AMD XC2VP70-5FF1517C

Overview

XC2VP70-5FF1517C from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom, networking, and video processing systems requiring integrated processing, serial connectivity, and programmable logic.

For engineers reviewing the XC2VP70-5FF1517C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed 4.25 Gb/s RocketIO X transceiver performance, dual PowerPC 405 core timing at 300 MHz (–5 speed grade), FF1517 package I/O count and thermal profile, and compatibility with Xilinx ISE 12.4+ toolchain for partial reconfiguration and ChipScope integration.

Technical Context

The XC2VP70-5FF1517C implements a hardened architecture combining SRAM-based FPGA fabric with monolithic embedded blocks: each RocketIO X transceiver integrates serializer/deserializer, clock data recovery (CDR), 64B/66B encoding, and programmable pre-emphasis (0–500%) and differential swing (200–1600 mV_pp). The dual PowerPC 405 cores operate at 300 MHz (–5 grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface.

FPGA resources include 328 18 Kb Block SelectRAM+ modules (max 996 Kb block RAM), 1,034 dedicated 18×18 multipliers, twelve Digital Clock Managers (DCMs) supporting phase shifting in 1/256-clock increments, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and DCI-terminated single-ended standards - all on a 0.13 µm nine-layer copper process with 1.5 V core, 2.5 V auxiliary, and programmable 1.5–3.3 V I/O supplies.

Key Specifications

Pinout & Package

XC2VP70-5FF1517C uses the FF1517 flip-chip fine-pitch BGA package: 40 mm × 40 mm body, 1.0 mm ball pitch, 1517 I/O balls (including power, ground, configuration, and transceiver pins). Thermal characteristics support industrial temperature operation (0°C to 85°C) with recommended PCB stack-up and thermal vias under the die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-5FF1517C, the –6 variant trades higher static power for improved processor clock margin, while the FF1704 variant trades board area and cost for I/O scalability - neither offers functional or transceiver capability upgrades, making XC2VP70-5FF1517C the most balanced choice for mainstream 10G+ embedded systems.

Availability

XC2VP70-5FF1517C is available at Aetrix Electronics and suitable for telecom infrastructure, network equipment, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP70-5FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed specifically for high-performance embedded systems integrating processor, serial I/O, and programmable logic - targeting applications where ASIC development cost and time-to-market are prohibitive.

FAQ

What is the maximum guaranteed RocketIO X transceiver data rate for XC2VP70-5FF1517C?

The XC2VP70-5FF1517C is specified for RocketIO X transceivers operating at a fixed 4.25 Gb/s baud rate, as confirmed in Table 4 of DS083 (v5.0). This rate applies across commercial temperature range (0°C to 85°C) and is not adjustable - unlike XC2VPX20 devices, which support variable-rate operation. The XC2VP70-5FF1517C does not support 6.25 Gb/s modes.

Does XC2VP70-5FF1517C support partial reconfiguration, and what toolchain versions enable it?

Yes, XC2VP70-5FF1517C supports partial reconfiguration through Xilinx ISE Design Suite 12.4 and later. Implementation requires modular design partitioning, use of the PlanAhead tool for floorplanning, and generation of incremental bitstreams targeting specific reconfigurable regions. The feature relies on the device's SRAM-based configuration memory and is validated for runtime logic swaps without disrupting PowerPC core operation or active RocketIO links.

What are the power supply requirements for XC2VP70-5FF1517C's transceiver banks?

XC2VP70-5FF1517C requires VCCAUX = 2.5 V ±3% for RocketIO X PLLs and clock circuitry, and VCCO_MGT = 2.5 V for transceiver I/O banks. These supplies must be independently regulated from the 1.5 V VCCINT core supply and the 1.5–3.3 V user I/O banks. Decoupling must meet Xilinx's layout guidelines: ≥10 µF bulk capacitance per supply plane plus ≥100 nF ceramic caps within 10 mm of each power ball.

Can XC2VP70-5FF1517C implement PCI Express endpoints, and which generation is supported?

No, XC2VP70-5FF1517C does not support PCI Express. While its RocketIO transceivers are compatible with XAUI and Fibre Channel protocols, PCI Express Gen1 (2.5 Gb/s) compliance requires specific protocol logic, transaction layer, and link training state machines not present in the Virtex-II Pro architecture. Xilinx introduced native PCIe support starting with Virtex-4 FX devices - XC2VP70-5FF1517C lacks the required hard IP blocks and certified PHY characterization.

Is XC2VP70-5FF1517C still recommended for new designs, and what is its obsolescence status?

No - XC2VP70-5FF1517C is marked "Product Not Recommended For New Designs" per DS083 (v5.0) revision history. Xilinx discontinued Virtex-II Pro production in 2011; the device remains available through authorized distributors and Aetrix Electronics' legacy inventory, with full technical documentation and ISE 12.4 toolchain support. Long-term supply is managed via controlled allocation and lifecycle coordination.