AMD XC2VP70-6FF1517C

Overview

XC2VP70-6FF1517C from Xilinx is a high-density, flip-chip BGA FPGA with dual PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in the FF1517 package. It serves as a system-on-chip platform for telecom backplane interfaces, high-speed networking control planes, and embedded DSP-accelerated video processing.

For engineers reviewing the XC2VP70-6FF1517C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO X transceiver compliance with 4.25 Gb/s fixed-rate protocols (e.g., XAUI), dual-processor clock domain isolation, DCM-based jitter-tolerant clock management, and FF1517 package-level thermal and signal integrity validation.

Technical Context

The XC2VP70-6FF1517C integrates two independent PowerPC 405 cores running up to 350 MHz (-6 speed grade), each with 16 KB instruction and 16 KB data caches, MMU support, and dedicated OCM interfaces. Its 20 RocketIO X transceivers implement monolithic CDR, programmable pre-emphasis (0–500%), and 64B/66B encoding - all fixed at 4.25 Gb/s per channel per DS083 v5.0 Table 4.

FPGA fabric includes 328 18×18-bit multipliers, 328 Block SelectRAM+ modules (18 Kb each), twelve Digital Clock Managers (DCMs) with fine-grained phase shifting (1/256 period), and SelectIO-Ultra I/O supporting LVDS, SSTL, and DCI-terminated standards. Routing uses Active Interconnect Technology with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP70-6FF1517C is housed in a 40 mm × 40 mm flip-chip fine-pitch BGA (FF1517) with 1.0 mm ball pitch, 1517 I/O balls, and thermal-enhanced construction optimized for high-power density operation. Pin definitions are documented across 302 pages in DS083 Module 4, including dedicated VCCINT/VCCAUX/VCCO power domains, differential clock inputs, RocketIO X transceiver lanes (TXP/TXN/RXP/RXN), JTAG boundary-scan pins, and dual PowerPC debug interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-6FF1517C, the -5FF1517C trades 50 MHz CPU performance for lower power and cost, while the XC2VPX70-6FF1517C adds protocol-specific transceiver enhancements without altering core logic resources or I/O count - making both viable alternatives depending on clock budget and serial standard requirements.

Availability

XC2VP70-6FF1517C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video processing, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP70-6FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-II Pro family, including XC2VP70-6FF1517C, was engineered to unify high-performance FPGA fabric with hardened processor and transceiver subsystems for system-level integration in wireline communications and embedded computing.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP70-6FF1517C?

The XC2VP70-6FF1517C is rated for 350 MHz PowerPC 405 core operation under commercial -6 speed grade conditions, as confirmed in DS083 v5.0 Table 4. This assumes proper decoupling, thermal management below 85°C junction temperature, and adherence to voltage tolerances (VCCINT = 1.5V ±3%). The XC2VP70-6FF1517C does not support 400 MHz operation - that rating applies only to -7 grade devices, which are not offered in this package variant.

Does XC2VP70-6FF1517C support 64B/66B encoding in its RocketIO X transceivers?

Yes, XC2VP70-6FF1517C supports 64B/66B encoding as a standard feature of its RocketIO X transceivers, per DS083 v5.0 Module 1 Section "RocketIO X Transceiver Features". This capability is required for 10 Gigabit Ethernet and newer Fibre Channel standards, and is implemented in hardware alongside 8B/10B encoding - both selectable per channel in the transceiver configuration registers.

Can XC2VP70-6FF1517C be configured via JTAG boundary scan only, or are other methods required?

XC2VP70-6FF1517C supports full configuration through IEEE 1149.1 JTAG boundary scan (IEEE 1532 mode), eliminating need for external configuration PROMs. It also supports slave-serial, master-serial, and Slave SelectMAP modes. JTAG is sufficient for prototyping and debugging, but production systems often combine it with SelectMAP for faster parallel loading - all methods are validated for XC2VP70-6FF1517C in DS083 Module 1.

What is the DCI impedance range supported by XC2VP70-6FF1517C for single-ended I/O standards?

XC2VP70-6FF1517C implements XCITE Digitally Controlled Impedance (DCI) supporting programmable on-die termination of 50 Ω, 60 Ω, and 75 Ω for single-ended standards like LVCMOS and SSTL, as specified in DS083 v5.0 Module 1. This eliminates external resistors and improves signal integrity across varying PCB trace impedances - a design value confirmed for all FF1517-packaged Virtex-II Pro devices.

Is partial reconfiguration supported on XC2VP70-6FF1517C, and what tools enable it?

Yes, XC2VP70-6FF1517C supports partial reconfiguration as documented in DS083 v5.0 Module 1. This capability allows dynamic swapping of logic modules (e.g., changing encryption algorithms or protocol engines) without resetting the entire device. Implementation requires Xilinx ISE 12.4 or later with PlanAhead toolflow and specific floorplanning constraints - all validated for XC2VP70-6FF1517C in XAPP290 and XAPP655 application notes.