AMD XC2VP70-7FF1517C

Overview

XC2VP70-7FF1517C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating two 400 MHz PowerPC 405 RISC processor blocks, up to 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 8 DCM clock management units - deployed in telecom infrastructure, high-speed networking equipment, and embedded DSP systems requiring hardened serial I/O and embedded processing.

For engineers reviewing the XC2VP70-7FF1517C datasheet, pinout, applications, or equivalent options, key selection criteria include verified 4.25 Gb/s RocketIO X transceiver compliance with XAUI and Fibre Channel, dual PowerPC 405 core timing closure at -7 speed grade, FF1517 flip-chip BGA package I/O count (996 user I/Os), and DCI-enabled SelectIO-Ultra support for LVDS, SSTL, and HSTL standards.

Technical Context

This device implements a monolithic SRAM-based FPGA architecture built on a 0.13 µm nine-layer copper process with 1.5 V core voltage (VCCINT), 2.5 V auxiliary supply (VCCAUX), and configurable I/O banks (VCCO). Its RocketIO X transceivers feature integrated CDR, programmable pre-emphasis (0–500%), on-chip 50 Ω termination, and 64B/66B encoding - all operating without external clock synthesis components.

The dual PowerPC 405 cores each deliver 32 KB unified cache (16 KB instruction + 16 KB data), MMU with 64-entry TLB, and OCM interface to Block SelectRAM+ memory, while the FPGA fabric provides 328 18×18 multipliers, 328 18 Kb Block SelectRAM+ modules (totaling 5,904 Kb), and 12 global clock networks with fine-grained phase shifting (1/256 period resolution).

Key Specifications

Pinout & Package

XC2VP70-7FF1517C uses the FF1517 flip-chip fine-pitch BGA package with 1.0 mm pitch, 40 mm × 40 mm body size, and 1517 balls. It includes dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals (TCK/TMS/TDI/TDO), 15 control pins excluded from user I/O count, and 20 RocketIO X transceiver banks occupying dedicated ball groups.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-7FF1517C, the XC2VP70-6FF1517I trades 50 MHz processor speed for industrial temperature operation, while the XC2VPX70-7FF1517C removes variable transceiver rate flexibility to guarantee fixed 4.25 Gb/s compliance - both retain identical logic resources, memory, and I/O structure.

Availability

XC2VP70-7FF1517C is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed networking equipment, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP70-7FF1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family was designed to integrate hardened processor cores and multi-gigabit transceivers into a single FPGA die - targeting applications demanding concurrent high-speed I/O, embedded processing, and reconfigurable logic in telecom, defense, and scientific instrumentation.

FAQ

What is the maximum RocketIO X transceiver data rate supported by XC2VP70-7FF1517C?

XC2VP70-7FF1517C supports RocketIO X transceivers operating at a fixed 4.25 Gb/s baud rate, as specified in DS083 Table 4 for -7 speed grade flip-chip devices. This rate complies with XAUI and Fibre Channel standards and is verified across commercial temperature range (0°C to +85°C). The XC2VP70-7FF1517C does not support variable-rate RocketIO X operation - that capability is exclusive to XC2VPX20 devices.

Does XC2VP70-7FF1517C include embedded processor cores, and what is their clock speed?

Yes, XC2VP70-7FF1517C integrates two hard PowerPC 405 RISC processor cores, each capable of sustained operation at 400 MHz in -7 speed grade Commercial devices. This performance level is confirmed in DS083 Table 4 and requires adherence to XAPP755 guidelines for dual-core timing closure. Each core includes 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface to Block SelectRAM+ memory.

What package type and pin count does XC2VP70-7FF1517C use?

XC2VP70-7FF1517C uses the FF1517 flip-chip fine-pitch BGA package with 1.0 mm ball pitch and 1517 total balls. Of these, 996 are user I/O pins, excluding 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and RocketIO X transceiver differential pairs. Package dimensions are 40 mm × 40 mm, and thermal dissipation is enhanced by flip-chip construction per DS083 Module 1 Section 7.

Can XC2VP70-7FF1517C perform on-chip I/O termination, and which standards does it support?

Yes, XC2VP70-7FF1517C implements XCITE Digitally Controlled Impedance (DCI) for on-chip termination across 22 single-ended I/O standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, SSTL, HSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT). DCI eliminates external termination resistors and maintains impedance match over voltage/temperature variation - detailed in DS083 Module 1 Section 4 and verified in electrical characterization data.

Is XC2VP70-7FF1517C recommended for new designs, and what is its lifecycle status?

No, XC2VP70-7FF1517C is marked "Product Not Recommended For New Designs" per DS083 cover page and Module 1 header. It remains available for existing production programs and legacy system refreshes, but Xilinx recommends Virtex-5 or newer families for new development. Aetrix Electronics maintains active inventory and provides lifecycle coordination support for ongoing manufacturing requirements.