AMD XC2VP70-7FF1704C

Overview

XC2VP70-7FF1704C from Xilinx is a high-density, flip-chip BGA FPGA with dual PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at 4.25 Gb/s, 74,448 logic cells, and 996 user I/Os in the FF1704 package. It serves as a system-on-chip platform for telecom line cards, high-speed networking switches, and embedded DSP-accelerated video processing systems.

For engineers reviewing the XC2VP70-7FF1704C datasheet, pinout, applications, or equivalent options, key selection criteria include verified 4.25 Gb/s transceiver compliance with XAUI and Fibre Channel, dual-processor deterministic timing under DCM control, and FF1704 package-level I/O count and thermal performance validation.

Technical Context

The XC2VP70-7FF1704C integrates two independent PowerPC 405 cores running up to 400 MHz (at -7 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its 20 RocketIO X transceivers are fixed-rate at 4.25 Gb/s, support 8B/10B and 64B/66B encoding, and feature on-chip 50 Ω termination and programmable pre-emphasis.

FPGA fabric includes 328 18 Kb Block SelectRAM+ modules (5,904 Kb total), 1,034 dedicated 18×18 multipliers, twelve Digital Clock Managers (DCMs) with fine-grained phase shifting, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X standards with digitally controlled impedance (DCI).

Key Specifications

Pinout & Package

XC2VP70-7FF1704C uses the FF1704 flip-chip fine-pitch BGA package (42.5 mm × 42.5 mm, 1.0 mm pitch, 1704 balls). Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (programmable 1.5–3.3 V), differential pairs (LVDS/BLVDS), and transceiver-specific power/ground groups. Ball map includes 996 user I/Os, 20 RocketIO X transceiver lanes (10 TX + 10 RX per lane), 12 DCM clock inputs, and JTAG/Boundary Scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-6FF1704I, the XC2VP70-7FF1704C delivers 14% higher transceiver throughput and 14% faster processor clocking, enabling tighter real-time deadlines; versus XC4VLX100-11FF1513C, it retains hard PowerPC cores essential for deterministic boot and control-plane software, despite lower logic density and older 0.13 µm process.

Availability

XC2VP70-7FF1704C is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply over extended product lifecycles.

Supply support for XC2VP70-7FF1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.

The Virtex-II Pro family, including XC2VP70-7FF1704C, was engineered for high-performance system integration-combining FPGA fabric, embedded processors, and multi-gigabit transceivers to replace discrete ASICs in wired communications and signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP70-7FF1704C?

The XC2VP70-7FF1704C supports PowerPC 405 cores running up to 400 MHz under Commercial temperature conditions (-7 speed grade), as confirmed in DS083 Table 4. This rating assumes proper decoupling, thermal management, and adherence to voltage tolerances (VCCINT = 1.5 V ±3%). The actual sustained frequency depends on cache hit rate, bus contention, and DCM configuration.

Does XC2VP70-7FF1704C support 64B/66B encoding in its RocketIO X transceivers?

Yes, XC2VP70-7FF1704C's RocketIO X transceivers explicitly support both 8B/10B and 64B/66B encoding, as documented in DS083 Module 1 Section "RocketIO X Transceiver Features". This enables compatibility with IEEE 802.3ae 10GbE and newer protocols requiring higher encoding efficiency than 8B/10B.

What package type and ball count does XC2VP70-7FF1704C use?

XC2VP70-7FF1704C uses the FF1704 flip-chip fine-pitch BGA package with 1704 solder balls, 1.0 mm pitch, and 42.5 mm × 42.5 mm footprint. This package delivers 996 user I/Os and supports high-speed signal integrity through short internal interconnects and optimized power/ground ball placement.

Can XC2VP70-7FF1704C be configured via JTAG, and what standard does it comply with?

Yes, XC2VP70-7FF1704C supports IEEE 1149.1-compliant JTAG boundary-scan configuration and debugging. Its TAP controller implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming, interconnect testing, and real-time visibility into I/O states during development.

Is XC2VP70-7FF1704C recommended for new designs, and why?

No - XC2VP70-7FF1704C is marked "Product Not Recommended For New Designs" per DS083 v5.0 cover page. This reflects Xilinx's end-of-life roadmap: the Virtex-II Pro family has been superseded by Virtex-4, Virtex-5, and UltraScale families offering higher density, lower power, and advanced transceivers. Legacy support remains for repair and sustainment.