across heterogeneous subsystems.

Key Specifications

Pinout & Package

XC2VP50-5FFG1517C is housed in a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.0 mm pitch and 40×40 mm body size. This package supports 852 user I/Os, 16 RocketIO transceiver pairs, dual PowerPC JTAG/debug interfaces, and dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP50-5FFG1517C, XC2VP70-5FF1152C trades I/O count and package thermal performance for higher transceiver count, while XC2VP40-5FF1152C reduces logic and transceiver resources to lower cost - making XC2VP50-5FFG1517C the optimal balance of I/O, transceivers, and embedded processing for mid-range telecom and video platforms.

Availability

XC2VP50-5FFG1517C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and defense radar systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP50-5FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic and platform FPGAs, delivering high-performance, feature-rich devices for aerospace, communications, and industrial markets since 1984.

The Virtex-II Pro family was designed to integrate hard processor cores and high-speed serial transceivers into a single programmable logic device - targeting system-level consolidation in networking, wireless infrastructure, and digital video.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP50-5FFG1517C?

The XC2VP50-5FFG1517C supports RocketIO transceivers at up to 3.125 Gb/s in full-duplex mode, as confirmed in DS083 v5.0 Table 4 for -5 speed grade devices. This applies to all 16 transceiver channels in the FF1517 package configuration, and is compatible with Fibre Channel, Gigabit Ethernet, and XAUI protocols.

Does XC2VP50-5FFG1517C include embedded processor cores?

Yes, XC2VP50-5FFG1517C integrates two IBM PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. These cores operate at up to 300 MHz in the -5 speed grade and support real-time embedded software execution alongside FPGA fabric logic.

What package type and pin count does XC2VP50-5FFG1517C use?

XC2VP50-5FFG1517C uses the FF1517 flip-chip fine-pitch BGA package with 1517 balls, 1.0 mm pitch, and 40×40 mm body size. It provides 852 user I/Os, as documented in DS083 v5.0 Table 3, and supports thermal dissipation requirements for sustained 300 MHz PowerPC and 3.125 Gb/s transceiver operation.

Is XC2VP50-5FFG1517C suitable for new designs?

No - XC2VP50-5FFG1517C is marked "Product Not Recommended For New Designs" in DS083 v5.0. It remains available for legacy program support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new development due to enhanced performance, power efficiency, and toolchain support.

What clock management resources are available in XC2VP50-5FFG1517C?

XC2VP50-5FFG1517C includes twelve Digital Clock Manager (DCM) modules, each providing precise clock deskew, integer/fractional frequency synthesis, and coarse/fine phase shifting. These DCMs drive 16 global clock multiplexer buffers, enabling robust clock distribution across the FPGA fabric, PowerPC cores, and I/O banks.