AMD XC2VP50-6FFG1152I

Overview

XC2VP50-6FFG1152I from Xilinx is a Virtex-II Pro Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom, networking, and video processing systems requiring integrated processing, serial connectivity, and reconfigurable logic.

For engineers reviewing the XC2VP50-6FFG1152I datasheet, pinout, applications, or equivalent options, this device delivers verified dual-processor execution at 350 MHz, 18×18-bit dedicated multipliers, on-chip digitally controlled impedance (DCI), and DCM-based clock management - all validated for industrial temperature operation (-40°C to +100°C) under speed grade -6.

Technical Context

The XC2VP50-6FFG1152I implements a hardened architecture combining SRAM-based FPGA fabric with two IBM PowerPC 405 cores and up to 16 RocketIO transceivers. Its DCM modules provide precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting - critical for synchronous multi-domain designs.

Each RocketIO channel supports full-duplex operation at 3.125 Gb/s with 8B/10B encoding, programmable pre-emphasis, on-chip 50Ω termination, and per-channel internal loopback. The IOBs support 22 single-ended and 10 differential I/O standards including LVDS, SSTL, and HSTL, with DCI enabling automatic on-die termination calibration.

Key Specifications

Pinout & Package

XC2VP50-6FFG1152I is housed in a 1152-ball flip-chip fine-pitch BGA (FFG1152) with 1.0 mm pitch, optimized for thermal performance and signal integrity in high-density PCB layouts. The package supports industrial temperature range (-40°C to +100°C) and includes dedicated configuration, JTAG, power, and ground balls alongside configurable I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system-on-chip applications.

Compared with XC2VP50-6FFG1152I, XC2VP70-6FF1152I offers higher transceiver count and logic capacity in identical packaging - ideal for scalability - while XC3S1600E-4FGG456C lacks processor and high-speed serial capability entirely, limiting it to basic logic replacement roles.

Availability

XC2VP50-6FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP50-6FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic and introduced the first FPGA in 1985. The company specializes in adaptive computing platforms for aerospace, defense, communications, and data center markets.

The Virtex-II Pro family was designed to integrate embedded processors and high-speed serial transceivers into a single reconfigurable platform - targeting systems demanding both software programmability and hardware acceleration.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-6FFG1152I?

The XC2VP50-6FFG1152I supports PowerPC 405 core operation at up to 350 MHz under speed grade -6 and industrial temperature conditions. This rating is confirmed in DS083 Table 4 and requires adherence to voltage and cooling specifications outlined in the DC characteristics module. The XC2VP50-6FFG1152I achieves this performance using its dedicated 1.5 V VCCINT supply and on-chip clock management circuitry.

Does XC2VP50-6FFG1152I support partial reconfiguration?

Yes, XC2VP50-6FFG1152I supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. This allows dynamic modification of specific logic regions without disrupting active functions - a capability documented in Module 1 of DS083 and enabled by Xilinx's early-generation partial reconfiguration tools. The XC2VP50-6FFG1152I retains full functionality during partial bitstream loads.

What I/O standards are supported by XC2VP50-6FFG1152I with on-chip termination?

XC2VP50-6FFG1152I supports on-chip termination for 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL) via its XCITE Digitally Controlled Impedance (DCI) feature. Termination values are auto-calibrated to match PCB trace impedance - eliminating external resistors for these standards.

Is XC2VP50-6FFG1152I pin-compatible with other Virtex-II Pro devices in the FF1152 package?

No, XC2VP50-6FFG1152I is not pin-compatible with other Virtex-II Pro devices in the FF1152 package. While the FF1152 footprint is shared across several members (e.g., XC2VP40, XC2VP70), ball assignments differ significantly due to varying RocketIO transceiver counts, I/O bank configurations, and power rail allocations. Pin compatibility is not guaranteed - each device requires its own layout.

What configuration modes does XC2VP50-6FFG1152I support?

XC2VP50-6FFG1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. These are selected via M0–M2 pins at power-up and enable flexible programming options - from SPI flash-based boot to JTAG-based debug and field updates. All modes are fully documented in Module 1 of DS083.