AMD XC2VP50-6FFG1152C

Overview

XC2VP50-6FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (MGTs), 53,136 logic cells, and 8 DCM clock management units. It operates at -6 speed grade (350 MHz PowerPC, 3.125 Gb/s MGTs) in an 1152-pin flip-chip fine-pitch BGA package with 1.0 mm pitch, targeting high-bandwidth telecom and networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP50-6FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, verified 16-channel RocketIO transceiver capability at 3.125 Gb/s, validated 852-user-I/O count in FF1152 package, and compatibility with XAUI, Fibre Channel, and Gigabit Ethernet protocols.

Technical Context

This device implements a hardened architecture combining two independent PowerPC 405 cores-each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface-with programmable FPGA fabric containing 23,616 CLB slices, 738 dedicated 18×18 multipliers, and 4,176 Kb of Block SelectRAM+ memory. The RocketIO transceivers are fully integrated SERDES with monolithic CDR, 8/16/32-bit parallel interfaces, and 8B/10B encoding.

DCM modules provide precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting across 16 global clock nets. I/O subsystem supports 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL-with Digitally Controlled Impedance (DCI) termination and DDR register support per IOB.

Key Specifications

Pinout & Package

XC2VP50-6FFG1152C uses the FF1152 flip-chip fine-pitch BGA package: 35 mm × 35 mm body, 1.0 mm ball pitch, 1152 I/O balls. Package supports thermal dissipation for sustained 350 MHz PowerPC operation and high-speed signal integrity for 3.125 Gb/s transceivers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP50-6FFG1152C, XC2VP70-6FF1152C delivers +40% logic resources and +25% transceiver count in identical packaging, while XC4VLX80-11FF1148C trades embedded processors for higher-speed transceivers and modern process efficiency - making it suitable only where software-defined control is handled externally.

Availability

XC2VP50-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, network equipment, medical imaging systems, and defense electronics requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP50-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-on-chip architectures for high-performance digital systems.

The Virtex-II Pro family was designed to integrate hard processor cores and high-speed serial transceivers into FPGA fabric, enabling complete system-level solutions for wired communications and signal processing without discrete components.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-6FFG1152C?

The XC2VP50-6FFG1152C is rated at -6 speed grade, supporting up to 350 MHz for each PowerPC 405 core under commercial temperature conditions. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP50-6FFG1152C datasheet specifies this value in Table 4 of Module 1, confirming sustained operation without derating when voltage and cooling requirements are met.

Does XC2VP50-6FFG1152C support 10 Gigabit Ethernet XAUI interface?

Yes, XC2VP50-6FFG1152C supports XAUI through its RocketIO transceivers: four channels can be configured as a compliant 10 GbE XAUI interface (3.125 Gb/s per lane). The device implements native 8B/10B encoding, channel bonding, and elastic buffers required by XAUI specification. This capability is documented in Module 2 of DS083, confirming XC2VP50-6FFG1152C's use in 10GbE line cards and switches.

How many user I/O pins does XC2VP50-6FFG1152C provide in the FF1152 package?

XC2VP50-6FFG1152C provides 852 user I/O pads in the FF1152 flip-chip BGA package, as specified in Table 3 of DS083. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, etc.), VBATT, and RocketIO transceiver pins. The FF1152 package enables high I/O density while maintaining signal integrity for 3.125 Gb/s serial links.

Is XC2VP50-6FFG1152C pin-compatible with other Virtex-II Pro devices in FF1152 package?

No, XC2VP50-6FFG1152C is not pin-compatible with other Virtex-II Pro devices in the FF1152 package. While physical package dimensions and ball pitch match, I/O assignment, transceiver pinout, and power/ground ball mapping differ across device densities. Table 3 in DS083 shows distinct I/O counts and transceiver allocations - e.g., XC2VP40-FF1152 offers 804 I/Os with zero bonded-out RocketIO, whereas XC2VP50-6FFG1152C has 852 I/Os and 16 transceivers.

What configuration modes are supported by XC2VP50-6FFG1152C?

XC2VP50-6FFG1152C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. These are selected via M0–M2 pins and enable flexible integration with microcontrollers, flash memory, or JTAG programmers. Configuration details, including timing parameters and pin behavior, are fully specified in Module 1 and Module 3 of DS083 for the XC2VP50-6FFG1152C.