AMD XC2VP70-7FFG1704C

Overview

XC2VP70-7FFG1704C from Xilinx is a high-density Virtex-II Pro X platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 20 RocketIO X multi-gigabit transceivers operating at a fixed 4.25 Gb/s baud rate, 74,448 logic cells, and 996 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom infrastructure, protocol bridging, and embedded signal processing systems requiring integrated processing and serial connectivity.

For engineers reviewing the XC2VP70-7FFG1704C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO X transceiver count and speed grade (-7), PowerPC dual-core support, DCM clock management capability, SelectIO-Ultra I/O voltage flexibility (1.5V/1.8V/2.5V/3.3V), and FF1704 package thermal and routing constraints.

Technical Context

The XC2VP70-7FFG1704C implements a hardened architecture combining FPGA fabric with two IBM PowerPC 405 cores and 20 monolithic RocketIO X transceivers. Its -7 speed grade guarantees 400 MHz PowerPC operation and full-speed 4.25 Gb/s transceiver performance under commercial temperature conditions.

It uses a 0.13 µm nine-layer copper process with 1.5V core supply (VCCINT), dedicated 2.5V VCCAUX, and programmable VCCO per bank. Clocking relies on up to twelve Digital Clock Managers (DCMs) supporting precise deskew, integer/fractional frequency synthesis, and 1/256-cycle phase shifting.

Key Specifications

Pinout & Package

XC2VP70-7FFG1704C is housed in a 1704-ball flip-chip fine-pitch BGA (FF1704) package with 1.0 mm pitch, designed for high I/O count and thermal performance in telecom and networking applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP70-7FFG1704C, the XC2VP70-6FF1704C trades transceiver speed and processor frequency for lower cost and power, while the XC4VLX100-11FF1513C abandons PowerPC integration for greater logic scalability and newer process advantages-neither is pin-compatible nor functionally drop-in.

Availability

XC2VP70-7FFG1704C is available at Aetrix Electronics and suitable for telecom infrastructure, protocol bridging, embedded radar, high-speed test equipment, and industrial control systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP70-7FFG1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as its flagship high-performance FPGA platform for demanding system-on-chip applications.

The Virtex-II Pro X product line was engineered specifically to integrate hardened processor cores and multi-gigabit transceivers into a single FPGA die, targeting wireline and wireless infrastructure where silicon consolidation reduces latency and board complexity.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP70-7FFG1704C?

The XC2VP70-7FFG1704C -7 speed grade guarantees 400 MHz operation for both PowerPC 405 cores under commercial temperature conditions. This rating assumes proper thermal management and adherence to XAPP755 guidelines for dual-processor timing closure at this frequency. The XC2VP70-7FFG1704C datasheet specifies this value in Table 4 of Module 1.

Does XC2VP70-7FFG1704C support 64B/66B encoding in its RocketIO X transceivers?

Yes, XC2VP70-7FFG1704C RocketIO X transceivers natively support both 8B/10B and 64B/66B encoding/decoding per channel, as confirmed in the RocketIO X feature summary of DS083. This enables direct compatibility with 10G Ethernet WAN PHY and other standards requiring 64B/66B framing without external logic.

What package type and ball count does XC2VP70-7FFG1704C use?

XC2VP70-7FFG1704C uses the FF1704 flip-chip fine-pitch BGA package with 1704 solder balls and 1.0 mm pitch. This package is documented in Table 3 of DS083 and supports the full complement of 20 RocketIO X transceivers and 996 user I/Os with optimized thermal dissipation.

Can XC2VP70-7FFG1704C be configured via JTAG boundary scan?

Yes, XC2VP70-7FFG1704C fully supports IEEE 1149.1 boundary-scan configuration and testing through its dedicated TCK/TMS/TDI/TDO pins. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, and EXTEST instructions, allowing bitstream loading and interconnect verification without requiring dedicated configuration pins.

Is XC2VP70-7FFG1704C recommended for new designs?

No, XC2VP70-7FFG1704C is marked "Product Not Recommended For New Designs" in the official Xilinx DS083 datasheet. While still available and supported for legacy program continuity, Xilinx recommends migrating to newer families such as Virtex-5 or UltraScale for new development due to enhanced performance, power efficiency, and long-term supply assurance.