AMD XC2VP70-6FFG1517C

Overview

XC2VP70-6FFG1517C from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in a 1517-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom backplane interfaces, protocol-aware networking systems, and embedded DSP-accelerated video processing.

For engineers reviewing the XC2VP70-6FFG1517C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO X transceiver compliance with XAUI/InfiniBand, PowerPC 405 clocking stability at 350 MHz under -6 speed grade, DCM phase-shift resolution (1/256 period), and FF1517 package thermal performance for sustained 1.5 V core operation.

Technical Context

This device integrates hardened SERDES transceivers with monolithic CDR and programmable pre-emphasis (0–500%), dual PowerPC 405 cores with 16 KB instruction/data caches and MMU support, and FPGA fabric with 18×18-bit multipliers and 18 Kb Block SelectRAM+ modules. Its Active Interconnect routing ensures predictable delay independent of fanout.

The XC2VP70-6FFG1517C implements SelectIO-Ultra I/O with digitally controlled impedance (DCI) for LVDS, SSTL, and HSTL standards, supports DDR register insertion per IOB, and uses a 0.13 µm nine-layer copper process with 1.5 V VCCINT, 2.5 V VCCAUX, and configurable VCCO per bank.

Key Specifications

Pinout & Package

XC2VP70-6FFG1517C is housed in a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.0 mm pitch, 40 mm × 40 mm body size, and thermal-enhanced construction optimized for industrial temperature operation (0°C to 85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processor applications.

Compared with XC2VP70-6FFG1517C, the –7 speed grade offers higher CPU clock headroom but no transceiver upgrade, while the XC2VPX70 variant adds 64B/66B support at same speed grade-making it superior for standards-aligned serial protocols but not a drop-in replacement due to encoding differences.

Availability

XC2VP70-6FFG1517C is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, broadcast video equipment, and defense electronics requiring stable component supply across extended product lifecycles.

Supply support for XC2VP70-6FFG1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools now integral to aerospace, communications, and industrial systems.

The Virtex-II Pro family was engineered to unify high-performance FPGA fabric with hardened processor and transceiver subsystems-enabling complete system-on-chip implementations without discrete ASICs or ASSPs in bandwidth-intensive applications.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP70-6FFG1517C?

The XC2VP70-6FFG1517C is rated for 350 MHz PowerPC 405 operation under the –6 speed grade at commercial temperature (0°C to 85°C). This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP70-6FFG1517C does not support 400 MHz CPU operation-that requires the –7 speed grade variant.

Does XC2VP70-6FFG1517C support 64B/66B encoding in its RocketIO X transceivers?

No, XC2VP70-6FFG1517C supports only 8B/10B encoding in its RocketIO X transceivers. The 64B/66B capability is exclusive to the Virtex-II Pro X family (e.g., XC2VPX70-6FFG1517C). Documentation in DS083 explicitly states that 64B/66B is a RocketIO X feature limited to XC2VPX20 and XC2VPX70 devices-not the base XC2VP70 series.

What package type and pin count does XC2VP70-6FFG1517C use?

XC2VP70-6FFG1517C uses the FF1517 flip-chip fine-pitch BGA package with 1517 balls arranged in a 40 mm × 40 mm array and 1.0 mm pitch. This package supports 996 user I/Os plus dedicated configuration, clock, JTAG, and power pins, and is thermally optimized for industrial temperature operation.

Can XC2VP70-6FFG1517C be configured via JTAG boundary scan?

Yes, XC2VP70-6FFG1517C fully supports IEEE 1149.1 JTAG boundary-scan configuration through TCK, TMS, TDI, and TDO pins. It implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming, verification, and debug visibility without requiring dedicated configuration memory.

Is bitstream encryption supported on XC2VP70-6FFG1517C, and how is it implemented?

Yes, XC2VP70-6FFG1517C supports Triple-DES bitstream encryption using on-chip decryption hardware. Configuration bitstreams are encrypted off-line using Xilinx tools and loaded into the device; the XC2VP70-6FFG1517C decrypts them in real time using one or two stored DES key sets, protecting design IP from reverse engineering or cloning.