AMD XC2VP50-7FFG1152C

Overview

XC2VP50-7FFG1152C from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 852 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It delivers high-speed serial interconnect, embedded processing, and configurable logic for telecom backplane, wireless baseband, and high-performance DSP systems.

For engineers reviewing the XC2VP50-7FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO channel count (16), -7 speed grade timing (400 MHz PowerPC, 3.125 Gb/s transceivers), FF1152 package I/O mapping, DCM-based clock management, and SelectIO-Ultra I/O standard support including LVDS and DCI termination.

Technical Context

The XC2VP50-7FFG1152C integrates two independent PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded control alongside programmable logic. Its 16 RocketIO transceivers implement full-duplex SERDES with monolithic CDR, 8B/10B encoding, and per-channel loopback for protocol-agnostic high-speed links.

Configurable logic resources include 23,616 CLB slices, 738 dedicated 18×18 multipliers, and 4,176 Kb of Block SelectRAM+ memory organized as 232 × 18-Kb blocks. Clocking uses up to twelve Digital Clock Managers (DCMs) for phase shifting, frequency synthesis, and deskew - all routed via 16 global clock lines and active interconnect architecture.

Key Specifications

Pinout & Package

XC2VP50-7FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) package with 1.0 mm pitch, optimized for thermal dissipation and signal integrity in high-density PCB layouts. The package supports 852 user I/Os plus dedicated configuration, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP50-7FFG1152C, XC2VP70-7FF1152C provides headroom in logic and transceiver count within identical mechanical and thermal constraints, while XC5VLX110-2FF1136C represents a generational upgrade with improved power efficiency and higher-speed transceivers - but demands full hardware and toolchain requalification.

Availability

XC2VP50-7FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar subsystems, and medical imaging equipment requiring stable component supply and long-lifecycle support.

Supply support for XC2VP50-7FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference platforms.

The Virtex-II Pro family, including XC2VP50-7FFG1152C, was engineered for high-bandwidth, compute-intensive embedded systems integrating hard processor cores, multi-gigabit serial I/O, and configurable logic on a single die - targeting telecom, aerospace, and scientific instrumentation markets.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP50-7FFG1152C?

The XC2VP50-7FFG1152C supports RocketIO transceivers operating at up to 3.125 Gb/s per channel in full-duplex mode. This is guaranteed under the -7 speed grade at commercial temperature conditions and aligns with Fibre Channel, Gigabit Ethernet, and XAUI protocol requirements. The device does not include RocketIO X transceivers, which are limited to XC2VPX-series variants.

Does XC2VP50-7FFG1152C include embedded processor cores?

Yes, XC2VP50-7FFG1152C integrates two IBM PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. These cores operate at up to 400 MHz in the -7 speed grade and are fully functional without external microprocessors, enabling tightly coupled software-defined hardware acceleration.

What package type and pin count does XC2VP50-7FFG1152C use?

XC2VP50-7FFG1152C uses the FF1152 flip-chip fine-pitch BGA package with 1152 balls and 1.0 mm pitch. It provides 852 user I/Os, plus dedicated configuration, JTAG, clock, and power pins. This package is optimized for thermal performance and high-speed signal integrity in dense PCB layouts.

Can XC2VP50-7FFG1152C be configured via JTAG boundary scan?

Yes, XC2VP50-7FFG1152C fully supports IEEE 1149.1 boundary-scan testing and configuration through its TCK, TMS, TDI, and TDO pins. It also supports IEEE 1532 configuration and includes built-in DES encryption for secure bitstream loading - enabling both debug access and production programming via standard JTAG interfaces.

What I/O standards are supported by XC2VP50-7FFG1152C's SelectIO-Ultra blocks?

XC2VP50-7FFG1152C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Its XCITE Digitally Controlled Impedance (DCI) feature enables automatic on-chip termination for single-ended I/Os without external resistors.