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AMD XC2VP70-6FF1704I
- Part No.:
- XC2VP70-6FF1704I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1704-BBGA, FCBGA
- Datasheet:
-
XC2VP70-6FF1704I.pdf
- Description:
- IC FPGA 996 I/O 1704FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,371
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Product details
Overview
XC2VP70-6FF1704I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interfaces requiring embedded processing and serial interconnect.
For engineers reviewing the XC2VP70-6FF1704I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO X transceiver count and speed grade (-6), PowerPC dual-core clock stability at 350 MHz, DCM phase-shifting resolution, SelectIO-Ultra I/O voltage support (1.5V–3.3V), and FF1704 package thermal/power delivery constraints.
Technical Context
This device implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and data caches, MMU, and OCM interface, tightly coupled to FPGA fabric via CoreConnect bus. Its 20 RocketIO X transceivers provide monolithic CDR, programmable pre-emphasis (0–500%), and 64B/66B encoding - all fixed at 4.25 Gb/s per channel per DS083 v5.0 Table 4.
The FPGA fabric includes 328 18×18-bit multipliers, 328 Block SelectRAM+ modules (18 Kb each), twelve Digital Clock Managers (DCMs) with 1/256-cycle phase shift, and SelectIO-Ultra I/O with Digitally Controlled Impedance (DCI) for on-die termination across 22 single-ended and 10 differential standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,448 - defines maximum combinational + sequential logic capacity for HDL synthesis |
| PowerPC Cores | 2 × 350 MHz - enables dual-threaded real-time control with cache-coherent memory access |
| RocketIO X Transceivers | 20 @ 4.25 Gb/s - provides 85 Gb/s full-duplex raw bandwidth for backplane or optical line-card links |
| User I/O Pins | 996 - supports high-pin-count parallel buses (e.g., DDR2, PCI-X) and dense differential signaling |
| Digital Clock Managers | 12 × DCM - delivers sub-degree phase alignment and integer/fractional frequency synthesis for multi-clock domain systems |
| Block RAM | 5,904 Kb - enables large on-chip buffering for packet processing, video frame stores, or FFT engines |
| Multiplier Blocks | 328 × 18×18-bit - accelerates DSP-intensive tasks including filtering, correlation, and modulation without external ASICs |
Pinout & Package
XC2VP70-6FF1704I uses the FF1704 flip-chip fine-pitch BGA package (42.5 mm × 42.5 mm, 1.0 mm pitch), optimized for thermal dissipation and signal integrity in high-speed serial applications. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP (TCK/TDI/TDO/TMS), PowerPC debug signals (JTAGPPC), RocketIO reference clocks (REFCLKP/N), and bank-specific VCCO/VREF supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives synchronous bitstream loading in Master SelectMAP mode; requires stable 0–100 MHz source |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful configuration completion |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| REFCLKP/N | Differential Reference Clock Input | Provides low-jitter timing reference for RocketIO X transceivers; must meet ±100 ppm stability |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for FPGA fabric and PowerPC logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V ±3% supply for DCMs, SelectIO-Ultra drivers, and configuration circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables asymmetric multiprocessing: one core for real-time packet inspection, second for protocol stack execution |
| 20 RocketIO X Transceivers | Eliminates need for external SERDES chips in OC-192/STM-64 line cards or 10GbE switch fabrics |
| SelectIO-Ultra with DCI | Automatically matches on-die termination to trace impedance (50 Ω–75 Ω), removing 20+ external resistors per bank |
| 12 × Digital Clock Manager (DCM) | Permits jitter-free clock domain crossing between 100 MHz system clock, 4.25 Gb/s transceiver reference, and DDR2 memory interface |
| Block SelectRAM+ Memory | Supports true dual-port access at >200 MHz - critical for ping-pong buffering in video compression pipelines |
Applications
| Telecom Line Card | High-Speed Test Equipment |
|---|---|
Use Scenario: OC-192/STM-64 add-drop multiplexer with integrated framer and overhead processing. IC Role / Device Role / Timing Role: XC2VP70-6FF1704I serves as the central packet-processing engine, hosting framer IP, SONET mapping logic, and 20-channel 4.25 Gb/s transceiver interface. Use Value: Integrated RocketIO X eliminates external PHYs; dual PowerPC cores run management plane software while FPGA fabric handles time-critical framing in hardware. | Use Scenario: Multi-port 10 GbE compliance tester validating jitter tolerance and eye diagram margins. IC Role / Device Role / Timing Role: XC2VP70-6FF1704I acts as the pattern generator/analyzer controller, synchronizing 20 transceiver lanes to IEEE 802.3ae reference clocks. Use Value: On-chip DCMs align all 20 transceiver clocks to <±50 ps skew; built-in loopback modes enable per-lane BER testing without external cabling. |
| Military Radar Signal Processor | Medical Imaging Backplane |
Use Scenario: AESA radar front-end with real-time beamforming and pulse-Doppler processing. IC Role / Device Role / Timing Role: XC2VP70-6FF1704I implements wideband digital downconversion (DDC), CFAR detection, and SAR image reconstruction using distributed arithmetic. Use Value: 328 dedicated multipliers execute 16K-point FFTs in <10 µs; industrial-grade (-I) temperature range ensures operation from –40°C to +100°C. | Use Scenario: PET/CT scanner backplane aggregating 64-channel analog-to-digital data streams at 125 MSPS. IC Role / Device Role / Timing Role: XC2VP70-6FF1704I functions as the centralized data concentrator, receiving LVDS inputs and formatting packets for GPU-accelerated reconstruction. Use Value: 996 SelectIO-Ultra pins support 32 × 2-bit LVDS pairs at 840 Mb/s; on-chip differential termination removes 64 external 100 Ω resistors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integration FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP70-5FF1704I | Lower speed grade: RocketIO X limited to 2.0 Gb/s; PowerPC max 300 MHz | Suitable for cost-sensitive test fixtures where full 4.25 Gb/s is unnecessary | Select only if design operates below 300 MHz CPU and 2.0 Gb/s serial rates |
| XC2VP70-6FF1152I | Same speed grade but FF1152 package: 35 mm × 35 mm, 996 I/Os, no RocketIO X bonded out | Used when high I/O count is prioritized over serial transceivers (e.g., massive parallel memory interface) | Choose when board layout requires smaller footprint and transceivers are implemented externally |
Compared with XC2VP70-5FF1704I, the XC2VP70-6FF1704I delivers 112% higher transceiver bandwidth and 17% higher CPU frequency; versus XC2VP70-6FF1152I, it trades 5.5 mm² area and 592 pins for 20 integrated 4.25 Gb/s channels - eliminating 40 discrete SERDES ICs and associated layout complexity.
Availability
XC2VP70-6FF1704I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, medical imaging, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC2VP70-6FF1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a U.S.-based semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered the FPGA architecture and established industry standards for reconfigurable computing.
The Virtex-II Pro family was designed for high-performance system integration, combining hard processor cores, multi-gigabit transceivers, and flexible logic fabric to replace ASICs in telecom, aerospace, and instrumentation applications.
FAQ
What is the maximum guaranteed RocketIO X transceiver speed for XC2VP70-6FF1704I?
The XC2VP70-6FF1704I is rated for 4.25 Gb/s per RocketIO X transceiver channel, as specified in DS083 v5.0 Table 4 for -6 speed grade flip-chip devices. This fixed rate applies to all 20 transceivers and is not user-programmable to higher speeds. The XC2VP70-6FF1704I does not support the 6.25 Gb/s mode found in -7 grade XC2VPX70 parts.
Does XC2VP70-6FF1704I support partial reconfiguration?
Yes, XC2VP70-6FF1704I supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. This allows dynamic swapping of functional modules (e.g., changing encryption algorithms or protocol stacks) without resetting the PowerPC cores or disrupting active transceiver links - a capability confirmed in DS083 Module 1 Section "SRAM-Based In-System Configuration".
What I/O standards are supported by XC2VP70-6FF1704I's SelectIO-Ultra banks?
XC2VP70-6FF1704I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each bank's VCCO voltage determines compatible standards, and Digitally Controlled Impedance (DCI) provides automatic on-die termination matching for most single-ended interfaces.
Is XC2VP70-6FF1704I pin-compatible with other Virtex-II Pro devices in FF1704 packaging?
No - XC2VP70-6FF1704I is not pin-compatible with other Virtex-II Pro devices in FF1704 packages because no other device in the family is offered in FF1704. According to DS083 Table 3, only XC2VP70 and XC2VPX70 are available in FF1704; their pinouts differ due to distinct RocketIO X routing and PowerPC debug signal allocations.
What configuration modes does XC2VP70-6FF1704I support?
XC2VP70-6FF1704I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Master SelectMAP is commonly used for fast parallel loading from flash memory, while Boundary-Scan enables in-system programming and verification without dedicated configuration controllers.
XC2VP70-6FF1704I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1704-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8272
- Number of Logic Elements/Cells:
- 74448
- Total RAM Bits:
- 6045696
- Number of I/O:
- 996
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1704-FCBGA (42.5x42.5)
XC2VP70-6FF1704I FAQ
1.How can I place an order for XC2VP70-6FF1704I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP70-6FF1704I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP70-6FF1704I reliable?
The price and inventory of XC2VP70-6FF1704I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP70-6FF1704I is usually 5 days.
3.What payment methods are accepted for XC2VP70-6FF1704I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP70-6FF1704I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP70-6FF1704I?
XC2VP70-6FF1704I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP70-6FF1704I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP70-6FF1704I?
For technical support, including XC2VP70-6FF1704I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP70-6FF1704I requirements.
6.How does Aetrix verify that XC2VP70-6FF1704I is sourced from the original manufacturer or authorized distributors?
All XC2VP70-6FF1704I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP70-6FF1704I meets industry standards.
7.What is the process for return or replacement of XC2VP70-6FF1704I?
All XC2VP70-6FF1704I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP70-6FF1704I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP70-6FF1704I part is unused and in its original packaging.
Return procedure for XC2VP70-6FF1704I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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