AMD XC2VP70-5FF1704I

Overview

XC2VP70-5FF1704I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interconnect and embedded signal processing systems requiring deterministic real-time control and serial data aggregation.

For engineers reviewing the XC2VP70-5FF1704I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, confirmed transceiver performance, validated I/O count and package mapping, and real-world deployment context for legacy system sustainment and industrial requalification.

Technical Context

The XC2VP70-5FF1704I implements a dual-processor SoC-FPGA architecture with two independent PowerPC 405 cores-each featuring 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface-operating at 300 MHz under Industrial (-I) speed grade. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s, supporting 64B/66B encoding, programmable pre-emphasis (0–500%), and on-chip 50 Ω termination.

FPGA fabric includes 328 18 Kb Block SelectRAM+ modules (totaling 5,904 Kb), 1,034 dedicated 18×18 multipliers, twelve Digital Clock Managers (DCMs) with fine-grained phase shifting (1/256 period resolution), and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X at up to 840 Mb/s. All resources are interconnected via Active Interconnect routing with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP70-5FF1704I is housed in the FF1704 flip-chip fine-pitch BGA package: 42.5 mm × 42.5 mm, 1.0 mm ball pitch, 1704 I/O balls. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG boundary-scan (TCK/TDI/TDO/TMS), power domains (VCCINT = 1.5 V, VCCAUX = 2.5 V, VCCO = configurable), 20 RocketIO X transceiver banks (each with TXP/TXN/RXP/RXN, REFCLKP/REFCLKN), and 996 user-configurable I/O banks supporting SelectIO-Ultra standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processors and high-speed transceivers applications.

Compared with XC2VP70-5FF1704I, the -6FF1704I trades transceiver speed and CPU frequency for broader commercial temperature range availability, while the XC4VLX100-11FF1513C abandons embedded processors entirely to maximize fabric scalability and transceiver count-making it appropriate only for architectures decoupling control and datapath functions.

Availability

XC2VP70-5FF1704I is available at Aetrix Electronics and suitable for telecom infrastructure spares, military avionics sustainment, and industrial video equipment requalification requiring stable component supply under extended lifecycle management.

Supply support for XC2VP70-5FF1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGA platforms for demanding system-on-chip applications.

The Virtex-II Pro series-including XC2VP70-5FF1704I-was engineered specifically for embedded computing systems requiring tightly integrated processor cores, high-speed serial I/O, and reconfigurable logic in a single die, targeting telecom, defense, and broadcast markets.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP70-5FF1704I?

The XC2VP70-5FF1704I is rated for 300 MHz PowerPC 405 core operation under Industrial (-I) speed grade conditions. This frequency is guaranteed across the full industrial temperature range (-40°C to +100°C) and requires adherence to voltage tolerances (VCCINT = 1.5 V ±3%) and proper decoupling per DS083 Section 3. The -5 speed grade specifies this timing margin for deterministic real-time execution in safety-critical deployments.

Does XC2VP70-5FF1704I support 64B/66B encoding in its RocketIO X transceivers?

Yes, XC2VP70-5FF1704I's RocketIO X transceivers natively support 64B/66B encoding as specified in DS083 Module 2. This capability is essential for compatibility with IEEE 802.3ae 10GBASE-R and other high-speed serial protocols requiring low-overhead framing. The encoding block is hardwired within each transceiver channel and requires no LUT resources.

What is the purpose of the VBATT pin on XC2VP70-5FF1704I?

The VBATT pin on XC2VP70-5FF1704I supplies backup power to the internal configuration memory retention circuitry. When main VCCINT is removed, VBATT (typically 2.5 V) preserves the contents of the configuration SRAM, enabling fast wake-up without full reconfiguration. This feature is used in battery-backed industrial controllers where zero-reboot latency is required after power interruption.

Can XC2VP70-5FF1704I perform partial reconfiguration in the field?

Yes, XC2VP70-5FF1704I supports IEEE 1532-compliant partial reconfiguration. This allows dynamic swapping of functional modules-such as changing encryption algorithms or updating protocol stacks-without disrupting ongoing operations of other FPGA regions or PowerPC cores. Implementation requires Xilinx ISE 12.4 or earlier toolchain and adherence to frame-based bitstream partitioning rules.

Is XC2VP70-5FF1704I pin-compatible with other Virtex-II Pro devices in FF1704 package?

No, XC2VP70-5FF1704I is not pin-compatible with other Virtex-II Pro devices in the FF1704 package. While the FF1704 mechanical footprint is shared, pin assignments for configuration, JTAG, power, and I/O banks differ significantly between devices (e.g., XC2VP100-FF1704 vs. XC2VP70-FF1704). DS083 Module 4 confirms unique pin definitions per device/package combination.