AMD XC2VP70-5FF1517I

Overview

XC2VP70-5FF1517I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It serves as a system-on-chip solution for telecom line cards, high-speed packet processors, and embedded radar signal processing.

For engineers reviewing the XC2VP70-5FF1517I datasheet, pinout, applications, or equivalent options, key selection criteria include verified 4.25 Gb/s RocketIO X transceiver performance, dual PowerPC 405 core timing compliance at -5 speed grade, DCI-enabled SelectIO-Ultra I/O support across 22 single-ended and 10 differential standards, and FF1517 package thermal/mechanical validation for industrial temperature operation.

Technical Context

The XC2VP70-5FF1517I implements a hardened dual-core PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - all running synchronously with the FPGA fabric at 300 MHz under Industrial (-40°C to +100°C) conditions. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s, supporting 64B/66B encoding, programmable pre-emphasis (0–500%), and on-chip 50 Ω termination.

Fabric-level resources include 328 18×18-bit signed multipliers, 328 Block SelectRAM+ modules (each 18 Kb true dual-port RAM), twelve Digital Clock Managers (DCMs) with ±1/256-cycle phase resolution, and Active Interconnect routing with 24 long lines per row/column. All I/Os feature Digitally Controlled Impedance (DCI) for automatic on-die termination matching.

Key Specifications

Pinout & Package

XC2VP70-5FF1517I uses the FF1517 flip-chip fine-pitch BGA package: 40 mm × 40 mm, 1.0 mm pitch, 1517 balls, RoHS-compliant, rated for Industrial temperature range (−40°C to +100°C). Thermal pad (center ground array) and dedicated VCCINT/VCCAUX/VCCO power rings ensure stable operation under sustained 300 MHz CPU and 4.25 Gb/s transceiver loads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-6FF1517I, the -5FF1517I offers guaranteed Industrial temperature operation and fixed 4.25 Gb/s RocketIO X compliance, while XC4VLX100-11FF1513C provides modern process benefits and extended availability but lacks hard PowerPC cores and requires architectural redesign.

Availability

XC2VP70-5FF1517I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and industrial imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2VP70-5FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a global leader in adaptive computing, acquired by AMD in 2022. It pioneered FPGA technology and defined the platform FPGA category with integrated processors and high-speed transceivers.

The Virtex-II Pro family was designed specifically for high-performance embedded systems requiring tightly coupled hardware/software co-design - enabling single-chip solutions for networking, wireless infrastructure, and real-time signal processing.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP70-5FF1517I?

The XC2VP70-5FF1517I is rated for 300 MHz PowerPC 405 operation under Industrial temperature conditions (−40°C to +100°C) per DS083 v5.0 Table 4. This is the maximum frequency validated across voltage and process corners for the -5 speed grade. Higher frequencies require derating or use of the -6 speed grade variant, which is not Industrial qualified.

Does XC2VP70-5FF1517I support 10 Gigabit Ethernet MAC functionality?

Yes, XC2VP70-5FF1517I supports 10GbE MAC implementation via its 20 RocketIO X transceivers operating at 4.25 Gb/s and integrated 64B/66B encoding blocks. The dual PowerPC 405 cores can run TCP/IP stack firmware, while the FPGA fabric implements XAUI interface logic and flow control - all without external components.

What I/O standards are supported by XC2VP70-5FF1517I with on-chip termination?

XC2VP70-5FF1517I supports on-chip Digitally Controlled Impedance (DCI) termination for all 22 single-ended I/O standards (including LVCMOS 1.5/1.8/2.5/3.3 V, SSTL, HSTL) and on-chip differential termination for LVDS, BLVDS, ULVDS, and LDT. Termination values are auto-calibrated to match PCB trace impedance.

Is XC2VP70-5FF1517I pin-compatible with other Virtex-II Pro devices in FF1517 packaging?

No - XC2VP70-5FF1517I is not pin-compatible with other Virtex-II Pro devices in FF1517 packages. While the FF1517 mechanical footprint is shared, ball function mapping (e.g., transceiver pins, I/O bank assignments, power/ground distribution) differs across device densities. Pinout validation must be performed per DS083 Module 4.

What configuration modes does XC2VP70-5FF1517I support?

XC2VP70-5FF1517I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 JTAG Boundary-Scan. Configuration bitstreams may be encrypted using on-chip DES/3DES engines, and readback is supported for verification and debugging of XC2VP70-5FF1517I configuration state.