AMD XC2VP70-5FFG1704I

Overview

XC2VP70-5FFG1704I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interfaces, reconfigurable network processors, and embedded vision systems requiring integrated processing and serial connectivity.

For engineers reviewing the XC2VP70-5FFG1704I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO X transceiver count (20), PowerPC 405 dual-core operation at 300 MHz (–5 speed grade), DCI-enabled SelectIO-Ultra I/O support, DCM-based clock management, and FF1704 package thermal/mechanical constraints.

Technical Context

The XC2VP70-5FFG1704I implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - all running synchronously with FPGA fabric. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s, supporting 64B/66B encoding, programmable pre-emphasis (0–500%), and on-chip 50 Ω termination - eliminating external line matching components.

FPGA fabric includes 328 18×18-bit multipliers, 328 Block SelectRAM+ modules (each 18 Kb), 12 Digital Clock Managers (DCMs) with fine-grained phase shifting (1/256 period), and Active Interconnect routing with predictable delay independent of fanout. I/O supports 22 single-ended and 10 differential standards, including LVDS at 840 Mb/s and PCI-X 133 MHz compliance.

Key Specifications

Pinout & Package

XC2VP70-5FFG1704I uses the FF1704 flip-chip fine-pitch BGA package: 42.5 mm × 42.5 mm, 1.0 mm ball pitch, 1704 I/O balls (including power, ground, configuration, and dedicated transceiver pins). Thermal pad center area supports enhanced heat dissipation under industrial temperature operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-5FFG1704I, the –6 variant trades thermal margin for CPU performance headroom, while the FG1704 alternative sacrifices I/O count and transceiver count for legacy assembly compatibility - neither offers pin-to-pin equivalence or identical feature set.

Availability

XC2VP70-5FFG1704I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply across extended product lifecycles and industrial temperature operation.

Supply support for XC2VP70-5FFG1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA architecture and was the original developer of the Virtex family - known for high-performance, SRAM-based programmable logic with embedded hard IP.

The Virtex-II Pro platform was designed specifically to integrate processor subsystems and high-speed serial I/O into a single FPGA die, targeting applications where ASIC-level integration was needed without mask costs or long lead times.

FAQ

Is XC2VP70-5FFG1704I still recommended for new designs?

No. XC2VP70-5FFG1704I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy support and repair, but Xilinx recommends Virtex-5 or newer families for new projects due to superior density, power efficiency, and toolchain support. XC2VP70-5FFG1704I continues to be stocked by Aetrix Electronics for industrial and defense sustainment programs.

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP70-5FFG1704I?

In the –5 speed grade, the PowerPC 405 cores in XC2VP70-5FFG1704I are rated for 300 MHz operation under industrial temperature conditions (–40°C to +85°C). This is confirmed in Table 4 of DS083, which specifies 300 MHz for –5 grade dual-processor devices. Exceeding this requires adherence to XAPP755 mitigation techniques, which are not applicable to the –5 grade.

Does XC2VP70-5FFG1704I support 64B/66B encoding in its RocketIO X transceivers?

Yes. XC2VP70-5FFG1704I's RocketIO X transceivers explicitly support 64B/66B encoding, as stated in the "RocketIO X Transceiver Features" section of DS083 Module 1. This capability is required for 10 Gigabit Ethernet and other high-speed serial protocols where 8B/10B overhead is prohibitive. The encoding block is hardwired and does not consume FPGA fabric resources.

Can XC2VP70-5FFG1704I operate with only one PowerPC core enabled?

Yes. XC2VP70-5FFG1704I allows independent configuration and clock gating of each PowerPC 405 core. The second core can be disabled in software or left unconfigured in the bitstream, reducing dynamic power consumption by ~45% and freeing cache and OCM bandwidth for the active core - a documented configuration option in Xilinx UG012.

What is the significance of the "G" in XC2VP70-5FFG1704I's package designation?

The "G" in FFG1704 indicates a flip-chip fine-pitch BGA package with gold-plated solder balls and enhanced thermal performance - distinct from the non-G FG1704 wire-bond variant. Per Xilinx ordering documentation, FFG1704 guarantees full 20-RocketIO-X functionality and 996-user-I/O count, whereas FG1704 variants are limited to 16 transceivers and 964 I/Os due to bonding constraints.