AMD XC2VP7-5FF672I

Overview

XC2VP7-5FF672I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers, 11,088 logic cells, 44 18×18-bit multipliers, and 792 Kb of Block SelectRAM+ memory in a 672-pin flip-chip fine-pitch BGA package. It operates at -5 speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO) and targets high-reliability telecom and industrial embedded systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP7-5FF672I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver count and baud rate, PowerPC 405 clock frequency under industrial temperature, DCI I/O termination support, DCM phase-shifting resolution, and FF672 package pin compatibility with legacy Virtex-II Pro designs.

Technical Context

This device implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP blocks: a single IBM PowerPC 405 core running up to 300 MHz (Industrial grade), eight RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s per channel, and twelve Digital Clock Manager (DCM) modules enabling precise deskew, integer/fractional frequency synthesis, and 1/256-cycle phase shifting.

The FF672 flip-chip BGA package provides 396 user I/Os with SelectIO-Ultra support for 22 single-ended and 10 differential standards, including LVDS, SSTL, HSTL, and PCI-X, plus XCITE Digitally Controlled Impedance (DCI) for on-die termination across all supported single-ended I/O voltages (1.5V–3.3V).

Key Specifications

Pinout & Package

XC2VP7-5FF672I uses the FF672 flip-chip fine-pitch BGA package with 672 balls, 396 user I/Os, and dedicated power/ground/bank configuration. Pin definitions follow Xilinx DS083 Module 4, where each ball maps to a specific IOB, MGT, DCM, or power function.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-5FF672I, the -6FF672I offers higher clock margins for demanding control algorithms, while the -5FG676I trades thermal performance and signal integrity for lower assembly cost - neither is pin-compatible, requiring PCB redesign.

Availability

XC2VP7-5FF672I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging subsystems, and avionics sensor hubs requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-5FF672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for high-performance computing, networking, and embedded systems.

The Virtex-II Pro family was designed specifically for system-on-chip integration in high-reliability applications requiring embedded processors, high-speed serial I/O, and flexible logic - targeting telecom, defense, and industrial markets before the advent of modern RFSoCs.

FAQ

What is the maximum operating temperature range for XC2VP7-5FF672I?

The XC2VP7-5FF672I is rated for Industrial temperature range: –40°C to +100°C case temperature. This rating applies to all functional blocks - PowerPC core, RocketIO transceivers, CLBs, and DCMs - and is validated per Xilinx DS083 specifications. Thermal design must maintain junction temperature below 125°C using appropriate heatsinking and airflow, especially under sustained 300 MHz PowerPC operation.

Does XC2VP7-5FF672I support partial reconfiguration?

Yes, XC2VP7-5FF672I supports partial reconfiguration as defined in Xilinx UG070 and documented in DS083 Module 3. This capability allows dynamic swapping of logic modules in designated regions without resetting the entire device or interrupting PowerPC execution. Implementation requires use of Xilinx ISE 12.4 or later with PlanAhead tools and adherence to strict placement/routing constraints for reconfigurable partitions.

Can XC2VP7-5FF672I achieve 3.125 Gb/s RocketIO operation?

No, XC2VP7-5FF672I cannot achieve 3.125 Gb/s RocketIO operation. Per DS083 Table 4, the -5 speed grade limits RocketIO transceivers to 2.0 Gb/s in flip-chip packages. Only -6 and -7 speed grades support 2.5 Gb/s and 3.125 Gb/s respectively. Attempting 3.125 Gb/s on XC2VP7-5FF672I will result in link training failure or excessive BER due to insufficient analog front-end bandwidth.

Is bitstream encryption supported on XC2VP7-5FF672I?

Yes, XC2VP7-5FF672I supports Triple DES (3DES) bitstream encryption using on-chip decryptors as specified in DS083 Module 1. Two independent 3DES key sets can be programmed into the device's eFUSE array, enabling secure configuration against cloning or reverse engineering. Encryption requires Xilinx ISE toolchain v11.1 or later and proper key provisioning during PROM generation.

What JTAG instructions are supported by XC2VP7-5FF672I?

XC2VP7-5FF672I supports IEEE 1149.1-compliant JTAG instructions including BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ. These enable boundary-scan testing, configuration verification, and real-time debugging via ChipScope ILA. The TAP controller is fully integrated and accessible through standard JTAG adapters without firmware modification.