AMD XC2VP50-6FF1517C

Overview

XC2VP50-6FF1517C from Xilinx is a high-density Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom, networking, and video processing systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP50-6FF1517C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, verified 3.125 Gb/s RocketIO transceiver performance at -6 speed grade, validated FF1517 package I/O count (852), and compatibility with Xilinx Foundation/Alliance design tools and ChipScope ILA debugging.

Technical Context

The XC2VP50-6FF1517C integrates two independent PowerPC 405 cores running at up to 350 MHz (-6 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its FPGA fabric includes 232 18×18-bit multipliers and 232 Block SelectRAM+ modules (18 Kb each), supporting true dual-port RAM configurations from 512×36 to 16K×1.

RocketIO transceivers are fully integrated SERDES with monolithic CDR, programmable pre-emphasis (0–500%), on-chip 50 Ω termination, and 8B/10B encoding. The device uses Active Interconnect routing with 24 long lines per row/column and supports partial reconfiguration and Triple DES bitstream encryption.

Key Specifications

Pinout & Package

XC2VP50-6FF1517C is housed in a 40 mm × 40 mm flip-chip fine-pitch BGA (FF1517) with 1.0 mm pitch and 1517 solder balls. The package supports thermal dissipation suitable for industrial temperature range operation and provides dedicated power/ground ball arrays for signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP50-6FF1517C, XC2VP70-6FF1152C trades I/O count for transceiver count and logic density in a smaller package, while XC2VP50-6FF1704C retains identical functionality but expands I/O and thermal headroom-making it ideal for high-signal-integrity, high-I/O-count deployments.

Availability

XC2VP50-6FF1517C is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP50-6FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-II Pro family was designed to deliver integrated embedded processing and high-speed serial connectivity for demanding communications and signal processing applications-bridging the gap between ASIC flexibility and microprocessor programmability.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-6FF1517C?

The XC2VP50-6FF1517C supports PowerPC 405 cores up to 350 MHz under -6 speed grade at commercial temperature range. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The actual achievable frequency depends on cache hit rate, bus contention, and peripheral interface timing constraints within the implemented design.

Does XC2VP50-6FF1517C support partial reconfiguration?

Yes, XC2VP50-6FF1517C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. Users can dynamically reload specific CLB or Block RAM regions without resetting the entire device or interrupting PowerPC execution-enabling runtime adaptation of communication protocols or filter coefficients in deployed systems.

What I/O standards are supported by XC2VP50-6FF1517C's SelectIO-Ultra blocks?

XC2VP50-6FF1517C supports 22 single-ended standards-including LVTTL, LVCMOS (1.5 V to 3.3 V), PCI/PCI-X, GTL, HSTL, and SSTL-and 10 differential standards such as LVDS, BLVDS, ULVDS, LVPECL, and HyperTransport. Each I/O bank is independently configurable for voltage and standard, enabling mixed-interface designs on a single device.

Is XC2VP50-6FF1517C compatible with Xilinx ISE Design Suite?

Yes, XC2VP50-6FF1517C is fully supported by Xilinx ISE 14.7 and earlier versions, including synthesis, place-and-route, timing analysis, and ChipScope ILA integration. It is not supported in Vivado, as Virtex-II Pro devices were discontinued prior to Vivado's introduction and require legacy toolchain workflows.

What is the significance of "Product Not Recommended For New Designs" for XC2VP50-6FF1517C?

"Product Not Recommended For New Designs" indicates Xilinx has ceased development and marketing of the Virtex-II Pro family. While XC2VP50-6FF1517C remains available through authorized distributors and Aetrix Electronics for legacy support and obsolescence management, new projects should consider migration paths such as Kintex-7 or Versal ACAP families for long-term supply assurance and feature parity.