AMD XC2VP70-5FF1704C

Overview

XC2VP70-5FF1704C from Xilinx is a high-density Virtex-II Pro X platform FPGA integrating two PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in an FF1704 flip-chip BGA package. It targets high-throughput telecom backplane interconnects, 10G Ethernet line cards, and embedded DSP-accelerated processing systems.

For engineers reviewing the XC2VP70-5FF1704C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO X transceiver count (20), fixed 4.25 Gb/s per-channel rate, dual PowerPC 405 core support, DCM-based clock management, and FF1704 package I/O mapping with 1.0 mm pitch.

Technical Context

The XC2VP70-5FF1704C implements a hardened architecture combining FPGA fabric with embedded processor subsystems and serial transceivers. Its RocketIO X transceivers are fixed-rate at 4.25 Gb/s (not variable-speed), lack 64B/66B encoding support (confirmed only for XC2VPX20/XC2VPX70 per DS083 Table 4 and Module 2), and provide monolithic CDR with on-chip 50 Ω termination.

Each PowerPC 405 core operates up to 300 MHz at -5 speed grade, includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface - all verified in DS083 Module 2 and Table 4. The FPGA fabric delivers 74,448 logic cells, 328 18×18 multipliers, and 5,904 Kb block RAM, with DCI-enabled SelectIO-Ultra I/O supporting LVDS, SSTL, and HSTL standards.

Key Specifications

Pinout & Package

XC2VP70-5FF1704C is housed in a 42.5 mm × 42.5 mm FF1704 flip-chip fine-pitch BGA package with 1.0 mm ball pitch, supporting 996 user I/Os plus dedicated power, configuration, and transceiver pins. Pin definitions and full pinout tables are documented across 302 pages in DS083 Module 4, specifically under "FF1704 Flip-Chip Fine-Pitch BGA Package".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processors and high-speed transceivers applications.

Compared with XC2VP70-5FF1704C, the XC2VP70-6FF1704C trades transceiver compliance for higher CPU frequency, while XC2VPX70-5FF1704C offers identical electrical behavior but divergent documentation emphasis on encoding flexibility - neither provides pin-compatible upgrade paths without revalidation of transceiver link training and clock domain crossing logic.

Availability

XC2VP70-5FF1704C is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP70-5FF1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms since 1984.

The Virtex-II Pro X family was designed for high-bandwidth, compute-intensive embedded systems requiring integrated processing, high-speed serial I/O, and reconfigurable logic - targeting telecom, aerospace, and scientific instrumentation markets.

FAQ

What is the maximum RocketIO X transceiver data rate supported by XC2VP70-5FF1704C?

The XC2VP70-5FF1704C supports a fixed RocketIO X transceiver data rate of 4.25 Gb/s per channel, as confirmed in DS083 Table 4 and Module 2. It does not support variable-rate operation or the 6.25 Gb/s mode found in XC2VPX20 devices. This rate aligns with OC-48/STM-16 and 10G Fibre Channel standards.

Does XC2VP70-5FF1704C include PowerPC processor cores, and what is their maximum operating frequency?

Yes, XC2VP70-5FF1704C integrates two PowerPC 405 RISC processor cores. At the -5 speed grade, each core operates up to 300 MHz, as specified in DS083 Table 4. Both cores include 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside FPGA logic.

What package type and I/O count does XC2VP70-5FF1704C use?

XC2VP70-5FF1704C uses the FF1704 flip-chip fine-pitch BGA package (42.5 mm × 42.5 mm, 1.0 mm pitch) with 996 user I/O pads. This count excludes 15 dedicated configuration pins (e.g., CCLK, DONE, M0–M2), VBATT, and RocketIO X transceiver differential pairs, as defined in DS083 Table 3.

Is XC2VP70-5FF1704C compatible with 64B/66B encoding protocols like 10GBASE-R?

No, XC2VP70-5FF1704C does not support 64B/66B encoding. DS083 explicitly limits this feature to XC2VPX20 and XC2VPX70 devices. The XC2VP70-5FF1704C implements only 8B/10B encoding in its RocketIO X transceivers, making it suitable for Fibre Channel and XAUI but not native 10GBASE-R PHY layers.

What clock management resources are available in XC2VP70-5FF1704C?

XC2VP70-5FF1704C includes 12 Digital Clock Manager (DCM) modules, each capable of precise deskew, integer/fractional frequency synthesis, and coarse/fine phase shifting (down to 1/256 clock period). These DCMs feed 16 global clock multiplexer buffers, supporting multi-domain timing architectures with sub-nanosecond skew control.