AMD XC2VP7-5FFG672C

Overview

XC2VP7-5FFG672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, four Digital Clock Managers (DCMs), and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It delivers up to 3.125 Gb/s per transceiver channel and supports 300 MHz PowerPC operation for embedded telecom and networking systems requiring high-speed serial interconnect and soft-core processing.

For engineers reviewing the XC2VP7-5FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at -5 speed grade, confirmed FF672 package I/O count and thermal profile, PowerPC 405 cache and MMU configuration, DCM phase-shifting resolution, and SelectIO-Ultra DCI support for impedance-controlled single-ended interfaces.

Technical Context

The XC2VP7-5FFG672C implements a hybrid architecture combining SRAM-based configurable logic with hard IP blocks: an embedded PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface; eight RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s full-duplex SERDES with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination; and twelve global clock resources fed by up to four DCMs offering ±1/256-cycle phase shift and integer/fractional frequency synthesis.

Its routing fabric uses Active Interconnect Technology with hierarchical segmented resources - 24 long lines per row/column, 120 hex lines, and dedicated horizontal cascade chains - enabling predictable timing independent of fanout. Configuration occurs via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional triple-DES bitstream encryption and readback capability for debug.

Key Specifications

Pinout & Package

XC2VP7-5FFG672C is housed in a 672-ball flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, optimized for thermal dissipation and signal integrity in high-density PCB layouts. Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments for configuration, JTAG, PowerPC debug, RocketIO differential pairs, SelectIO-Ultra banks, and global clock resources.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-5FFG672C, the XC2VP7-6FF672C offers higher guaranteed clock frequencies and wider operating margins, while the XC2VP7-5FG676C trades thermal and electrical performance for manufacturing simplicity - neither is pin-compatible due to differing ball maps and power delivery structures.

Availability

XC2VP7-5FFG672C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, industrial automation, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP7-5FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family, including XC2VP7-5FFG672C, was designed for high-performance embedded systems integrating programmable logic, hardened PowerPC cores, and multi-gigabit serial I/O - targeting telecom, aerospace, and test equipment markets prior to 2011.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP7-5FFG672C?

The XC2VP7-5FFG672C supports RocketIO transceivers rated for up to 3.125 Gb/s per channel in full-duplex mode. This rating is guaranteed at the -5 speed grade under commercial temperature conditions (0°C to 85°C) and applies to all eight transceiver blocks. The device does not include RocketIO X cores, which are exclusive to XC2VPX-series variants.

Does XC2VP7-5FFG672C include an embedded processor, and what are its key capabilities?

Yes, XC2VP7-5FFG672C integrates a single PowerPC 405 RISC processor core capable of 300 MHz operation at the -5 speed grade. It features 16 KB instruction cache, 16 KB data cache, MMU with 64-entry TLB, OCM interface, and CoreConnect bus compliance - enabling standalone embedded software execution without external microcontrollers.

What package type and pin count does XC2VP7-5FFG672C use, and how does it differ from wire-bond alternatives?

XC2VP7-5FFG672C uses a 672-ball flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch. Unlike wire-bond FG676 packages, the FF672 employs copper pillar bumps for superior thermal conductivity and signal integrity, supporting higher transceiver performance and denser routing - but requires specialized assembly and rework processes.

Can XC2VP7-5FFG672C perform partial reconfiguration, and what configuration modes are supported?

Yes, XC2VP7-5FFG672C supports partial reconfiguration via JTAG or SelectMAP interfaces. Valid configuration modes include Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Bitstream encryption using triple-DES is available to protect intellectual property during remote updates.

What I/O standards and termination options are available on XC2VP7-5FFG672C?

XC2VP7-5FFG672C supports 22 single-ended (LVCMOS, LVTTL, PCI, HSTL, SSTL) and 10 differential (LVDS, BLVDS, LVPECL, ULVDS, LDT) I/O standards. Its Digitally Controlled Impedance (DCI) feature provides programmable on-die termination from 25 Ω to 125 Ω for single-ended standards, eliminating external resistors and improving impedance matching across voltage/temperature variation.