AMD XC2VP70-6FF1517I

Overview

XC2VP70-6FF1517I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro X platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interconnect, embedded video processing, and reconfigurable DSP systems requiring hardened serial I/O and on-die processing.

For engineers reviewing the XC2VP70-6FF1517I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, transceiver timing constraints, DCM phase-shift resolution, SelectIO-Ultra I/O drive strength configuration, and real-world use cases for legacy system sustainment and industrial control upgrades.

Technical Context

The XC2VP70-6FF1517I implements a dual-processor SoC-FPGA architecture with tightly coupled PowerPC 405 cores sharing access to 32 KB on-chip memory via CoreConnect bus, while RocketIO X transceivers provide monolithic clock recovery and programmable pre-emphasis (0–500%) for deterministic 4.25 Gb/s serial links. Its Active Interconnect routing fabric supports predictable timing closure independent of fanout.

Each RocketIO X channel features 8B/10B and 64B/66B encoding, per-channel internal loopback, and on-chip 50 Ω termination - eliminating external resistors. The device uses twelve Digital Clock Managers (DCMs) with 1/256-period fine-grained phase shifting and supports DDR/LVDS/HSTL/SSTL I/O standards with Digitally Controlled Impedance (DCI) for dynamic on-die termination calibration.

Key Specifications

Pinout & Package

XC2VP70-6FF1517I is housed in a 40 mm × 40 mm flip-chip fine-pitch BGA (FF1517) with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in industrial environments. Package includes dedicated VCCINT (1.5 V), VCCAUX (2.5 V), and VCCO (1.5/1.8/2.5/3.3 V) power domains, plus 15 mandatory configuration control pins (CCLK, DONE, M0–M2, PROG_B, etc.).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP70-5FF1517I, the XC2VP70-6FF1517I delivers 17% higher PowerPC clock margin for real-time interrupt handling; versus XC2VPX70-6FF1517I, it trades peak transceiver speed for guaranteed compatibility with 4.25 Gb/s telecom infrastructure without over-specifying silicon.

Availability

XC2VP70-6FF1517I is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial video encoders, avionics retrofits, and radar signal processors requiring stable component supply across extended product lifecycles.

Supply support for XC2VP70-6FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding compute and I/O applications.

The Virtex-II Pro X product line was engineered specifically for embedded systems requiring integrated processing, high-speed serial connectivity, and deterministic real-time behavior - targeting aerospace, defense, and carrier-class networking.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP70-6FF1517I?

The XC2VP70-6FF1517I is rated for 350 MHz PowerPC 405 core operation under industrial temperature conditions (–40°C to +100°C) and -6 speed grade. This assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP70-6FF1517I datasheet specifies this as the guaranteed maximum frequency for sustained operation in its target environment.

Does XC2VP70-6FF1517I support JTAG boundary-scan testing?

Yes, XC2VP70-6FF1517I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. It implements EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification and in-system programming. The XC2VP70-6FF1517I also supports IEEE 1532 for configuration through the JTAG interface.

Can XC2VP70-6FF1517I be configured using Master SelectMAP mode?

Yes, XC2VP70-6FF1517I supports Master SelectMAP configuration, where the FPGA generates CCLK and drives configuration data to external PROM or flash memory. This mode enables fast parallel loading (up to 100 MB/s) and is commonly used in systems requiring rapid boot times. The XC2VP70-6FF1517I's M0–M2 pins must be set to '100' to select this mode per the DS083 specification.

What I/O standards are supported by XC2VP70-6FF1517I's SelectIO-Ultra blocks?

XC2VP70-6FF1517I supports 22 single-ended (e.g., LVCMOS 1.5/1.8/2.5/3.3 V, PCI, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Its Digitally Controlled Impedance (DCI) feature provides automatic on-die termination calibration for all supported single-ended I/Os, ensuring signal integrity without external resistors.

Is XC2VP70-6FF1517I recommended for new designs?

No - XC2VP70-6FF1517I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy system maintenance, obsolescence mitigation, and industrial program continuity, but new designs should consider modern alternatives such as Kintex or Virtex UltraScale families for improved density, power efficiency, and toolchain support.