AMD XC2VP50-7FFG1517C

Overview

XC2VP50-7FFG1517C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, up to 16 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 53,136 logic cells, and 8 DCM clock management units. It implements SRAM-based in-system configuration with 1.5 V core voltage and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL for telecom, networking, and video processing systems.

For engineers reviewing the XC2VP50-7FFG1517C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, verified 16-channel RocketIO transceiver count in FF1517 package, validated -7 speed grade timing (400 MHz PowerPC, 3.125 Gb/s transceivers), and exact FF1517 flip-chip BGA mechanical compatibility.

Technical Context

This device uses a 0.13 µm nine-layer copper process with active interconnect routing, enabling predictable high-speed signal integrity independent of fanout. Its architecture integrates hardened PowerPC 405 cores with MMU, 16 KB instruction/data caches, and dedicated OCM interfaces alongside programmable FPGA fabric featuring 18×18 multipliers and Block SelectRAM+ memory.

The XC2VP50-7FFG1517C implements monolithic clock synthesis and recovery (CDR) per RocketIO channel, supports 8/16/32-bit parallel FPGA interface widths, and includes on-chip 50 Ω termination for differential signaling standards. It delivers full-duplex serial data rates up to 3.125 Gb/s per transceiver channel with programmable pre-emphasis and receiver equalization.

Key Specifications

Pinout & Package

XC2VP50-7FFG1517C is housed in a 1517-ball flip-chip fine-pitch BGA (FFG1517) package with 1.0 mm ball pitch and 40 mm × 40 mm body size. This package supports high I/O count, low-inductance power delivery, and superior thermal dissipation compared to wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP50-7FFG1517C, XC2VP70-7FF1152C offers greater transceiver and logic scalability in a smaller package but reduces I/O availability, while XC2VP50-6FF1517C maintains identical form factor and feature set at reduced speed-enabling drop-in qualification for less demanding environments.

Availability

XC2VP50-7FFG1517C is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and high-end video processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC2VP50-7FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level integration.

The Virtex-II Pro product line was designed to unify programmable logic with embedded processors and high-speed serial I/O-targeting applications where ASIC-level performance meets FPGA flexibility in networking, aerospace, and broadcast equipment.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP50-7FFG1517C?

The XC2VP50-7FFG1517C supports 400 MHz operation for both PowerPC 405 cores under commercial temperature conditions (-7 speed grade). This is confirmed in Table 4 of DS083 (v5.0), which specifies 400 MHz for -7 grade devices. The XC2VP50-7FFG1517C achieves this performance using its 1.5 V VCCINT supply and requires adherence to XAPP755 guidelines when implementing dual-processor clocking above 350 MHz.

Does XC2VP50-7FFG1517C include on-chip termination for differential I/O standards?

Yes, XC2VP50-7FFG1517C provides on-chip differential termination for LVDS, Extended LVDS, ULVDS, and LDT standards. As documented in Module 1 of DS083, each differential pair uses two adjacent pads and supports internal 50 Ω or 75 Ω termination, eliminating the need for external resistors and improving signal integrity in high-speed layouts.

How many RocketIO transceivers are implemented in XC2VP50-7FFG1517C, and what is their maximum data rate?

The XC2VP50-7FFG1517C implements 16 RocketIO transceivers, as specified in Table 1 of DS083. In the FF1517 flip-chip package, these operate at up to 3.125 Gb/s per channel in full-duplex mode. This is confirmed in Table 4, which lists 3.125 Gb/s for RocketIO transceivers in -7 grade flip-chip devices.

Is XC2VP50-7FFG1517C compatible with boundary-scan testing per IEEE 1149.1?

Yes, XC2VP50-7FFG1517C fully complies with IEEE 1149.1 and supports boundary-scan testing via its dedicated TAP controller. The device implements EXTEST, INTEST, and HIGHZ instructions, and supports BYPASS, PRELOAD, SAMPLE, IDCODE, and USERCODE non-test instructions as defined in Module 1 of DS083.

What configuration modes does XC2VP50-7FFG1517C support?

XC2VP50-7FFG1517C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). These are detailed in the Configuration section of Module 1, and all modes use the dedicated CCLK, DONE, M0–M2, PROG_B, and JTAG pins referenced in the Pin Definitions chapter.