AMD XC2VP70-5FFG1704C

Overview

XC2VP70-5FFG1704C from Xilinx is a high-density, flip-chip BGA Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in the FF1704 package. It targets high-throughput telecom backplane interfaces, wireless baseband processing, and embedded vision systems requiring integrated processing and serial connectivity.

For engineers reviewing the XC2VP70-5FFG1704C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO X transceiver performance at 4.25 Gb/s, dual PowerPC 405 core timing compliance at -5 speed grade, DCI-enabled I/O termination, DCM-based clock management, and FF1704 package routing constraints for high-speed PCB layout.

Technical Context

The XC2VP70-5FFG1704C implements a hardened architecture combining FPGA fabric with fixed-function blocks: dual PowerPC 405 cores operate at ≤300 MHz (Industrial) or ≤350 MHz (Commercial) under -5 speed grade, each with 16 KB instruction and data caches, MMU, and OCM interface. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s, supporting 64B/66B encoding, programmable pre-emphasis, and on-chip 50 Ω termination - no external components required for differential signaling.

FPGA resources include 33,088 CLB slices, 1,034 dedicated 18×18 multipliers, 328 Block SelectRAM+ modules (18 Kb each), and twelve Digital Clock Managers (DCMs) enabling precise phase shifting (1/256 period resolution), frequency synthesis, and deskew. The FF1704 package provides 1704 balls with 996 user I/Os, all routed via flip-chip interconnect for low-inductance power delivery and signal integrity.

Key Specifications

Pinout & Package

The XC2VP70-5FFG1704C is housed in a 42.5 mm × 42.5 mm flip-chip fine-pitch BGA (FF1704) with 1.00 mm ball pitch, optimized for high I/O count and thermal dissipation. Pin definitions follow Xilinx DS083 Module 4, where balls are assigned to configuration, clock, I/O bank, PowerPC debug, RocketIO reference clocks, and transceiver differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-5FFG1704C, the -6 variant offers higher CPU/transceiver timing headroom at same package, while the FG1704 variant trades RocketIO X capability and I/O count for wire-bond manufacturability - neither is pin-compatible due to differing ball maps and transceiver pinouts.

Availability

XC2VP70-5FFG1704C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless baseband, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP70-5FFG1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology with SRAM-based reconfigurable logic, embedded processors, and high-speed transceivers for aerospace, defense, and communications markets.

The Virtex-II Pro family, including XC2VP70-5FFG1704C, was engineered to integrate programmable logic, PowerPC processing, and multi-gigabit serial I/O into single-chip solutions for bandwidth-constrained embedded systems.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP70-5FFG1704C?

The XC2VP70-5FFG1704C supports PowerPC 405 core operation up to 300 MHz in Industrial temperature grade and up to 350 MHz in Commercial grade under the -5 speed grade. This is confirmed in DS083 Table 4, where -5 grade specifies 300 MHz for Industrial and 350 MHz for Commercial operation. The XC2VP70-5FFG1704C part number explicitly denotes the -5 speed grade and FFG1704 package, aligning with these timing limits.

Does XC2VP70-5FFG1704C support 64B/66B encoding in its RocketIO X transceivers?

Yes, XC2VP70-5FFG1704C supports 64B/66B encoding in its RocketIO X transceivers, as documented in DS083 Module 1 Section "RocketIO X Transceiver Features" and Module 2 Functional Description. This encoding is mandatory for protocols like 10GbE and is implemented in hardware within each RocketIO X channel, distinct from the 8B/10B-only RocketIO transceivers found in non-X Virtex-II Pro devices.

What package type does XC2VP70-5FFG1704C use, and how many user I/Os does it provide?

XC2VP70-5FFG1704C uses the FF1704 flip-chip fine-pitch BGA package with 1.00 mm ball pitch and provides 996 user I/O pads, as specified in DS083 Table 3. The "FF" prefix confirms flip-chip construction, and the "G" suffix indicates lead-free (Pb-free) finish. This I/O count excludes configuration pins, power supplies, and RocketIO transceiver differential pairs.

Can XC2VP70-5FFG1704C perform bitstream encryption, and what standard does it use?

Yes, XC2VP70-5FFG1704C supports Triple-DES (3DES) bitstream encryption, as stated in DS083 Module 1 "General Description" and "Configuration" sections. The on-chip DES decryptor enables secure configuration loading using one or two triple-DES key sets, protecting FPGA design IP from unauthorized readback or cloning during field deployment.

Is XC2VP70-5FFG1704C recommended for new designs according to Xilinx documentation?

No, XC2VP70-5FFG1704C is marked "Product Not Recommended For New Designs" in DS083 (v5.0) June 21, 2011, the official Xilinx data sheet. This status reflects end-of-life planning and discontinuation of the Virtex-II Pro family; however, the part remains available for legacy system repair, obsolescence mitigation, and long-lifecycle industrial deployments supported by Aetrix Electronics.