AMD XC2VP50-6FF1152C

Overview

XC2VP50-6FF1152C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an FF1152 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom infrastructure, network processors, and video-over-IP systems.

For engineers reviewing the XC2VP50-6FF1152C datasheet, pinout, applications, or equivalent options, this page provides verified architecture-level specifications, confirmed I/O count and transceiver configuration, package-mapped timing performance, and validated alternative options for legacy system sustainment and redesign.

Technical Context

The XC2VP50-6FF1152C implements a hardened dual-processor subsystem with two independent PowerPC 405 cores running at up to 350 MHz (–6 speed grade), each with 16 KB instruction and data caches, MMU, and OCM interface. Its FPGA fabric includes 232 18×18-bit multipliers, 232 Block SelectRAM+ modules (18 Kb each), and twelve Digital Clock Managers supporting fine-grained phase shifting and frequency synthesis.

This device supports RocketIO transceivers configured for full-duplex operation at 3.125 Gb/s per channel with 8B/10B encoding, on-chip 50 Ω termination, programmable pre-emphasis, and channel bonding across up to 20 lanes. I/O subsystem uses SelectIO-Ultra with DCI, LVDS, SSTL, HSTL, and PCI-X support - all operating from dedicated 2.5 V (VCCAUX) and 3.3 V (VCCO) supplies.

Key Specifications

Pinout & Package

XC2VP50-6FF1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. Pin definitions follow Xilinx DS083 Module 4, where balls are organized into I/O banks, configuration pins (e.g., CCLK, DONE, M[0:2], PROG_B), JTAG boundary-scan (TCK/TDI/TDO/TMS), and dedicated transceiver pairs (RXN/RXP, TXN/TXP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP50-6FF1152C, XC2VP70-6FF1152C offers immediate scalability within the same footprint and thermal envelope, while XC5VLX110-1FF1136C represents a generational shift with higher performance per watt but mandates layout and firmware adaptation.

Availability

XC2VP50-6FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, network acceleration, and broadcast video equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP50-6FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and design tools since 1984.

The Virtex-II Pro family - including XC2VP50-6FF1152C - was engineered for high-performance embedded systems integrating processor, serial I/O, and programmable logic on a single die, targeting telecom, aerospace, and imaging applications.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP50-6FF1152C?

XC2VP50-6FF1152C supports RocketIO transceivers at up to 3.125 Gb/s per channel in full-duplex mode. This speed is guaranteed for the –6 speed grade under commercial temperature conditions and aligns with Fibre Channel, Gigabit Ethernet, and XAUI protocol requirements. The device does not include RocketIO X transceivers, which are limited to XC2VPX-series variants.

Does XC2VP50-6FF1152C include PowerPC processor cores?

Yes, XC2VP50-6FF1152C integrates two IBM PowerPC 405 RISC processor blocks, each capable of sustained operation at 350 MHz in the –6 speed grade. These cores include 16 KB instruction and data caches, MMU, OCM interface, and CoreConnect bus compatibility - enabling embedded Linux or real-time OS deployment directly on the FPGA fabric.

What package type and pin count does XC2VP50-6FF1152C use?

XC2VP50-6FF1152C uses the FF1152 flip-chip fine-pitch BGA package with 1152 solder balls, 1.0 mm pitch, and a 35 mm × 35 mm body size. This package supports high I/O count (852 user I/Os) and superior thermal performance compared to wire-bond alternatives, and is explicitly listed in Table 3 of DS083 for XC2VP50 devices with 16 RocketIO channels.

Is XC2VP50-6FF1152C recommended for new designs?

No, XC2VP50-6FF1152C is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0). It remains available for legacy system repair, obsolescence mitigation, and sustainment programs, but Xilinx recommends Virtex-5 or newer families for new development due to enhanced performance, lower power, and extended lifecycle support.

What configuration modes are supported by XC2VP50-6FF1152C?

XC2VP50-6FF1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is controlled by M0–M2 pins at power-up, and the device includes on-chip DES decryption for bitstream security. Readback and partial reconfiguration are also fully supported.