AMD XC2VP50-6FF1152I

Overview

XC2VP50-6FF1152I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an FF1152 flip-chip BGA package. It targets high-bandwidth telecom and networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP50-6FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO channel count (16), -6 speed grade timing (350 MHz PowerPC, 3.125 Gb/s transceivers), FF1152 package I/O mapping, DCM-based clock management, and dual-processor support for real-time control in legacy infrastructure designs.

Technical Context

The XC2VP50-6FF1152I integrates two IBM PowerPC 405 cores with 16 KB instruction and data caches, MMU, and OCM interface - enabling tightly coupled software-defined signal processing. Its 16 RocketIO transceivers support full-duplex 3.125 Gb/s operation with 8B/10B encoding, on-chip 50 Ω termination, and channel bonding across up to 20 lanes.

FPGA fabric includes 232 18×18-bit multipliers, 232 Block SelectRAM+ modules (18 Kb each), 12 Digital Clock Managers (DCMs) with fine-grained phase shifting, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X standards - all built on a 0.13 µm nine-layer copper process with 1.5 V core supply.

Key Specifications

Pinout & Package

XC2VP50-6FF1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for thermal dissipation and high I/O density. It contains 1152 balls with dedicated power, ground, configuration, JTAG, and high-speed transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA with embedded processor applications.

Compared with XC2VP50-6FF1152I, XC2VP70-6FF1152I offers greater transceiver count and logic capacity at identical package and thermal footprint, while XC4VLX80-11FF1148I trades embedded processors for raw fabric throughput and modern process advantages - making it relevant only for non-legacy redesigns where PowerPC dependency is removed.

Availability

XC2VP50-6FF1152I is available at Aetrix Electronics and suitable for SONET line cards, wireless baseband units, industrial Ethernet switches, and avionics data concentrators requiring stable component supply amid long-lifecycle deployments.

Supply support for XC2VP50-6FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and defined the platform FPGA category with integrated processors and high-speed I/O.

The Virtex-II Pro family was engineered for infrastructure equipment demanding both programmable logic density and hardened compute resources - specifically targeting telecom, defense, and broadcast applications where ASIC-level performance meets FPGA flexibility.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP50-6FF1152I?

The XC2VP50-6FF1152I -6 speed grade guarantees 350 MHz operation for both PowerPC 405 cores under industrial temperature conditions (–40°C to +85°C). This rating assumes proper decoupling, thermal management, and adherence to voltage tolerances (1.5 V ±3% for VCCINT). Performance above 350 MHz requires implementation of the CPMC405CLOCK macro per XAPP755 for dual-processor configurations.

Does XC2VP50-6FF1152I support partial reconfiguration?

Yes, XC2VP50-6FF1152I supports partial reconfiguration via the SelectMAP interface and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., changing modulation schemes in wireless PHY) without resetting the PowerPC cores or disrupting active RocketIO links - subject to proper floorplanning and use of Xilinx Virtex-II Pro-specific configuration tools.

What transceiver protocols are natively supported by the RocketIO blocks in XC2VP50-6FF1152I?

The RocketIO transceivers in XC2VP50-6FF1152I support Fibre Channel (1.0625/2.125 Gb/s), Gigabit Ethernet (1.25 Gb/s), 10G Attachment Unit Interface (XAUI at 3.125 Gb/s), InfiniBand, and OC-48 (2.488 Gb/s) - all enabled through 8B/10B encoding, channel bonding, and programmable pre-emphasis. RocketIO X features (e.g., 64B/66B) are not present in this variant.

Is XC2VP50-6FF1152I pin-compatible with other Virtex-II Pro devices in the FF1152 package?

No - XC2VP50-6FF1152I is not pin-compatible with other Virtex-II Pro devices in FF1152. While package outline and ball pitch match, I/O bank assignments, transceiver pinouts, and power/ground ball distributions differ across densities (e.g., XC2VP70-6FF1152I allocates more balls to transceiver banks). Board reuse requires verification against device-specific pinout tables in DS083 Module 4.

What is the status of XC2VP50-6FF1152I for new designs according to Xilinx documentation?

Xilinx explicitly marks XC2VP50-6FF1152I as "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). This reflects end-of-life planning: no new mask sets, limited long-term availability, and no roadmap extension. Aetrix Electronics supports legacy production and repair programs but advises migration planning for new projects toward Virtex-4 or later families.