AMD XC2VP70-5FFG1517C

Overview

XC2VP70-5FFG1517C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interfaces, embedded DSP acceleration, and protocol-aware networking systems requiring on-chip processing and serial interconnect.

For engineers reviewing the XC2VP70-5FFG1517C datasheet, pinout, applications, or equivalent options, key selection considerations include confirmed RocketIO X transceiver count (20), PowerPC 405 dual-core support, -5 speed grade timing compliance, FF1517 package I/O mapping, and compatibility with XAUI, Fibre Channel, and InfiniBand protocols.

Technical Context

This device implements a hardened architecture combining SRAM-based configurable logic fabric with monolithic embedded blocks: each RocketIO X transceiver provides full-duplex 4.25 Gb/s operation with on-chip 50 Ω termination, programmable pre-emphasis (0–500%), and 64B/66B encoding; the dual PowerPC 405 cores deliver Harvard architecture execution with 16 KB instruction and data caches, MMU, and OCM interface.

The FPGA fabric includes 328 18 Kb Block SelectRAM+ modules (max 996 Kb block RAM), 1,034 dedicated 18×18 multipliers, twelve Digital Clock Managers (DCMs) supporting phase shifting in 1/256-clock increments, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X with digitally controlled impedance (DCI).

Key Specifications

Pinout & Package

XC2VP70-5FFG1517C uses the FFG1517 flip-chip fine-pitch BGA package: 40 mm × 40 mm body, 1.0 mm ball pitch, 1517 I/O balls arranged in perimeter and area array, optimized for thermal dissipation and signal integrity in high-speed designs. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration, JTAG, power, ground, I/O bank voltage domains, RocketIO X differential pairs (TXP/TXN, RXP/RXN), and PowerPC-specific signals (PLB, DCR, debug).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-5FFG1517C, the -6 variant trades speed for broader temperature range and lower static power, while the XC2VPX70-5FFG1517C replaces flexible RocketIO with fixed RocketIO X - both retain identical package, logic resources, and dual PowerPC capability but differ in transceiver feature set and timing guarantees.

Availability

XC2VP70-5FFG1517C is available at Aetrix Electronics and suitable for telecom infrastructure, military radar processing, and high-end test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP70-5FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family was designed to integrate processor cores, high-speed serial transceivers, and configurable logic in a single die - targeting applications demanding both software-defined flexibility and hardware-accelerated throughput, such as communications infrastructure and embedded vision.

FAQ

What is the maximum RocketIO X transceiver data rate supported by XC2VP70-5FFG1517C?

XC2VP70-5FFG1517C supports a fixed 4.25 Gb/s baud rate per RocketIO X transceiver channel, as specified in DS083 Table 4 for -5 speed grade flip-chip devices. This rate is compliant with Fibre Channel, XAUI, and InfiniBand standards. The device does not support variable-rate operation like XC2VPX20; all 20 RocketIO X transceivers operate exclusively at 4.25 Gb/s.

Does XC2VP70-5FFG1517C include PowerPC processor cores, and how many?

Yes, XC2VP70-5FFG1517C integrates two IBM PowerPC 405 RISC processor blocks, each capable of sustained operation at 300 MHz in the -5 speed grade. These cores feature 16 KB instruction and data caches, MMU, OCM interface, and CoreConnect bus compatibility - enabling embedded software execution alongside FPGA logic in a single chip.

What package type and pin count does XC2VP70-5FFG1517C use?

XC2VP70-5FFG1517C uses the FFG1517 flip-chip fine-pitch BGA package: 1517 solder balls, 40 mm × 40 mm body size, 1.0 mm pitch, and Pb-free construction. This package supports 996 user I/Os plus dedicated configuration, JTAG, power, and RocketIO X differential pairs - optimized for thermal performance and high-speed signal integrity.

Can XC2VP70-5FFG1517C perform 64B/66B encoding, and which transceivers support it?

Yes, XC2VP70-5FFG1517C supports 64B/66B encoding exclusively in its RocketIO X transceivers - all 20 channels include hardware 64B/66B encoder/decoder blocks. Standard RocketIO transceivers (not present in this part) only support 8B/10B. This makes XC2VP70-5FFG1517C suitable for 10G Ethernet WAN PHY and other 64B/66B-dependent protocols.

What is the logic capacity and memory resource allocation of XC2VP70-5FFG1517C?

XC2VP70-5FFG1517C provides 74,448 logic cells, 328 × 18 Kb Block SelectRAM+ modules (totaling up to 996 Kb block RAM), and 1,034 dedicated 18×18 multipliers. Distributed RAM delivers up to 1,378 Kb, and the device includes twelve Digital Clock Managers for advanced clock routing and phase control - enabling large-scale DSP, packet processing, and control-plane logic.