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AMD XC2VP50-6FF1517I
- Part No.:
- XC2VP50-6FF1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XC2VP50-6FF1517I.pdf
- Description:
- IC FPGA 852 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,006
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Product details
Overview
XC2VP50-6FF1517I from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput embedded systems requiring integrated processing, serial connectivity, and programmable logic - such as telecom line cards and network packet processors.
For engineers reviewing the XC2VP50-6FF1517I datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade (350 MHz PowerPC, 3.125 Gb/s transceivers), industrial temperature rating (–40°C to +100°C), FF1517 package I/O count (852), and confirmed support for LVDS, SSTL, HSTL, PCI-X, and RocketIO-based protocols including Gigabit Ethernet and XAUI.
Technical Context
The XC2VP50-6FF1517I integrates two IBM PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface, enabling real-time embedded software execution alongside hardware acceleration. Its 16 RocketIO transceivers implement full-duplex SERDES with monolithic CDR, 8B/10B encoding, channel bonding, and programmable pre-emphasis - all operating at 3.125 Gb/s in this -6 speed grade.
FPGA fabric includes 23,616 Configurable Logic Blocks (CLBs), 738 dedicated 18×18 multipliers, 232 Block SelectRAM+ modules (18 Kb each), and twelve Digital Clock Managers (DCMs) supporting precise phase shifting, frequency synthesis, and deskew. I/O subsystem supports 22 single-ended and 10 differential standards with Digitally Controlled Impedance (DCI) and on-chip differential termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 53,136 - determines maximum combinational/sequential logic capacity for custom RTL or IP integration. |
| PowerPC Cores | 2 × PowerPC 405 - enables dual-core embedded software execution with cache, MMU, and OCM interface. |
| RocketIO Transceivers | 16 × 3.125 Gb/s - provides 50 Gb/s full-duplex raw bandwidth; supports XAUI, Fibre Channel, and Gigabit Ethernet. |
| User I/O Pins | 852 - supports high-pin-count parallel buses, memory interfaces, and multi-standard I/O banks. |
| Block RAM | 852 Kb distributed + 4,176 Kb block (232 × 18 Kb) - enables large on-chip buffering, FIFOs, and memory-mapped peripherals. |
| Digital Clock Managers | 12 × DCM - delivers jitter-tolerant clock synthesis, phase alignment, and deskew across complex synchronous domains. |
| Operating Temperature | –40°C to +100°C (Industrial) - qualified for deployment in base stations, industrial controllers, and avionics edge nodes. |
| Core Voltage | 1.5 V (VCCINT) - defines power delivery requirements and thermal design constraints for system-level integration. |
Pinout & Package
XC2VP50-6FF1517I uses the FF1517 flip-chip fine-pitch BGA package: 40 mm × 40 mm, 1.0 mm pitch, 1517 balls. Pin definitions are documented across 302 pages in DS083 Module 4, with dedicated banks for VCCO, VCCAUX, VRP/VRN reference, configuration (CCLK, DONE, M0–M2, PROG_B), JTAG (TCK/TDI/TDO/TMS), PowerPC debug (JSP/JSC), and RocketIO differential pairs (TXP/TXN, RXP/RXN).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP loading; requires stable 0–100 MHz source. |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream load completion; used for system reset synchronization. |
| M0–M2 | Mode Selection Inputs | Three-pin binary encoding selects configuration mode (e.g., Master Serial = 000, Slave SelectMAP = 010). |
| TCK/TDI/TDO/TMS | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification. |
| TXP/TXN (per channel) | RocketIO Differential Transmitter | Current-mode differential output pair; supports 3.125 Gb/s with programmable swing (200–1600 mVpp) and pre-emphasis. |
| RXP/RXN (per channel) | RocketIO Differential Receiver | Terminated differential input with internal equalization; locks to incoming serial stream without external PLL. |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables asymmetric multiprocessing: one core for control-plane tasks (e.g., protocol stack), second for data-plane offload (e.g., packet classification). |
| 16 RocketIO Transceivers | Supports 16 independent 3.125 Gb/s links - sufficient for 4× XAUI (4-lane), 2× 10GbE, or bonded 40GbE backplane interfaces. |
| SelectIO-Ultra I/O System | Programmable drive strength (2–24 mA), DCI termination, and 32 I/O standards eliminate external resistors and level shifters in mixed-voltage systems. |
| Distributed & Block RAM | 1,378 Kb distributed RAM + 4,176 Kb block RAM enables deep pipeline buffers, coefficient storage for FIR filters, and local memory for PowerPC co-processing. |
| Digital Clock Manager (DCM) | 12 independent DCMs provide deterministic clock domain crossing, dynamic phase adjustment for DDR timing closure, and jitter reduction for transceiver reference clocks. |
| SRAM-Based Configuration | Allows unlimited reprogramming, partial reconfiguration of logic sections, and bitstream encryption via triple-DES for IP protection. |
Applications
| Telecom Line Card | Network Packet Processor |
|---|---|
Use Scenario: High-density OC-48/STM-16 line interface card aggregating 16× Gigabit Ethernet streams into a 10 GbE uplink. IC Role / Device Role / Timing Role: XC2VP50-6FF1517I serves as the central packet switching and framing engine - handling SerDes I/O, HDLC/GFP encapsulation, and traffic shaping in programmable logic while running control-plane software on PowerPC cores. Use Value: Integrated RocketIO transceivers eliminate external PHYs; dual PowerPC cores manage SNMP, CLI, and OAM independently from data-path latency. |
Use Scenario: Deep packet inspection appliance performing real-time regex matching and policy enforcement on 10 GbE traffic. IC Role / Device Role / Timing Role: XC2VP50-6FF1517I implements parallelized finite-state machines in CLBs for pattern matching, uses Block RAM for signature databases, and runs flow management software on PowerPC. Use Value: 53K logic cells enable >1M state transitions/sec; 852 I/Os route multiple 10 GbE lanes and host CPU interface simultaneously. |
| Avionics Data Concentrator | Industrial Video Encoder |
Use Scenario: ARINC 664 (AFDX) end-system consolidating sensor data from 32 LRUs onto a deterministic 100 Mbps switched backbone. IC Role / Device Role / Timing Role: XC2VP50-6FF1517I implements AFDX virtual link scheduling in hardware, manages redundant Ethernet MACs, and hosts DO-254-certifiable firmware on PowerPC. Use Value: Industrial temp rating (–40°C to +100°C) and radiation-tolerant 0.13 µm copper process meet airborne environmental requirements. |
Use Scenario: 4K60 video encoder converting HDMI 2.0 input to compressed JPEG2000 over SFP+ fiber using SMPTE 2082. IC Role / Device Role / Timing Role: XC2VP50-6FF1517I handles pixel-rate video buffering (via Block RAM), performs wavelet transforms in multiplier-rich DSP slices, and drives SFP+ transceivers via RocketIO. Use Value: 738× 18×18 multipliers accelerate JPEG2000 quantization; RocketIO supports direct SFP+ electrical interface without retimer IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integration FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-6FF1152I | Higher density (74,448 logic cells), 20 RocketIO transceivers, but only 644 user I/Os in smaller FF1152 package. | Better suited for transceiver-heavy designs (e.g., 20× 1 GbE) where I/O count is secondary to serial bandwidth. | Select XC2VP70-6FF1152I when RocketIO channel count >16 is required and board space allows FF1152 footprint. |
| XC2VP50-6FF1704I | Same logic and transceiver resources, but 1704-ball FF1704 package offers 1164 user I/Os - 312 more than FF1517. | Preferred for I/O-bound applications like memory-rich video processing or multi-protocol backplanes requiring >1000 pins. | Choose XC2VP50-6FF1704I when maximum I/O expansion is critical and larger PCB area is available. |
Compared with XC2VP50-6FF1517I, XC2VP70-6FF1152I trades I/O count for higher transceiver density and logic capacity, while XC2VP50-6FF1704I retains identical functionality but scales I/O availability - making the FF1517 variant optimal for balanced logic/transceiver/I/O workloads in constrained board space.
Availability
XC2VP50-6FF1517I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and avionics applications requiring stable component supply, long lifecycle support, and industrial-grade reliability.
Supply support for XC2VP50-6FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA architecture with SRAM-based reconfigurable logic, embedded processors, and high-speed transceivers - delivering programmable platforms for aerospace, communications, and industrial markets.
The Virtex-II Pro family, including XC2VP50-6FF1517I, was engineered to unify hard processor subsystems, multi-gigabit serial I/O, and flexible logic in a single die - targeting systems needing both software-defined control and hardware-accelerated data paths.
FAQ
What is the maximum RocketIO transceiver speed supported by XC2VP50-6FF1517I?
The XC2VP50-6FF1517I supports RocketIO transceivers at up to 3.125 Gb/s in full-duplex mode, consistent with its -6 speed grade specification. This rate enables compliance with Gigabit Ethernet, XAUI, and Fibre Channel standards. The device does not support RocketIO X (6.25 Gb/s) transceivers - that capability is exclusive to XC2VPX-series variants.
Does XC2VP50-6FF1517I include PowerPC processor cores?
Yes, XC2VP50-6FF1517I integrates two IBM PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. These cores operate at up to 350 MHz in the -6 speed grade and support embedded Linux, VxWorks, or bare-metal firmware execution alongside FPGA logic.
What I/O standards are supported by XC2VP50-6FF1517I?
XC2VP50-6FF1517I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, LVPECL, ULVDS, LDT). Digitally Controlled Impedance (DCI) provides on-chip termination for single-ended I/Os, and on-chip differential termination is available for LVDS and related standards.
Is XC2VP50-6FF1517I suitable for industrial temperature operation?
Yes, the "I" suffix in XC2VP50-6FF1517I denotes Industrial temperature grade, qualified for continuous operation from –40°C to +100°C. This makes it appropriate for base station radios, factory automation controllers, and other harsh-environment applications where commercial-grade FPGAs would fail.
What configuration modes does XC2VP50-6FF1517I support?
XC2VP50-6FF1517I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration bitstreams can be encrypted using on-chip triple-DES engines, and readback capability allows verification of both configuration memory and register states during debug.
XC2VP50-6FF1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5904
- Number of Logic Elements/Cells:
- 53136
- Total RAM Bits:
- 4276224
- Number of I/O:
- 852
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XC2VP50-6FF1517I FAQ
1.How can I place an order for XC2VP50-6FF1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP50-6FF1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP50-6FF1517I reliable?
The price and inventory of XC2VP50-6FF1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP50-6FF1517I is usually 5 days.
3.What payment methods are accepted for XC2VP50-6FF1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP50-6FF1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP50-6FF1517I?
XC2VP50-6FF1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP50-6FF1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP50-6FF1517I?
For technical support, including XC2VP50-6FF1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP50-6FF1517I requirements.
6.How does Aetrix verify that XC2VP50-6FF1517I is sourced from the original manufacturer or authorized distributors?
All XC2VP50-6FF1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP50-6FF1517I meets industry standards.
7.What is the process for return or replacement of XC2VP50-6FF1517I?
All XC2VP50-6FF1517I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP50-6FF1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP50-6FF1517I part is unused and in its original packaging.
Return procedure for XC2VP50-6FF1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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