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AMD XC2VP70-6FF1704C
- Part No.:
- XC2VP70-6FF1704C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1704-BBGA, FCBGA
- Datasheet:
-
XC2VP70-6FF1704C.pdf
- Description:
- IC FPGA 996 I/O 1704FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,034
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Product details
Overview
XC2VP70-6FF1704C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 8 DCM clock management units. It targets high-throughput telecom backplane interfaces, wireless baseband processing, and embedded video systems requiring deterministic real-time compute + serial I/O co-processing.
For engineers reviewing the XC2VP70-6FF1704C datasheet, pinout, applications, or equivalent options, key selection criteria include verified 4.25 Gb/s RocketIO X transceiver compliance with XAUI/InfiniBand, dual-processor cache coherency support, DCI-enabled I/O termination for LVDS/HSTL, and FF1704 flip-chip BGA package routing constraints.
Technical Context
The XC2VP70-6FF1704C implements a hardened architecture combining FPGA fabric with two independent PowerPC 405 cores (350 MHz max), each with 16 KB instruction and data caches, MMU, and OCM interface. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s with monolithic CDR, 64B/66B encoding, and programmable pre-emphasis (0–500%).
Logic resources include 33,088 CLB slices, 1,034 dedicated 18×18 multipliers, 328 Block SelectRAM+ modules (18 Kb each), and 12 global clock buffers. I/O subsystem supports 996 user pins with Digitally Controlled Impedance (DCI) for on-die termination across 22 single-ended and 10 differential standards including LVDS, HSTL, and PCI-X.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,448 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| RocketIO X Transceivers | 20 × 4.25 Gb/s full-duplex - enables 85 Gb/s raw serial bandwidth for XAUI/InfiniBand backplane links |
| PowerPC 405 Cores | 2 × 350 MHz - provides dual-threaded embedded control with Harvard cache architecture and MMU |
| Block RAM | 5,904 Kb (328 × 18 Kb) - supports large FIFOs, frame buffers, or protocol packet buffering in hardware |
| Digital Clock Managers | 8 × DCM - delivers jitter-tolerant clock synthesis, phase shifting (1/256 period resolution), and deskew |
| User I/O Pins | 996 - supports high-pin-count parallel buses (e.g., DDR2, RapidIO) plus multiple differential lanes |
| Package | FF1704 flip-chip BGA, 1.0 mm pitch, 42.5 × 42.5 mm - optimized for signal integrity and thermal dissipation in dense PCB layouts |
Pinout & Package
XC2VP70-6FF1704C uses the FF1704 flip-chip fine-pitch BGA package with 1704 balls, 1.0 mm pitch, and 42.5 × 42.5 mm footprint. This package supports 996 user I/Os, 20 RocketIO X transceiver pairs (RX/TX), dual PowerPC JTAG/debug ports, and dedicated configuration pins (CCLK, DONE, M[0:2], PROG_B).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.5 V supply for FPGA fabric and PowerPC core logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, DCMs, and transceiver reference clocks |
| VCCO | I/O bank power | Programmable 1.5/1.8/2.5/3.3 V per bank; sets voltage level and drive strength for associated I/O standards |
| HRxP/N, HTxP/N | RocketIO X differential pair | 20 dedicated high-speed serial lanes; each pair requires controlled 100 Ω differential impedance routing |
| PPC_JTAG_TCK/TDI/TDO/TMS | Processor debug interface | Separate JTAG chain for PowerPC cores; enables independent firmware debugging without affecting FPGA logic |
| CCLK, DONE, PROG_B | Configuration control | Master configuration clock, status flag, and reprogrammable reset; critical for reliable bitstream loading sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores with 16 KB I/D cache | Enables tightly coupled software-defined radio (SDR) control and real-time packet processing alongside FPGA acceleration |
| 20 × 4.25 Gb/s RocketIO X transceivers | Meets XAUI (4×3.125 Gb/s) and InfiniBand SDR/DDR physical layer specs without external retimers or clock ICs |
| Digitally Controlled Impedance (DCI) | Eliminates external series/parallel termination resistors for LVDS, HSTL, and SSTL I/O, reducing BOM count and layout area |
| 12 global clock buffers + 8 DCMs | Supports multi-domain clocking for synchronous DDR2 memory, transceiver PHY, and processor subsystems with sub-ns skew control |
| Block SelectRAM+ (328 × 18 Kb) | Provides true dual-port RAM for concurrent read/write access in video frame buffers or protocol state machines |
| 1,034 × 18×18 multipliers | Accelerates FIR filters, FFT engines, and channel estimation algorithms in wireless baseband with single-cycle throughput |
Applications
| Telecom Backplane Interface | Wireless Baseband Processing |
|---|---|
|
Use Scenario: 10-Gigabit Ethernet aggregation switch with XAUI-to-SerDes bridging and line-card traffic shaping. IC Role / Device Role / Timing Role: XC2VP70-6FF1704C acts as protocol-aware SerDes bridge and traffic manager, synchronizing XAUI lanes to system clock via DCM while offloading QoS scheduling to PowerPC cores. Use Value: Eliminates need for discrete PHYs and traffic managers; 20 RocketIO X lanes handle 5× XAUI groups (4 lanes each) with integrated 64B/66B encoding and elastic buffer deskew. |
Use Scenario: LTE eNodeB digital unit implementing MIMO-OFDM modulation, channel coding, and CPRI fronthaul. IC Role / Device Role / Timing Role: XC2VP70-6FF1704C serves as baseband processor with FPGA-accelerated FFT/IFFT and PowerPC-managed RRC/L2 stack, using 1,034 multipliers for real-time symbol processing. Use Value: Achieves >200 MHz sustained DSP throughput with deterministic latency; DCI-configured LVDS I/O interfaces directly to ADC/DAC and CPRI optical modules. |
| Medical Imaging Data Acquisition | Avionics High-Speed Data Recorder |
|
Use Scenario: PET/CT scanner front-end acquiring 16-bit parallel sensor data at 200 MSPS and compressing via wavelet transform. IC Role / Device Role / Timing Role: XC2VP70-6FF1704C functions as real-time acquisition controller and compression engine, using Block SelectRAM+ for ping-pong frame buffering and PowerPC for JPEG2000 header generation. Use Value: 5,904 Kb on-chip RAM avoids external DDR bottleneck; 996 I/Os route parallel ADC bus + PCIe Gen1 host interface simultaneously. |
Use Scenario: Flight test recorder capturing ARINC 429, MIL-STD-1553, and high-speed Ethernet data onto solid-state storage. IC Role / Device Role / Timing Role: XC2VP70-6FF1704C operates as deterministic data concentrator, time-stamping all inputs via DCM-synchronized counters and managing flash wear-leveling via PowerPC firmware. Use Value: Dual PowerPC cores isolate safety-critical timestamping (lockstep mode) from non-critical file-system tasks; RocketIO X links enable encrypted 4.25 Gb/s downlink to ground station. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA with embedded processor and serial transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-5FF1704C | Slower speed grade (-5 vs -6): 300 MHz PowerPC, 2.0 Gb/s RocketIO (non-X variant), reduced timing margin | Limited to legacy telecom systems requiring only 2.5 Gb/s transceivers and lower CPU clock rates | Select only if design meets relaxed timing closure and does not require 4.25 Gb/s RocketIO X compliance |
| XCVU3P-2FFVA2104E | UltraScale+ architecture: 1.1 GHz ARM Cortex-A53, 32.75 Gb/s GTY transceivers, 1.1M logic cells, 2104-pin FC-BGA | Targets next-gen 5G NR and AI inference where software-defined radio and ML acceleration coexist | Choose for new designs needing higher performance, security extensions (TrustZone), and long-term roadmap support |
Compared with XC2VP70-6FF1704C, the -5FF1704C trades transceiver speed and CPU frequency for cost and power reduction in legacy deployments, while the XCVU3P offers architectural modernization with ARM-based processing, PCIe Gen4, and hardened AI engines - but requires full RTL and toolchain migration.
Availability
XC2VP70-6FF1704C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless baseband, medical imaging, and avionics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XC2VP70-6FF1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions for high-performance computing, networking, and embedded systems since 1984.
The Virtex-II Pro family was designed specifically for system-level integration of embedded processors, high-speed serial I/O, and configurable logic - enabling complete hardware/software co-design in single-package platforms for demanding communications and signal processing applications.
FAQ
What is the maximum guaranteed RocketIO X transceiver data rate for XC2VP70-6FF1704C?
The XC2VP70-6FF1704C is rated for 4.25 Gb/s fixed-rate operation per RocketIO X transceiver channel, as confirmed in DS083 Table 4 for -6 speed grade flip-chip devices. This rate complies with XAUI and InfiniBand SDR specifications and is not adjustable - unlike RocketIO variants which support variable rates from 600 Mb/s to 3.125 Gb/s.
Does XC2VP70-6FF1704C support partial reconfiguration?
Yes, XC2VP70-6FF1704C supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. This allows dynamic logic module swapping without resetting the entire device or interrupting PowerPC execution - essential for adaptive radio protocols and field-upgradable signal processing pipelines.
What I/O standards are supported by XC2VP70-6FF1704C with Digitally Controlled Impedance (DCI)?
XC2VP70-6FF1704C supports DCI termination for LVCMOS (1.5V/1.8V/2.5V/3.3V), HSTL (Class I/II/III/IV), SSTL (1.8V/2.5V), and PCI/PCI-X standards. DCI automatically calibrates on-die series or parallel termination to match transmission line impedance, eliminating external resistors for these standards.
Can both PowerPC 405 cores in XC2VP70-6FF1704C run simultaneously at 350 MHz?
Yes - the -6 speed grade guarantees dual PowerPC 405 cores operating at 350 MHz under commercial temperature conditions, as specified in DS083 Table 4. This requires adherence to XAPP755 guidelines for clock macro implementation when exceeding 300 MHz in industrial-grade dual-core configurations.
Is XC2VP70-6FF1704C compatible with Xilinx ISE 14.7 design tools?
XC2VP70-6FF1704C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and ChipScope ILA integration. However, newer tools like Vivado do not support Virtex-II Pro devices - ISE 14.7 remains the final and only officially supported toolchain.
XC2VP70-6FF1704C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1704-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8272
- Number of Logic Elements/Cells:
- 74448
- Total RAM Bits:
- 6045696
- Number of I/O:
- 996
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1704-FCBGA (42.5x42.5)
XC2VP70-6FF1704C FAQ
1.How can I place an order for XC2VP70-6FF1704C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP70-6FF1704C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP70-6FF1704C reliable?
The price and inventory of XC2VP70-6FF1704C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP70-6FF1704C is usually 5 days.
3.What payment methods are accepted for XC2VP70-6FF1704C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP70-6FF1704C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP70-6FF1704C?
XC2VP70-6FF1704C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP70-6FF1704C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP70-6FF1704C?
For technical support, including XC2VP70-6FF1704C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP70-6FF1704C requirements.
6.How does Aetrix verify that XC2VP70-6FF1704C is sourced from the original manufacturer or authorized distributors?
All XC2VP70-6FF1704C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP70-6FF1704C meets industry standards.
7.What is the process for return or replacement of XC2VP70-6FF1704C?
All XC2VP70-6FF1704C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP70-6FF1704C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP70-6FF1704C part is unused and in its original packaging.
Return procedure for XC2VP70-6FF1704C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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