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AMD XC2VP50-7FF1152C
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- Part No.:
- XC2VP50-7FF1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP50-7FF1152C.pdf
- Description:
- IC FPGA 692 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,549
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Product details
Overview
XC2VP50-7FF1152C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an FF1152 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network line cards, and video processing systems.
For engineers reviewing the XC2VP50-7FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, verified 3.125 Gb/s RocketIO transceiver performance in FF1152 packaging, DCM-based clock management with ±150 ps phase shift resolution, and compatibility with PCI-X, LVDS, and DDR I/O standards.
Technical Context
The XC2VP50-7FF1152C implements two independent PowerPC 405 cores running at up to 400 MHz (–7 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its 16 RocketIO transceivers support full-duplex operation at 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.
FPGA fabric includes 23,616 CLB slices, 232 dedicated 18×18 multipliers, 4,176 Kb block SelectRAM+ (18 Kb × 232), and twelve Digital Clock Managers (DCMs) enabling precise deskew, multiplication/division, and fine-grained phase shifting (1/256 period increments). Routing uses Active Interconnect Technology with hierarchical segmented resources and predictable delay independent of fanout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 53,136 - total configurable logic capacity for complex digital functions |
| PowerPC Blocks | 2 × PPC405 - embedded 32-bit RISC processors with cache, MMU, and OCM interface |
| RocketIO Transceivers | 16 × 3.125 Gb/s - full-duplex SERDES with 8B/10B, channel bonding, and on-chip 50 Ω termination |
| User I/O Pads | 852 - supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and PCI-X standards |
| Digital Clock Managers | 12 × DCM - provides clock deskew, frequency synthesis, and ±150 ps phase shift resolution |
| Block RAM | 4,176 Kb (232 × 18 Kb) - true dual-port memory for buffering, FIFOs, and lookup tables |
| Multipliers | 232 × 18×18 - hardwired signed arithmetic units for DSP filtering and math-intensive tasks |
Pinout & Package
XC2VP50-7FF1152C is housed in a 1152-pin flip-chip fine-pitch BGA (FF1152) package with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and power dissipation in telecom and networking applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master serial or SelectMAP mode; requires external 50 MHz source |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading; must be pulled up externally |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up; latched on PROG_B assertion |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS or LVPECL reference clocks for DCMs and RocketIO CDR circuits |
| GTxP/GTxN | RocketIO Transmitter Differential Pair | High-speed serial output (3.125 Gb/s) with programmable swing (200–1600 mVpp) and pre-emphasis |
| GRxP/GRxN | RocketIO Receiver Differential Pair | High-speed serial input with programmable equalization, internal AC coupling, and 50 Ω on-chip termination |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables symmetric multiprocessing or asymmetric task partitioning with shared memory via CoreConnect bus |
| 16 RocketIO Transceivers | Provides 50 Gb/s aggregate full-duplex bandwidth for XAUI, Fibre Channel, and InfiniBand interconnects |
| Digitally Controlled Impedance (DCI) | Automatically matches on-die termination to trace impedance without external resistors, reducing BOM and layout complexity |
| SelectIO-Ultra I/O Architecture | Supports 22 single-ended and 10 differential standards including 840 Mb/s LVDS and DDR register interfaces |
| Twelve DCMs | Delivers jitter-free clock distribution with sub-cycle phase alignment across multiple clock domains |
Applications
| Telecom Backplane Interface | Network Line Card Processing |
|---|---|
Use Scenario: High-bandwidth interconnection between line cards and switch fabric in carrier-grade routers. IC Role / Device Role / Timing Role: XC2VP50-7FF1152C serves as protocol-agnostic SERDES bridge with embedded PowerPC handling control-plane traffic and FPGA fabric implementing packet classification and buffering. Use Value: 16 RocketIO channels enable 50 Gb/s raw throughput while DCMs synchronize timing across distributed clock domains with <±150 ps skew. | Use Scenario: Multi-protocol packet forwarding engine supporting Gigabit Ethernet, SONET/SDH, and ATM interfaces. IC Role / Device Role / Timing Role: XC2VP50-7FF1152C integrates dual PowerPC cores for routing table management and FPGA fabric for header parsing, CRC checking, and queue management. Use Value: 852 I/Os allow simultaneous connection to multiple PHYs and memory controllers; SelectIO-Ultra supports 840 Mb/s LVDS for high-speed parallel bus interfaces. |
| Video Processing Accelerator | Industrial Embedded Control System |
Use Scenario: Real-time HD video encoding/decoding pipeline with frame buffering and motion estimation. IC Role / Device Role / Timing Role: XC2VP50-7FF1152C uses FPGA fabric for pixel-level operations and PowerPC cores for host interface, compression control, and system management. Use Value: 4,176 Kb block RAM enables dual-frame buffers; 232 multipliers accelerate DCT and quantization in MPEG-4/H.264 pipelines. | Use Scenario: Deterministic real-time control unit for factory automation with fieldbus co-processing and safety monitoring. IC Role / Device Role / Timing Role: XC2VP50-7FF1152C runs deterministic RTOS on PowerPC while FPGA fabric implements custom I/O expansion, PWM generation, and encoder interpolation. Use Value: Twelve DCMs provide independent, jitter-controlled clocks for servo loops, communication interfaces, and ADC sampling-ensuring sub-microsecond timing precision. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-7FF1152C | Higher density: 74,448 logic cells, 20 RocketIO transceivers, same FF1152 package | Supports higher-bandwidth protocols like 10G Fibre Channel and OC-192; suitable for next-generation line cards | Select when >16 transceivers or >53K logic cells are required; shares identical pinout and power delivery |
| XC2VP50-6FF1152I | Same logic and transceiver count but –6 speed grade (350 MHz PowerPC, 2.5 Gb/s RocketIO) and Industrial temperature range (–40°C to +100°C) | Validated for extended temperature environments such as base station outdoor units and rail signaling systems | Choose for industrial reliability where commercial-grade –7 speed is insufficient; requires timing closure at reduced frequencies |
Compared with XC2VP50-7FF1152C, XC2VP70-7FF1152C offers greater transceiver count and logic capacity for scalability, while XC2VP50-6FF1152I trades speed for extended temperature operation-enabling deployment in harsh environments without PCB redesign.
Availability
XC2VP50-7FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, network equipment, and video processing systems requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP50-7FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.
The Virtex-II Pro family was designed to integrate embedded processors and high-speed serial I/O into a single programmable platform, targeting applications demanding both software flexibility and hardware acceleration-especially in communications and signal processing.
FAQ
What is the maximum RocketIO transceiver speed supported by XC2VP50-7FF1152C?
The XC2VP50-7FF1152C supports RocketIO transceivers operating at up to 3.125 Gb/s in full-duplex mode. This speed is guaranteed for the –7 speed grade under commercial temperature conditions (0°C to 85°C) and applies to all 16 transceivers in the FF1152 package configuration. The device does not support RocketIO X (6.25 Gb/s) functionality.
Does XC2VP50-7FF1152C include embedded processor cores?
Yes, XC2VP50-7FF1152C integrates two IBM PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. These cores operate at up to 400 MHz in the –7 speed grade and are fully compliant with the PowerPC User Instruction Set Architecture (UISA).
What I/O standards are supported by XC2VP50-7FF1152C?
XC2VP50-7FF1152C supports 22 single-ended standards-including LVCMOS (1.5V/1.8V/2.5V/3.3V), LVTTL, PCI, PCI-X, HSTL, and SSTL-and 10 differential standards such as LVDS, BLVDS, ULVDS, LVPECL, and HyperTransport. Digitally Controlled Impedance (DCI) provides automatic on-die termination for single-ended I/Os.
Is XC2VP50-7FF1152C pin-compatible with other Virtex-II Pro devices in FF1152 packaging?
No, XC2VP50-7FF1152C is not fully pin-compatible with other Virtex-II Pro devices in the FF1152 package. While the physical footprint and power/ground pin locations are consistent, I/O bank assignments, transceiver pinouts, and configuration pin mappings differ across device densities and transceiver counts-even within the same package.
What clock management resources are available in XC2VP50-7FF1152C?
XC2VP50-7FF1152C includes twelve Digital Clock Manager (DCM) modules and sixteen global clock multiplexer buffers. Each DCM provides deskew, frequency synthesis (integer/fractional multiplication/division), and fine-grained phase shifting (1/256 period resolution), enabling precise timing control across multiple synchronous domains within the XC2VP50-7FF1152C design.
XC2VP50-7FF1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5904
- Number of Logic Elements/Cells:
- 53136
- Total RAM Bits:
- 4276224
- Number of I/O:
- 692
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP50-7FF1152C FAQ
1.How can I place an order for XC2VP50-7FF1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP50-7FF1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP50-7FF1152C reliable?
The price and inventory of XC2VP50-7FF1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP50-7FF1152C is usually 5 days.
3.What payment methods are accepted for XC2VP50-7FF1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP50-7FF1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP50-7FF1152C?
XC2VP50-7FF1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP50-7FF1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP50-7FF1152C?
For technical support, including XC2VP50-7FF1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP50-7FF1152C requirements.
6.How does Aetrix verify that XC2VP50-7FF1152C is sourced from the original manufacturer or authorized distributors?
All XC2VP50-7FF1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP50-7FF1152C meets industry standards.
7.What is the process for return or replacement of XC2VP50-7FF1152C?
All XC2VP50-7FF1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP50-7FF1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP50-7FF1152C part is unused and in its original packaging.
Return procedure for XC2VP50-7FF1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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